is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
θ
JC
is guaranteed by
design while R
θ
CA
is determined by the user's board design.
6
14
6
6
11
13
5
6
1
1.3
0.19
0.23
0.33
0.38
20
20
20
20
20
20
20
20
nS
t
r
t
f
Turn - Off Fall Time
nC
nC
Gate-Drain Charge
nC
0.51
-0.34
1.5
-1
0.8
-0.8
1.2
-1.2
A
A
V
N-Ch
P-Ch
P
D
(
t
) =
R
θ
JA
(
t
)
T
J
−
T
A
=
R
θ
JC
+
R
θ
CA
(
t
)
T
J
−
T
A
=
I
2
(
t
) ×
R
DS
(
ON
)
D
T
J
Typical R
θ
JA
for single device operation using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:
a. 130
o
C/W when mounted on a 0.125 in
2
pad of 2oz cpper.
b. 140 C/W when mounted on a 0.005 in pad of 2oz cpper.
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