KFG5616U1A-DIB60 datasheet, PDF

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KFG5616U1A-DIB60: DescriptionFlash, 16MX16, 76ns, PBGA67, 7 X 9 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-67; Categorystorage storage; File Size1MB，113 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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KFG5616U1A-DIB60 Overview

Flash, 16MX16, 76ns, PBGA67, 7 X 9 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-67

KFG5616U1A-DIB60 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	67
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	76 ns
Other features	SYNCHRONOUS BURST OPERATION IS POSSIBLE
JESD-30 code	R-PBGA-B67
JESD-609 code	e1
length	9 mm
memory density	268435456 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	2
Number of functions	1
Number of terminals	67
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	7 mm

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OneNAND256(KFG5616x1A-xxB6)

FLASH MEMORY

OneNAND

Specification

Density

Part No.

KFG5616Q1A-DEB6

KFG5616Q1A-PEB6

KFG5616U1A-DIB6

KFG5616U1A-PIB6

(core & IO)

1.8V(1.7V~1.95V)

3.3V(2.7V~3.6V)

Temperature

Extended

Industrial

PKG

67FBGA(LF)

48TSOP1

67FBGA(LF)

48TSOP1

256Mb

Version: Ver. 1.2

Date: Dec. 23, 2005

KFG5616U1A-DIB60 Related Products

	KFG5616U1A-DIB60	KFG5616Q1A-DEB60	KFG5616U1A-PIB60	KFG5616Q1A-PEB60
Description	Flash, 16MX16, 76ns, PBGA67, 7 X 9 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-67	Flash, 16MX16, 76ns, PBGA67, 7 X 9 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-67	Flash, 16MX16, 76ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, TSOP1-48	Flash, 16MX16, 76ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, TSOP1-48
Parts packaging code	BGA	BGA	TSOP1	TSOP1
package instruction	VFBGA,	7 X 9 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-67	TSOP1,	TSOP1,
Contacts	67	67	48	48
Reach Compliance Code	compliant	compliant	compliant	unknown
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	76 ns	76 ns	76 ns	76 ns
Other features	SYNCHRONOUS BURST OPERATION IS POSSIBLE	SYNCHRONOUS BURST OPERATION IS POSSIBLE	SYNCHRONOUS BURST OPERATION IS POSSIBLE	SYNCHRONOUS BURST OPERATION IS POSSIBLE
JESD-30 code	R-PBGA-B67	R-PBGA-B67	R-PDSO-G48	R-PDSO-G48
length	9 mm	9 mm	18.4 mm	18.4 mm
memory density	268435456 bit	268435456 bit	268435456 bit	268435456 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16
Number of functions	1	1	1	1
Number of terminals	67	67	48	48
word count	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-30 °C	-40 °C	-30 °C
organize	16MX16	16MX16	16MX16	16MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	TSOP1	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Programming voltage	2.7 V	1.8 V	2.7 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1 mm	1 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.6 V	1.95 V	3.6 V	1.95 V
Minimum supply voltage (Vsup)	2.7 V	1.7 V	2.7 V	1.7 V
Nominal supply voltage (Vsup)	3.3 V	1.8 V	3.3 V	1.8 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	INDUSTRIAL	OTHER
Terminal form	BALL	BALL	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	DUAL	DUAL
width	7 mm	7 mm	12 mm	12 mm
Is it Rohs certified?	conform to	conform to	conform to	-
Maker	SAMSUNG	-	SAMSUNG	SAMSUNG
Humidity sensitivity level	2	2	3	-
Peak Reflow Temperature (Celsius)	260	260	260	-
Maximum time at peak reflow temperature	40	40	NOT SPECIFIED	-

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