TD8087-2 datasheet, PDF - EEWORLD Datasheet

TD8087-2: DescriptionMath Processor, MOS, CDIP40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，22 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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TD8087-2 Overview

Math Processor, MOS, CDIP40

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum slew rate	475 mA
surface mount	NO
technology	MOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	TD8087-2	MD8087	QD8087-2	LD8087-2	TD8087
Description	Math Processor, MOS, CDIP40	Math Processor, MOS, CDIP40,	Math Processor, MOS, CDIP40	Math Processor, MOS, CDIP40,	Math Processor, MOS, CDIP40,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Intel	Intel	Intel	Intel	Intel
package instruction	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40
JESD-609 code	e0	e0	e0	e0	e0
Number of terminals	40	40	40	40	40
Maximum operating temperature	85 °C	125 °C	70 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Maximum slew rate	475 mA	600 mA	475 mA	475 mA	475 mA
surface mount	NO	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS	MOS
Temperature level	INDUSTRIAL	MILITARY	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Certification status	Not Qualified	Not Qualified	-	-	Not Qualified

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