EEWORLDEEWORLDEEWORLD

Part Number

Search

LR3220QC-33

Description
Memory IC, CMOS, PQFP184,
Categorystorage    storage   
File Size1MB,24 Pages
ManufacturerBroadcom
Download Datasheet Parametric Compare View All

LR3220QC-33 Overview

Memory IC, CMOS, PQFP184,

LR3220QC-33 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerBroadcom
Reach Compliance Codeunknown
JESD-30 codeS-PQFP-G184
JESD-609 codee0
Mixed memory typesN/A
Number of terminals184
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP184,1.26SQ,20
Package shapeSQUARE
Package formFLATPACK
power supply5 V
Certification statusNot Qualified
Maximum slew rate0.17 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD

LR3220QC-33 Related Products

LR3220QC-33 LR3220GM-25 LR3220GM-33 LR3220QC-25
Description Memory IC, CMOS, PQFP184, Memory Circuit, CMOS, CPGA180, Memory IC, CMOS, CPGA180, Memory Circuit, CMOS, PQFP184
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Broadcom Broadcom Broadcom Broadcom
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code S-PQFP-G184 S-XPGA-P180 S-XPGA-P180 S-PQFP-G184
JESD-609 code e0 e0 e0 e0
Mixed memory types N/A N/A N/A N/A
Number of terminals 184 180 180 184
Maximum operating temperature 70 °C 125 °C 125 °C 70 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY
encapsulated code QFP PGA PGA QFP
Encapsulate equivalent code QFP184,1.26SQ,20 PGA180M,15X15 PGA180M,15X15 QFP184,1.26SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK GRID ARRAY GRID ARRAY FLATPACK
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.17 mA 0.16 mA 0.17 mA 0.16 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO NO YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL MILITARY MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING PIN/PEG PIN/PEG GULL WING
Terminal pitch 0.5 mm 2.54 mm 2.54 mm 0.5 mm
Terminal location QUAD PERPENDICULAR PERPENDICULAR QUAD
Ask a question about compilation, simple
My book says "MOV BX 5" the result will be BX=0005; that is ,BH=00 and BL=05; The BX register is 16 bits, so isn't the high bit (BH) 0000 and the low bit (BL) 0005? Is it okay to write it like that?...
kof2ooo Embedded System
ST sensor fusion - Introduction to posture detection fusion algorithm [ST engineer article]
1. What is attitude fusion algorithm? Simply put, attitude fusion algorithm is to fuse multiple motion sensor data (generally requires 3-axis acceleration, 3-axis gyroscope or 3-axis geomagnetic induc...
nmg ST Sensors & Low Power Wireless Technology Forum
What model was your first mobile phone?
Let me talk about mine first: NOKIA 3310 is like a brick, but it was a rare thing in 2001. After many high-altitude drop tests, it was intact. Later, it fell from a container as high as a wine bottle,...
fish001 RF/Wirelessly
LPC54100 second batch board testing
After the second batch of boards were received, we still couldn't debug the platform. We tested it as soon as the information about Wanli was released. The original board was white. This time we found...
fyaocn NXP MCU
Design of CANopen master node
Design of CANopen master node - Based on IXXAT's CANopen Master API for Windows In addition to the basic conditions of CANopen devices, CANopen master nodes must also have the function of NMT Master, ...
阿南 MCU
Selection summary of mainstream Bluetooth BLE MESH module Bluetooth chip IC
1. Introduction Since the launch of the BLE Bluetooth mesh protocol stack, it has been attracting the attention of many developers. However, the application ecosystem is very scarce now, so the source...
火辣西米秀 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 255  2302  2805  2148  1854  6  47  57  44  38 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号