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LR3220GM-25

Description
Memory Circuit, CMOS, CPGA180,
Categorystorage    storage   
File Size1MB,24 Pages
ManufacturerLSC/CSI
Websitehttps://lsicsi.com
Download Datasheet Parametric Compare View All

LR3220GM-25 Overview

Memory Circuit, CMOS, CPGA180,

LR3220GM-25 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLSC/CSI
package instructionPGA, PGA180M,15X15
Reach Compliance Codecompliant
JESD-30 codeS-XPGA-P180
JESD-609 codee0
Memory IC TypeMEMORY CIRCUIT
Number of terminals180
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codePGA
Encapsulate equivalent codePGA180M,15X15
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum slew rate0.16 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED

LR3220GM-25 Related Products

LR3220GM-25 LR3220GM-33 LR3220QC-25 LR3220QC-33
Description Memory Circuit, CMOS, CPGA180, Memory Circuit, CMOS, CPGA180, Memory Circuit, CMOS, PQFP184 Memory Circuit, CMOS, PQFP184,
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker LSC/CSI LSC/CSI LSC/CSI LSC/CSI
package instruction PGA, PGA180M,15X15 PGA, PGA180M,15X15 QFP, QFP184,1.26SQ,20 QFP, QFP184,1.26SQ,20
Reach Compliance Code compliant compliant compliant compliant
JESD-30 code S-XPGA-P180 S-XPGA-P180 S-PQFP-G184 S-PQFP-G184
JESD-609 code e0 e0 e0 e0
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
Number of terminals 180 180 184 184
Maximum operating temperature 125 °C 125 °C 70 °C 70 °C
Package body material CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code PGA PGA QFP QFP
Encapsulate equivalent code PGA180M,15X15 PGA180M,15X15 QFP184,1.26SQ,20 QFP184,1.26SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY FLATPACK FLATPACK
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.16 mA 0.17 mA 0.16 mA 0.17 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO YES YES
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form PIN/PEG PIN/PEG GULL WING GULL WING
Terminal pitch 2.54 mm 2.54 mm 0.5 mm 0.5 mm
Terminal location PERPENDICULAR PERPENDICULAR QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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