BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XJD361-TR8
●
Features:
1. Emitted Color: Super Orange Red .
2. Lens Appearance: Water Clear.
3. Low cost plastic package.
4. This product doesn’t contain restriction
Substance, comply ROHS standard.
●
Package Dimensions:
●
Applications:
1.
Automotive: Dashboards, stop lamps,
turn signals.
2.
3.
Backlighting: LCDs, Key pads advertising.
Status indicators: Comsumer & industrial
electronics.
NOTES:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.10mm (0.004”) unless otherwise specified.
3. Specifications are subject to change without notice.
4.
General use.
●
Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Forward Current
Peak Forward Current
＊1
Reverse Voltage
Symbol
Pd
I
F
I
FP
Rating
100
30
100
5
Unit
mW
mA
mA
V
-
-
-
Operating Temperature
Storage Temperature
Soldering Temperature
½鴻工業股½有限公司
http://www.brtled.com
V
R
Topr
Tstg
Tsol
-25℃~80℃
-30℃~85℃
See Page 5
＊1
Condition for
I
FP
is pulse of 1/10 duty and 0.1msec width.
Ver.2.0 Page 1 of 6
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XJD361-TR8
●
Electrical and optical characteristics(Ta=25℃)
Parameter
Forward Voltage
Luminous Intensity
Reverse Current
Peak Wave Length
Dominant Wave Length
Spectral Line Half-width
Viewing Angle
Symbol
Vf
Iv
I
R
λp
λd
Δλ
2θ
1/2
Condition
I
F
=20mA
I
F
=20mA
V
R
=5V
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
Min.
-
63
-
-
620
-
-
Typ.
2.1
150
-
630
-
20
35
Max.
2.6
-
100
-
630
-
-
Unit
V
mcd
µA
nm
nm
nm
deg
●
Typical Electro-Optical Characteristics Curves
Fig.1 Relative intensity vs. wavelength
1.0
60
Fig.2 Forward current derating curve
vs. ambient temperature
50
Relative radiant intensity
Forward current (mA)
40
0.5
30
20
10
0
580
630
680
0
20
40
60
80
100
Wavelength (nm)
Ambient temperature Ta( C)
Fig.3 Forward current vs. forward voltage
50
3.0
Fig.4 Relative luminous intensity vs.
ambient temperature
Forward current (mA)
Relative Luminous intensity
(Normalized @20mA)
1
2
3
4
5
40
2.5
2.0
30
1.5
20
1.0
10
0.5
0
0
-40
-20
0
20
40
60
Forward voltage(V)
Ambient temperature Ta( C)
Relative luminous intensity (@20mA)
3.0
RELATIVE RADIANT INTENSITY
½鴻工業股½有限公司
http://www.brtled.com
Fig.5 Relative luminous intensity
vs. forward current
Fig.6 RADIATION DIAGRAM
0
10
4.0
20
30
1.0
40
2.0
0.9
0.8
50
60
70
0.7
80
90
0.5
0.3
0.1
0.2
0.4
0.6
1.0
0
10
20
30
40
50
Forward current (mA)
Ver.2.0 Page 2 of 6
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XJD361-TR8
●
Tapping and packaging specifications(Units: mm)
SPECIFICATION
ITEM
SYMBOL
mm
Tape Feed Hole Diameter (DIA)
Feed Hole Location
Centers Line Dimensions Length Direction
Compartment Depth
Carrier Tape Overall Thickness
Compartment Pitch
Sprocket Hole Diameter
Centers Line Dimensions Length Direction
Carrier Tape Thickness
Carrier Tape Width
Flange Diameter
Hub Spindle Hole
Hub Diameter
Fixing Tape Width
Flange Space Between Flanges
Compartment Length
Compartment Width
D
0
E
F
K
0
K
P
P
0
P
2
t
W
A
C
D
2
W
1
T
A
0
B
0
1.40
1.65
5.45
3.00
3.00
3.90
3.90
1.95
－
12.00
178.0
12.50
20.00
9.00
16.00
1.87
6.30
Minimum
inch
0.055
0.065
0.215
0.118
0.118
0.153
0.153
0.076
－
0.472
7.008
0.492
0.788
0.354
0.629
0.074
0.248
mm
1.55
1.85
5.55
3.20
3.20
4.10
4.10
2.05
0.30
12.30
180.0
13.50
21.50
9.30
17.00
2.07
6.50
Maximum
inch
0.061
0.072
0.218
0.126
0.126
0.161
0.161
0.080
0.012
0.484
7.087
0.531
0.846
0.366
0.669
0.081
0.256
A n o d e
C a t h o d e
½鴻工業股½有限公司
http://www.brtled.com
Ver.2.0 Page 3 of 6
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XJD361-TR8
●
Reliability Test
Classification
Test Item
Reference Standard
Test Conditions
Result
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS-C-7021
:B-1
High
Temperature MIL-STD-202:103B
High Humidity JIS-C-7021
:B-11
Endurance
Storage
Test
High
MIL-STD-883:1008
Temperature
JIS-C-7021
:B-10
Storage
Low
Temperature JIS-C-7021
:B-12
Storage
Temperature MIL-STD-202:107D
Cycling
MIL-STD-750:1051
MIL-STD-883:1010
JIS-C-7021
:A-4
Thermal Shock MIL-STD-202:107D
Environmental
MIL-STD-750:1051
Test
MIL-STD-883:1011
Solder
MIL-STD-202:201A
Resistance
MIL-STD-750:2031
JIS-C-7021
:A-1
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
Ta=+65℃±5℃
RH=90%-95%
Test time=240hrs
High Ta=+85℃±5℃
Test time=1,000hrs
Low Ta=-35℃±5℃
Test time=1,000hrs
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
60min 20min
60min
20min
Test Time=5cycle
-35℃±5℃ ~+85℃±5℃
20min
20min
Test Time=10cycle
Preheating：
140℃-160℃,within 2 minutes.
Operation heating：
260℃(Max.), within 10seconds. (Max.)
0/20
0/20
0/20
0/20
0/20
0/20
0/20
●
Judgment criteria of failure for the reliability
Measuring items
Forward voltage
Reverse current
Luminous intensity
Note:
1.U means the upper limit of specified characteristics.
½鴻工業股½有限公司
http://www.brtled.com
Symbol
V
F
( V)
I
R
(uA)
Iv ( mcd )
Measuring conditions
I
F
=20mA
V
R
=5V
I
F
=20mA
S means initial value.
Judgment criteria for failure
Over Ux1.2
Over Ux2
Below SX0.5
2. Measurment shall be taken between 2 hours and after the test pieces have been returned
to normal ambient conditions after completion of each test.
Ver.2.0 Page 4 of 6
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XJD361-TR8
●
Soldering :
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Refold Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
10 SEC. MAX.
3.
DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
●
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Temperature
140~160℃
260℃ MAX.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
Time
Soldering heat Max. 260
℃
120~150℃
245
±5℃
within 5 sec.
Temperature
Preheat
120~180 sec.
½鴻工業股½有限公司
http://www.brtled.com
Time
Ver.2.0 Page 5 of 6
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