CY37384P256-100BGI datasheet, PDF

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CY37384P256-100BGI: DescriptionEE PLD, 12ns, 384-Cell, CMOS, PBGA256, 27 X 27 MM, 2.33 MM HEIGHT, BGA-256; CategoryProgrammable logic devices Programmable logic; File Size518KB，17 Pages; ManufacturerCypress Semiconductor

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CY37384P256-100BGI Overview

EE PLD, 12ns, 384-Cell, CMOS, PBGA256, 27 X 27 MM, 2.33 MM HEIGHT, BGA-256

CY37384P256-100BGI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	BGA
package instruction	27 X 27 MM, 2.33 MM HEIGHT, BGA-256
Contacts	256
Reach Compliance Code	compliant
Other features	384 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
maximum clock frequency	80 MHz
In-system programmable	YES
JESD-30 code	S-PBGA-B256
JESD-609 code	e0
JTAG BST	YES
length	27 mm
Dedicated input times	1
Number of I/O lines	192
Number of macro cells	384
Number of terminals	256
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1 DEDICATED INPUTS, 192 I/O
Output function	MACROCELL
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA256,20X20,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3/5,5 V
Programmable logic type	EE PLD
propagation delay	12 ns
Certification status	Not Qualified
Maximum seat height	2.46 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm

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CY37384P256-100BGI Related Products

	CY37384P256-100BGI	CY37384P208-100NI	CY37384P208-100NC	CY37384P256-100BGC
Description	EE PLD, 12ns, 384-Cell, CMOS, PBGA256, 27 X 27 MM, 2.33 MM HEIGHT, BGA-256	EE PLD, 12ns, 384-Cell, CMOS, PQFP208, PLASTIC, QFP-208	EE PLD, 12ns, 384-Cell, CMOS, PQFP208, PLASTIC, QFP-208	EE PLD, 12ns, 384-Cell, CMOS, PBGA256, 27 X 27 MM, 2.33 MM HEIGHT, BGA-256
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Parts packaging code	BGA	QFP	QFP	BGA
package instruction	27 X 27 MM, 2.33 MM HEIGHT, BGA-256	PLASTIC, QFP-208	PLASTIC, QFP-208	27 X 27 MM, 2.33 MM HEIGHT, BGA-256
Contacts	256	208	208	256
Reach Compliance Code	compliant	compliant	compliant	compliant
Other features	384 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	384 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	384 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	384 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
maximum clock frequency	80 MHz	80 MHz	80 MHz	80 MHz
In-system programmable	YES	YES	YES	YES
JESD-30 code	S-PBGA-B256	S-PQFP-G208	S-PQFP-G208	S-PBGA-B256
JESD-609 code	e0	e0	e0	e0
JTAG BST	YES	YES	YES	YES
length	27 mm	28 mm	28 mm	27 mm
Dedicated input times	1	1	1	1
Number of I/O lines	192	160	160	192
Number of macro cells	384	384	384	384
Number of terminals	256	208	208	256
Maximum operating temperature	85 °C	85 °C	70 °C	70 °C
organize	1 DEDICATED INPUTS, 192 I/O	1 DEDICATED INPUTS, 160 I/O	1 DEDICATED INPUTS, 160 I/O	1 DEDICATED INPUTS, 192 I/O
Output function	MACROCELL	MACROCELL	MACROCELL	MACROCELL
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	FQFP	FQFP	BGA
Encapsulate equivalent code	BGA256,20X20,50	QFP208,1.2SQ,20	QFP208,1.2SQ,20	BGA256,20X20,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	220	220	NOT SPECIFIED
power supply	3.3/5,5 V	3.3/5,5 V	3.3/5,5 V	3.3/5,5 V
Programmable logic type	EE PLD	EE PLD	EE PLD	EE PLD
propagation delay	12 ns	12 ns	12 ns	12 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.46 mm	3.77 mm	3.77 mm	2.46 mm
Maximum supply voltage	5.5 V	5.5 V	5.25 V	5.25 V
Minimum supply voltage	4.5 V	4.5 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	GULL WING	GULL WING	BALL
Terminal pitch	1.27 mm	0.5 mm	0.5 mm	1.27 mm
Terminal location	BOTTOM	QUAD	QUAD	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	28 mm	28 mm	27 mm

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