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IDT72T51243L7-5BBI

Description
FIFO, 64KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Categorystorage    storage   
File Size202KB,11 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT72T51243L7-5BBI Overview

FIFO, 64KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72T51243L7-5BBI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA,
Contacts256
Reach Compliance Codenot_compliant
ECCN codeEAR99
period time7.5 ns
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
memory density1179648 bit
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals256
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX18
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height3.5 mm
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width17 mm
2.5V MULTI-QUEUE FIFO (4 QUEUES)
18 BIT WIDE CONFIGURATION
589,824 bits, 1,179,648 bits and
2,359,296 bits
ADVANCE INFORMATION
IDT72T51233
IDT72T51243
IDT72T51253
FEATURES:
Choose from among the following memory density options:
IDT72T51233
Total Available Memory = 589,824 bits
IDT72T51243
Total Available Memory = 1,179,648 bits
IDT72T51253
Total Available Memory = 2,359,296 bits
Configurable from 1 to 4 Queues
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 512 x 18 or 1,024 x 9
Independent Read and Write access per queue
User selectable I/O: 2.5V LVTTL, 1.5V HSTL, 1.8V eHSTL
User programmable via serial port
Default Multi-Queue device configurations
-IDT72T51233: 8,192 x 18 x 4Q
-IDT72T51243: 16,384 x 18 x 4Q
-IDT72T51253: 32,768 x 18 x 4Q
100% Bus Utilization, Read and Write on every clock cycle
200 MHz High speed operation (5ns cycle time)
3.6ns access time
Echo Read Enable & Echo Read Clock Outputs
Individual, Active queue flags (OV,
FF, PAE, PAF, PR)
4 bit parallel flag status on both read and write ports
Provides continuous
PAE
and
PAF
status of up to 4 Queues
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
- x18in to x18out
- x9in to x18out
- x18in to x9out
- x9in to x9out
FWFT mode of operation on read port
Packet Ready mode of operation
Partial Reset, clears data in single Queue
Expansion of up to 8 Multi-Queue devices in parallel is available
Power Down Input provides additional power savings in HSTL
and eHSTL modes.
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
DATA PATH FLOW DIAGRAM
MULTI-QUEUE FIFO
WADEN
FSTR
WRADD
WEN
WCLK
5
READ CONTROL
RADEN
ESTR
RDADD
6
WRITE CONTROL
Q0
REN
RCLK
EREN
ERCLK
OE
x9, x18
DATA IN
FF
PAF
PAFn
Din
Qout
x9, x18
DATA OUT
READ FLAGS
OV
PAE
PAEn
4
WRITE FLAGS
Qmax
4
6115 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2001
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
OCTOBER 2, 2001
DSC-6115/-

IDT72T51243L7-5BBI Related Products

IDT72T51243L7-5BBI IDT72T51233L7-5BB IDT72T51233L7-5BBI IDT72T51243L7-5BB IDT72T51253L7-5BBI IDT72T51253L7-5BB
Description FIFO, 64KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 32KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 32KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA BGA BGA BGA
package instruction BGA, BGA, BGA, BGA, BGA, BGA,
Contacts 256 256 256 256 256 256
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
period time 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609 code e0 e0 e0 e0 e0 e0
length 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
memory density 1179648 bit 589824 bit 589824 bit 1179648 bit 2359296 bit 2359296 bit
memory width 18 18 18 18 18 18
Humidity sensitivity level 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1
Number of terminals 256 256 256 256 256 256
word count 65536 words 32768 words 32768 words 65536 words 131072 words 131072 words
character code 64000 32000 32000 64000 128000 128000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C
organize 64KX18 32KX18 32KX18 64KX18 128KX18 128KX18
Exportable YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225 225 225 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 20 20 20 20 20
width 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
Base Number Matches - 1 1 1 1 1
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