iPEM
4.2 Gb SDRAM-DDR2
AS4DDR264M65PBG1
64Mx64 DDR2 SDRAM w/ DUAL CONTROL BUS
iNTEGRATED Plastic Encapsulated Microcircuit
FEATURES
DDR2 Data rate = 667, 533, 400
Available in Industrial, Enhanced and Military Temp
Package:
•
Proprietary Enchanced Die Stacked iPEM
•
208 Plastic Ball Grid Array (PBGA), 16 x 23mm
•
1.00mm ball pitch
Differential data strobe (DQS, DQS#) per byte
Internal, pipelined, double data rate architecture
4n-bit prefetch architecture
DLL for alignment of DQ and DQS transitions with
clock signal
Eightinternal banks for concurrent operation
(Per DDR2 SDRAM Die)
Programmable Burst lengths: 4 or 8
Auto Refresh and Self Refresh Modes (I/T Version)
On Die Termination (ODT)
Adjustable data – output drive strength
1.8V
±0.1V
common core power and I/O supply
Programmable CAS latency: 3, 4, 5, 6 or 7
Posted CAS additive latency: 0, 1, 2, 3, 4 or 5
Write latency = Read latency - 1* tCK
Organized as 64M x 64
Weight: AS4DDR264M64PBG1 ~ 2.0 grams typical
BENEFITS
58% Space Savings
49% I/O reduction vs Individual CSP approach
Reduced part count
Reduced trace lengths for lower parasitic
capacitance
Suitable for hi-reliability applications
Upgradable to 128M x 64 density in future
Pin / Function equivalent to White
W3H64M64E-xSBx
NOTE: Self Refresh Mode available on Industrial and Enhanced temp. only
FUNCTIONAL BLOCK DIAGRAM
Ax, BA0-2
ODT
VRef
VCC
VCCQ
VSS
VSSQ
VCCL
VSSDL
CSa\
WEa\
RASa\
CASa\
CKEa\
ODT
UDMx,
UDMx LDMx
UDSQx,UDSQx\
LDSQx, LDSQx\
CKx,CKx\
A
2
2
2
2
2
2
2
2
VCCQ
VSSQ
VCCL
A
VSSDL
B
CSb\
WEb\
RASb\
CASb\
CKEb\
VCCQ
VSSQ
VCCL
VSSDL
C
VCCQ
VSSQ
VCCL
VSSDL
D
2
2
2
2
2
2
2
2
DQ0-15 B
DQ16-31 C
DQ32-47 D
DQ48-63
AS4DDR264M65PBG1
Rev. 0.7 01/10
Micross Components reserves the right to change products or specifications without notice.
1
iPEM
4.2 Gb SDRAM-DDR2
AS4DDR264M65PBG1
BGA Locations
P6
C9,C10,D10,D11,T1,T2,
U2,U3
T8, D4
V5, B7
U5, C7
U6, C6
T9, D3
G5,H1,M11,N7
F1,F2,P10,P11
H9,H10,M2,M3
H7,H11,M1,M5
E8,E9,R3,R4
F10,F11,P1,P2
J2,J3,J4,J8,J9, K2,
K3,K9,L2,L3,L4,L9,L10
Symbol
ODT
CKx, CKx\
CKE
CS\
RASx\
CASx\
WE\
UDMx
LDMx
UDQSx
UDQSx\
LDQSx
LDQSx\
Ax
Type
CNTL Input
CNTL Input
CNTL Input
CNTL Input
CNTL Input
CNTL Input
CNTL Input
CNTL Input
CNTL Input
CNTL Input
CNTL Input
CNTL Input
CNTL Input
Input
Description
On-Die-Termination: Registered High enables on data bus termination
Differential input clocks, one set for each x16bits
Clock enable which activates all on silicon clocking circuitry
Chip Selects, one for each 16 bits of the data bus width
Command input which along with CAS\, WE\ and CS\ define operations
Command input which along with RAS\, WE\ and CS\ define operations
Command input which along with RAS\, CAS\ and CS\ define operations
One Data Mask cntl. for each upper 8 bits of a x16 word
One Data Mask cntl. For each lower 8 bits of a x16 word
Data Strobe input for upper byte of each x16 word
Differential input of UDQSx, only used when Differential DQS mode is enabled
Data Strobe input for lower byte of each x16 word
Differential input of LDQSx, only used when Differential DQS mode is enabled
Array Address inputs providing ROW addresses for Active commands, and
the column address and auto precharge bit (A10) for READ/WRITE commands
RFU
Future Input
J10
L8,K10,E5
BA0,BA1,BA2
Input
C8,D1,D2,D7,D8,D9,E1,
DQx
Input/Output
E2,E3,E7,E10,E11,F3,
F4,F5,F7,F8,F9,G1,G2,
G3,G4,G7,G8,G9,G10,
G11,H2,H3,H4,H5,H8,
M4,M7,M8,M9,M10,N1,
N2,N3,N4,N5,N8,N9,
N10,N11,P3,P4,P5,P7,
P8,P9,R1,R2,R5,R9,
R10,R11,T3,T4,T5,
T10,T11,U4
Vref
Supply
H6
A2,A4,A5,A7,A8,A10,
VCC
Supply
B1,B11,H6,J1,J5,J7,J11,
K4,K8,L1,L5,L7,L11,M6,
V1,V11,W2,W4,W5,
W7,W8,W10
A3,A6,A9,A11,B2,B10,
VSS
Supply
C1,C11,G6,J6,K1,K5,
K7,K11,L6,N6,U1,U11,
V2,V10,W1,W3,W6,
W9,W11
B3,B4,B5,B6,B8,B9,
NC
C2,C3,C4,C5,D5,D6,E4,
E6, F6, R6,R7,R8,
T6,T7,U7,U8,U9,U10,
V3,V4,V6,V7,V8,V9
A1
UNPOPULATED
Bank Address inputs
Data bidirectional input/Output pins
SSTL_18 Voltage Reference
Core Power Supply
Core Ground return
No connection
Unpopulated ball matrix location (location registration aid)
AS4DDR264M65PBG1
Rev. 0.7 01/10
Micross Components reserves the right to change products or specifications without notice.
3
iPEM
4.2 Gb SDRAM-DDR2
AS4DDR264M65PBG1
The 4.2Gb DDR2 SDRAM, a high-speed CMOS, dynamic
random-access memory containing 4,294,967,296 bits.
Each of the four chips in the MCP are internally configured
as 8-bank DRAM. The block diagram of the device is
shown in Figure 2. Ball assignments and are shown in
Figure 3.
The 4.2Gb DDR2 SDRAM uses a double-data-rate
architecture to achieve high-speed operation. The
double data rate architecture is essentially a 4n-prefetch
architecture, with an interface designed to transfer
two data words per clock cycle at the I/O balls. A
single read or write access for the x64 DDR2 SDRAM
effectively consists of a single 4n-bit-wide, one-clock-
cycle data transfer at the internal DRAM core and four
corresponding
n-bit-wide,
one-half-clock-cycle data
transfers at the I/O balls.
A bidirectional data strobe (DQS, DQS#) is transmitted
externally, along with data, for use in data capture at the
receiver. DQS is a strobe transmitted by the DDR2
SDRAM during READs and by the memory controller
during WRITEs. DQS is edge-aligned with data for
READs and center-aligned with data for WRITEs. There
are strobes, one for the lower byte (LDQS, LDQS#) and
one for the upper byte (UDQS, UDQS#).
The MCP DDR2 SDRAM operates from a differential
clock (CK and CK#); the crossing of CK going HIGH
and CK# going LOW will be referred to as the positive
edge of CK. Commands (address and control signals)
are registered at every positive edge of CK. Input data
is registered on both edges of DQS, and output data
is referenced to both edges of DQS, as well as to both
edges of CK.
Read and write accesses to the DDR2 SDRAM are
burst oriented; accesses start at a selected location
and continue for a programmed number of locations
in a programmed sequence. Accesses begin with the
registration of an ACTIVE command, which is then
followed by a READ or WRITE command. The address
bits registered coincident with the ACTIVE command
are used to select the bank and row to be accessed.
The address bits registered coincident with the READ
or WRITE command are used to select the bank and the
starting column location for the burst access.
The DDR2 SDRAM provides for programmable read
or write burst lengths of four or eight locations. DDR2
SDRAM supports interrupting a burst read of eight with
another read, or a burst write of eight with another
write.
DESCRIPTION
An auto precharge function may be enabled to provide a
self-timed row precharge that is initiated at the end of
the burst access.
As with standard DDR SDRAMs, the pipelined, multibank
architecture of DDR2 SDRAMs allows for concurrent
operation, thereby providing high, effective bandwidth by
hiding row precharge and activation time.
A self refresh mode is provided, along with a power-
saving power-down mode.
All inputs are compatible with the JEDEC standard for
SSTL_18. All full drive-strength outputs are SSTL_18-
compatible.
•
The functionality and the timing specifications
discussed in this data sheet are for the DLLenabled
mode of operation.
•
Throughout the data sheet, the various
fi
gures and
text refer to DQs as DQ. The DQ term is to be
interpreted as any and all DQ collectively, unless
specifically stated otherwise. Additionally, each chip
is divided into 2 bytes, the lower byte and upper
byte. For the lower byte (DQ0 CDQ7), DM refers to
LDM and DQS refers to LDQS. For the upper byte
(DQ8 CDQ15), DM refers to UDM and DQS refers to
UDQS.
•
Complete functionality is described throughout
the document and any page or diagram may have
been simplified to convey a topic and may not be
inclusive of all requirements.
•
Any specific requirement takes precedence over a
general statement.
GENERAL NOTES
INITIALIZATION
DDR2 SDRAMs must be powered up and initialized
in a predefined manner. Operational procedures other
than those specified may result in undefined operation.
The following sequence is required for power up and
initialization and is shown in Figure 4 on page 5.
AS4DDR264M65PBG1
Rev. 0.7 01/10
Micross Components reserves the right to change products or specifications without notice.
4
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