HB56RW832DZJ-6L datasheet, PDF

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HB56RW832DZJ-6L: DescriptionFast Page DRAM Module, 8MX32, 60ns, CMOS, SODIMM-72; Categorystorage storage; File Size246KB，22 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HB56RW832DZJ-6L Overview

Fast Page DRAM Module, 8MX32, 60ns, CMOS, SODIMM-72

HB56RW832DZJ-6L Parametric

Parameter Name	Attribute value
Maker	Hitachi （Renesas ）
Parts packaging code	SODIMM
package instruction	DIMM, DIMM72
Contacts	72
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	60 ns
I/O type	COMMON
JESD-30 code	R-XZMA-N72
memory density	268435456 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	72
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX32
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM72
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	2048
Maximum seat height	25.4 mm
self refresh	NO
Maximum standby current	0.0024 A
Maximum slew rate	0.76 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3.15 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG

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HB56RW832DZJ Series

8,388,608-word

32-bit High Density Dynamic RAM Module

ADE-203-768A (Z)

Rev.1.0

Apr. 21, 1997

Description

The HB56RW832DZJ is a 8M

32 dynamic RAM Small Outline Dual In-line Memory Module

(S.O.DIMM), mounted 16 pieces of 16-Mbit DRAM (HM51W17400) sealed in TCP package. An outline

of the HB56RW832DZJ is 72-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the

HB56RW832DZJ makes high density mounting possible without surface mount technology. The

HB56RW832DZJ provides common data inputs and outputs. Decoupling capacitors are mounted on the

module board.

Features

•

72-pin Zig Zag Dual tabs socket type



Outline: 59.69 mm (Length)

25.40 mm (Height)

3.80 mm (Thickness)



Lead pitch: 1.27 mm

•

Single 3.3 V (+0.3 V, –0.15 V) supply

•

High speed



Access time: t

RAC

= 60/70 ns (max)

CAC

= 15/18 ns (max)

•

Low power dissipation



Active mode: 2.74/2.45 W (max)



Standby mode (TTL): 115.2 mW (max)

(CMOS): 8.64 mW (max) (L-version)

•

Fast page mode capability

•

Refresh period



2048 refresh cycles: 32 ms

128 ms (L-version)

•

3 variations of refresh



RAS-only

refresh



CAS-before-RAS

refresh



Self refresh (LS-version)

HB56RW832DZJ-6L Related Products

	HB56RW832DZJ-6L	HB56RW832DZJ-7L	HB56RW832DZJ-6LS	HB56RW832DZJ-7LS	HB56RW832DZJ-7	HB56RW832DZJ-6
Description	Fast Page DRAM Module, 8MX32, 60ns, CMOS, SODIMM-72	Fast Page DRAM Module, 8MX32, 70ns, CMOS, SODIMM-72	Fast Page DRAM Module, 8MX32, 60ns, CMOS, SODIMM-72	Fast Page DRAM Module, 8MX32, 70ns, CMOS, SODIMM-72	Fast Page DRAM Module, 8MX32, 70ns, CMOS, SODIMM-72	Fast Page DRAM Module, 8MX32, 60ns, CMOS, SODIMM-72
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM
package instruction	DIMM, DIMM72	DIMM, DIMM72	DIMM, DIMM72	DIMM, DIMM72	DIMM, DIMM72	DIMM, DIMM72
Contacts	72	72	72	72	72	72
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	60 ns	70 ns	60 ns	70 ns	70 ns	60 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XZMA-N72	R-XZMA-N72	R-XZMA-N72	R-XZMA-N72	R-XZMA-N72	R-XZMA-N72
memory density	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit
Memory IC Type	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE
memory width	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	72	72	72	72	72	72
word count	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000	8000000	8000000	8000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	8MX32	8MX32	8MX32	8MX32	8MX32	8MX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM72	DIMM72	DIMM72	DIMM72	DIMM72	DIMM72
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	2048	2048	2048	2048	2048	2048
Maximum seat height	25.4 mm	25.4 mm	25.4 mm	25.4 mm	25.4 mm	25.4 mm
self refresh	NO	NO	YES	YES	NO	NO
Maximum standby current	0.0024 A	0.0024 A	0.0024 A	0.0024 A	0.016 A	0.016 A
Maximum slew rate	0.76 mA	0.68 mA	0.76 mA	0.68 mA	0.68 mA	0.76 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG

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