IDT7MP4145SA20M datasheet, PDF

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IDT7MP4145SA20M: DescriptionSRAM Module, 1MX8, 20ns, CMOS; Categorystorage storage; File Size214KB，8 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT7MP4145SA20M Overview

SRAM Module, 1MX8, 20ns, CMOS

IDT7MP4145SA20M Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
package instruction	SIMM, SSIM72
Reach Compliance Code	not_compliant
ECCN code	3A991.B.2.A
Maximum access time	20 ns
Other features	CONFIGURABLE AS 256K X 32
Spare memory width	16
I/O type	COMMON
JESD-30 code	R-XSMA-N72
JESD-609 code	e0
memory density	8388608 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	72
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX8
Output characteristics	3-STATE
Exportable	YES
Package body material	UNSPECIFIED
encapsulated code	SIMM
Encapsulate equivalent code	SSIM72
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	16.764 mm
Maximum standby current	0.12 A
Minimum standby current	4.5 V
Maximum slew rate	1.36 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	SINGLE
Maximum time at peak reflow temperature	30

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IDT7MP4145SA20M Related Products

	IDT7MP4145SA20M	IDT7MP4045SA15M	IDT7MP4045SA15Z	IDT7MP4045SA20Z	IDT7MP4045SA25M	IDT7MP4045SA25Z	IDT7MP4145SA15M	IDT7MP4145SA25M	IDT7MP4045SA20M
Description	SRAM Module, 1MX8, 20ns, CMOS	SRAM Module, 1MX8, 15ns, CMOS	SRAM Module, 1MX8, 15ns, CMOS	SRAM Module, 1MX8, 20ns, CMOS	SRAM Module, 1MX8, 25ns, CMOS	SRAM Module, 1MX8, 25ns, CMOS	SRAM Module, 1MX8, 15ns, CMOS	SRAM Module, 1MX8, 25ns, CMOS	SRAM Module, 1MX8, 20ns, CMOS
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
package instruction	SIMM, SSIM72	SIMM, SSIM64	ZIP, ZIP64/68,.1,.1	ZIP, ZIP64/68,.1,.1	SIMM, SSIM64	ZIP, ZIP64/68,.1,.1	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM64
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	20 ns	15 ns	15 ns	20 ns	25 ns	25 ns	15 ns	25 ns	20 ns
Other features	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32
Spare memory width	16	16	16	16	16	16	16	16	16
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XSMA-N72	R-XSMA-N64	R-XZMA-T64	R-XZMA-T64	R-XSMA-N64	R-XZMA-T64	R-XSMA-N72	R-XSMA-N72	R-XSMA-N64
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	72	64	64	64	64	64	72	72	64
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	SIMM	SIMM	ZIP	ZIP	SIMM	ZIP	SIMM	SIMM	SIMM
Encapsulate equivalent code	SSIM72	SSIM64	ZIP64/68,.1,.1	ZIP64/68,.1,.1	SSIM64	ZIP64/68,.1,.1	SSIM72	SSIM72	SSIM64
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225	225	225	225
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	16.764 mm	16.002 mm	15.24 mm	14.859 mm	16.002 mm	14.859 mm	16.764 mm	16.764 mm	16.002 mm
Maximum standby current	0.12 A	0.12 A	0.32 A	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	1.36 mA	1.36 mA	1.6 mA	1.36 mA	1.36 mA	1.36 mA	1.36 mA	1.36 mA	1.36 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	SINGLE	SINGLE	ZIG-ZAG	ZIG-ZAG	SINGLE	ZIG-ZAG	SINGLE	SINGLE	SINGLE
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30	30

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