□□1111C
Surface Mount IRED/1608 ( t = 0.7 mm) Type
Features
Package
Product features
1608 ( h = 0.7 mm) type, Water clear epoxy
・Outer
Dimension 1.6 x 0.8 x 0.7mm ( L x W x H )
・Small
Size
・Total
Output Power
DNK
:
6.5mW TYP. (I
F
=20mA)
TAN
:
4.3mW TYP. (I
F
=20mA)
AN
:
2.0mW TYP. (I
F
=20mA)
・Lead–free
soldering compatible
・RoHS
compliant
Peak Wavelength
DNK
TAN
AN
: 865nm
: 940nm
: 950nm
:
θx
= 145 deg.,
θy
=145 deg.
:
θx
= 145 deg.,θy = 145 deg.
:
θx
= 125 deg.,θy = 150 deg.
GaAs(TAN,AN)
Half Intensity Angle
DNK
TAN
AN
Die materials
Rank grouping parameter
Assembly method
Soldering methods
Taping and reel
ESD-withstand voltage
GaAlAs(DNK)
Sorted by radiant intensity per rank taping
Auto pick & place machine (Auto Mounter)
Reflow soldering
※Please
refer to Soldering Conditions about soldering.
4,000pcs per reel in a 8mm width tape. (Standard)
Reel diameter:φ180mm
2kV (HBM)
Recommended Applications
Car Audio, Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications
2010.03.30
Page 1
□□1111C
Surface Mount IRED/1608 ( h = 0.7 mm) Type
Color and Luminous Intensity
Peak
Wavelength
λ
½
(nm)
(Ta=25℃)
Part No.
Material
Lens
Color
Radiant Intensity
I
E
(
½
W/sr)
TYP.
DNK1111C
TAN1111C
AN1111C
GaAlAs
GaAs
GaAs
Water
Clear
865
940
950
I
F
(mA)
20
20
20
MIN.
0.7
0.3
0.2
TYP.
1.4
0.6
0.28
I
F
(mA)
20
20
20
2010.03.30
Page 2
□□1111C
Surface Mount IRED/1608 ( h = 0.7 mm) Type
Absolute Maximum Ratings
Item
Power Dissipation
Forward Current
Pulse Forward Current
Derating
(Ta=25
℃
or higher)
Reverse Voltage
Operating Temperature
Storage Temperature
※
1
(Ta=25℃)
Absolute Maximum Ratings
DNK
80
50
300
0.67
4.00
5
TAN
70
50
300
0.67
4.00
5
-30
½
+85
-40
½
+100
AN
75
50
300
0.67
4.00
5
Symbol
P
d
I
F
I
FRM
⊿
I
F
⊿
I
FRM
V
R
T
opr
T
stg
Unit
mW
mA
mA
mA/
℃
mA/
℃
V
℃
℃
※1
I
FRM
Measurement condition : Pulse Width≦100μs, Duty≦1/100
Electro-Optical Characteristics
Item
Conditions
I
F
=20mA
V
R
=5V
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
DC
±5mA,
-3db from 0.1MHz
I
F
=20mA
Symbol
(Ta=25℃)
Characteristics
DNK
TYP.
MAX.
MAX.
MIN.
TYP.
TYP.
TYP.
TYP.
TYP.
MIN.
TYP.
TYP.
1.40
1.65
100
0.7
1.4
6.5
865
45
TAN
1.20
1.40
10
0.3
0.6
4.3
940
50
AN
1.22
1.40
10
0.2
0.28
2
950
45
Unit
Forward Voltage
Reverse Current
Radiant Intensity
Total Output Power
Peak Wavelength
Spectral Half-width
Half Intensity Angle
V
F
I
R
I
E
Po
λ
p
⊿
λ
2θ1/2
V
μA
mW/sr
mW
nm
nm
deg.
145(θx) 145(θx) 125(θx)
145(θy)
-
50
7
145(θy)
-
-
1000
150(θy)
-
0.5
700
Cut-off Frequency
Response Time
fc
tr/tf
MHz
ns
※ θx:Product
long side axis,θ½:Product short side axis
2010.03.30
Page 3
□□1111C
Surface Mount IRED/1608 ( h = 0.7 mm) Type
Radiant Intensity Rank
(Ta=25℃)
R a nk
DNK
I
F
=20mA
MIN.
MAX.
1.4
2.0
2.8
4.0
5.6
0.7
1.0
1.4
2.0
2.8
I
E
(mW/sr)
TAN
I
F
=20mA
MIN.
0.3
0.4
0.6
0.8
1.2
MAX.
0.6
0.8
1.2
1.6
2.4
AN
I
F
=20mA
MIN.
0.20
0.28
0.40
-
-
MAX.
0.40
0.56
0.80
-
-
A
B
C
D
E
※Please
contact our sales staff concerning rank designation.
2010.03.30
Page 4
□□1111C
Surface Mount IRED/1608 ( h = 0.7 mm) Type
Technical Data(DNK)
Spectral Distribution
Relative Intensity vs. Wavelength
Condition : Ta = 25℃, I
F
= 20mA
Spatial Distribution Example
条件/Condition
: Ta = 25℃
y
1.2
1.0
Relative Intensity
x
0.8
1
0.6
0.4
0.2
0.0
700
800
Wavelength [nm]
900
1000
Forward Voltage vs. Forward Current
Condition : Ta = 25℃
Duty Ratio vs. Pulse Forward Current
Condition : Ta = 25℃, tw
≦
100μs
100
1000
Pulse Forward Current I
FRM
(mA)
Forward Current I
F
(mA)
10
100
1
1.2
1.3
1.4
Forward Voltage : V
F
(V)
1.5
1.6
10
0.001
0.01
Duty Ratio
0.1
1
2010.03.30
Page 5