|
HI4P5049-5 |
HI4P5045-5 |
HI4P5043-5 |
| Description |
DPST, 2 Func, 2 Channel, CMOS, PQCC20 |
DPST, 2 Func, 2 Channel, CMOS, PQCC20 |
SPDT, 2 Func, 1 Channel, CMOS, PQCC20 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
| package instruction |
QCCJ, LDCC20,.4SQ |
QCCJ, LDCC20,.4SQ |
QCCJ, LDCC20,.4SQ |
| Reach Compliance Code |
unknown |
unknown |
unknown |
| Analog Integrated Circuits - Other Types |
DPST |
DPST |
SPDT |
| JESD-30 code |
S-PQCC-J20 |
S-PQCC-J20 |
S-PQCC-J20 |
| JESD-609 code |
e0 |
e0 |
e0 |
| Nominal Negative Supply Voltage (Vsup) |
-15 V |
-15 V |
-15 V |
| Number of channels |
2 |
2 |
1 |
| Number of functions |
2 |
2 |
2 |
| Number of terminals |
20 |
20 |
20 |
| Nominal off-state isolation |
80 dB |
80 dB |
80 dB |
| On-state resistance matching specifications |
1 Ω |
2 Ω |
2 Ω |
| Maximum on-state resistance (Ron) |
50 Ω |
75 Ω |
75 Ω |
| Maximum operating temperature |
75 °C |
75 °C |
75 °C |
| output |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
QCCJ |
QCCJ |
QCCJ |
| Encapsulate equivalent code |
LDCC20,.4SQ |
LDCC20,.4SQ |
LDCC20,.4SQ |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
| Package form |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
5,+-15 V |
5,+-15 V |
5,+-15 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum supply current (Isup) |
0.5 mA |
0.5 mA |
0.5 mA |
| Nominal supply voltage (Vsup) |
15 V |
15 V |
15 V |
| surface mount |
YES |
YES |
YES |
| Maximum disconnect time |
500 ns |
500 ns |
500 ns |
| Maximum connection time |
1000 ns |
1000 ns |
1000 ns |
| switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
J BEND |
J BEND |
J BEND |
| Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Maker |
Harris |
Harris |
- |
| normal position |
NO |
NO |
- |
| Base Number Matches |
- |
1 |
1 |