K7N401801B datasheet, PDF - EEWORLD Datasheet

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K7N401801B: Description128Kx36 & 256Kx18 Pipelined NtRAM; File Size413KB，20 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K7N401801B Overview

128Kx36 & 256Kx18 Pipelined NtRAM

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K7N403601B

K7N401801B

128Kx36 & 256Kx18 Pipelined NtRAM

4Mb

NtRAM

Specification

100 TQFP with Pb only

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.

ALL INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or simi-

lar applications where Product failure couldresult in loss of life or personal or physical harm, or any military

or defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

Rev. 3.0 July 2006

-1-

K7N401801B Related Products

	K7N401801B	K7N401801B-QC13	K7N403601B-QI13	K7N401801B-QI13	K7N403601B-QC13	K7N403601B_06
Description	128Kx36 & 256Kx18 Pipelined NtRAM	128Kx36 & 256Kx18 Pipelined NtRAM	128Kx36 & 256Kx18 Pipelined NtRAM	128Kx36 & 256Kx18 Pipelined NtRAM	128Kx36 & 256Kx18 Pipelined NtRAM	128Kx36 & 256Kx18 Pipelined NtRAM
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	-
Parts packaging code	-	QFP	QFP	QFP	QFP	-
package instruction	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	-
Contacts	-	100	100	100	100	-
Reach Compliance Code	-	compli	compli	compli	compli	-
ECCN code	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	-
Maximum access time	-	4.2 ns	4.2 ns	4.2 ns	4.2 ns	-
Other features	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	-
Maximum clock frequency (fCLK)	-	166 MHz	133 MHz	166 MHz	133 MHz	-
I/O type	-	COMMON	COMMON	COMMON	COMMON	-
JESD-30 code	-	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	-
JESD-609 code	-	e0	e0	e0	e0	-
length	-	20 mm	20 mm	20 mm	20 mm	-
memory density	-	4718592 bi	4718592 bi	4718592 bi	4718592 bi	-
Memory IC Type	-	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	-
memory width	-	18	36	18	36	-
Number of functions	-	1	1	1	1	-
Number of terminals	-	100	100	100	100	-
word count	-	262144 words	131072 words	262144 words	131072 words	-
character code	-	256000	128000	256000	128000	-
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-
Maximum operating temperature	-	70 °C	85 °C	85 °C	70 °C	-
organize	-	256KX18	128KX36	256KX18	128KX36	-
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE	-
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	-	LQFP	LQFP	LQFP	LQFP	-
Encapsulate equivalent code	-	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	-
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	-
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
power supply	-	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	-
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm	-
Maximum standby current	-	0.05 A	0.05 A	0.05 A	0.05 A	-
Minimum standby current	-	3.14 V	3.14 V	3.14 V	3.14 V	-
Maximum slew rate	-	0.25 mA	0.25 mA	0.25 mA	0.25 mA	-
Maximum supply voltage (Vsup)	-	3.465 V	3.465 V	3.465 V	3.465 V	-
Minimum supply voltage (Vsup)	-	3.135 V	3.135 V	3.135 V	3.135 V	-
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V	3.3 V	-
surface mount	-	YES	YES	YES	YES	-
technology	-	CMOS	CMOS	CMOS	CMOS	-
Temperature level	-	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	-
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	-	GULL WING	GULL WING	GULL WING	GULL WING	-
Terminal pitch	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm	-
Terminal location	-	QUAD	QUAD	QUAD	QUAD	-
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	-	14 mm	14 mm	14 mm	14 mm	-

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