KFG5616Q1M-DED00 datasheet, PDF

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KFG5616Q1M-DED00: DescriptionFlash, 16MX16, 76ns, PBGA67, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-67; Categorystorage storage; File Size1007KB，84 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KFG5616Q1M-DED00 Overview

Flash, 16MX16, 76ns, PBGA67, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-67

KFG5616Q1M-DED00 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	67
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Maximum access time	76 ns
JESD-30 code	R-PBGA-B67
length	12 mm
memory density	268435456 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	67
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-30 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	9.5 mm

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OneNAND256

FLASH MEMORY

OneNAND SPECIFICATION

Product

Part No.

KFG5616Q1M-DEB

OneNAND256

KFG5616D1M-DEB

KFG5616U1M-DIB

(core & IO)

1.8V(1.7V~1.95V)

2.65V(2.4V~2.9V)

3.3V(2.7V~3.6V)

Temperature

Extended

Industrial

PKG

63FBGA(LF)/48TSOP1

Version: Ver. 1.1

KFG5616Q1M-DED00 Related Products

	KFG5616Q1M-DED00	KFG5616D1M-PED00	KFG5616D1M-DED00	KFG5616Q1M-PED00	KFG5616U1M-DID00	KFG5616U1M-PID00
Description	Flash, 16MX16, 76ns, PBGA67, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-67	Flash, 16MX16, 76ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, LEAD FREE, TSOP1-48	Flash, 16MX16, 76ns, PBGA67, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-67	Flash, 16MX16, 76ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, LEAD FREE, TSOP1-48	Flash, 16MX16, 76ns, PBGA67, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-67	Flash, 16MX16, 76ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, LEAD FREE, TSOP1-48
Parts packaging code	BGA	TSOP1	BGA	TSOP1	BGA	TSOP1
package instruction	VFBGA,	TSOP1,	VFBGA,	TSOP1,	VFBGA,	TSOP1,
Contacts	67	48	67	48	67	48
Reach Compliance Code	unknown	compliant	compliant	unknown	unknown	unknown
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	76 ns	76 ns	76 ns	76 ns	76 ns	76 ns
JESD-30 code	R-PBGA-B67	R-PDSO-G48	R-PBGA-B67	R-PDSO-G48	R-PBGA-B67	R-PDSO-G48
length	12 mm	18.4 mm	12 mm	18.4 mm	12 mm	18.4 mm
memory density	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	67	48	67	48	67	48
word count	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-30 °C	-30 °C	-30 °C	-30 °C	-40 °C	-40 °C
organize	16MX16	16MX16	16MX16	16MX16	16MX16	16MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	TSOP1	VFBGA	TSOP1	VFBGA	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Programming voltage	1.8 V	2.7 V	2.7 V	1.8 V	2.7 V	2.7 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1 mm	1.2 mm	1 mm	1.2 mm	1 mm	1.2 mm
Maximum supply voltage (Vsup)	1.95 V	2.9 V	2.9 V	1.95 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	1.7 V	2.4 V	2.4 V	1.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	1.8 V	2.65 V	2.65 V	1.8 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	BALL	GULL WING	BALL	GULL WING
Terminal pitch	0.8 mm	0.5 mm	0.8 mm	0.5 mm	0.8 mm	0.5 mm
Terminal location	BOTTOM	DUAL	BOTTOM	DUAL	BOTTOM	DUAL
width	9.5 mm	12 mm	9.5 mm	12 mm	9.5 mm	12 mm
Maker	SAMSUNG	-	-	SAMSUNG	SAMSUNG	SAMSUNG

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