Connection
Systems
Surface Mount
Surface Mount
PLCC Sockets
Description
Plastic Leaded Chip Carriers (PLCCs) in electronic equipment have
created a need for socketing devices to attach to printed wiring
board assemblies. Delphi Connection Systems’ PLCC sockets provide
a cost-effective, upgradeable method of utilizing PLCCs. These low
profile 4.45 mm [.175 in.] sockets allow high-density PC board
stacking.
Delphi’s sockets utilize Surface Mount Technology (SMT) and are
available with or without a board polarization feature. This internal
polarization feature identifies proper chip carrier orientation.
Molded-in standoffs aid the solder cleaning process. Inspection
windows in the base help enable easy socket placement on the PC
board and facilitate solder joint repair and inspection. A center pad
provides an area for pick-and-place processes.
To help ensure correct removal of devices from sockets, an
extraction tool is available. This tool fits all socket sizes and has
a plastic handle with heat treated steel blades.
Tool Part Number: PLCCT2084
Typical Applications
Computers and peripherals
Office automation
Instrumentation
Benefits/Features:
Industry Standard . . . . These sockets interface with standard
1.27 mm [.050 in.] pitch PLCCs defined by
the JEDEC JC-11 committee and included in
JEDEC Publication 95.
Square packages meet the requirements of
MS-018.
Rectangular packages meet the
requirements of MO-052.
Performance Characteristics
Product Type
Total No. of Positions
Housing Color
Packaging Type
Insulator Material
Surface mount PLCC sockets
20, 28, 32, 44, 68 and 84
Dark brown
Tubes (standard)
or tape and reel (optional)
UL94V-0 high temperature thermoplastic
Compatible with IR reflow and wave
soldering
1.0 amps max. per contact
20 mΩ max.
120 volts
-55°C to +125°C
50 cycles
180 grams/pin max.
28.35 grams/pin min.
4.57 µm [180 µin.] tin-lead over nickel
underplating
4.57 µm [180 µin.] tin-lead over nickel
underplating
1.14 µm [45 µin.] nickel
UL approved: UL File E134099
Current Rating
Contact Resistance
Voltage Rating
Continuous Operating
Temperature
Durability (Mating Cycles)
Mating Force
Unmating Force
Plating (Contact Area)
Plating (Soldering End)
Underplating
Standards, Approvals and
Certifications
PLCC Sockets
PCB Layout
Dimensions shown in millimeters and [inches].
No. of
Positions
20
28
32
44
68
84
Dim. “A”
5.08 [.200]
7.62 [.300]
7.62 [.300]
12.70 [.500]
20.32 [.800]
25.40 [1.000]
Dim. “B”
15.24 [.600]
17.78 [.700]
17.78 [.700]
22.86 [.900]
30.82 [1.213]
35.90 [1.413]
Dim. “C”
16.70 [.657]
20.30 [.799]
22.50 [.886]
27.50 [1.083]
38.30 [1.508]
45.50 [1.791]
Dim. “D”
5.08 [.200]
7.62 [.300]
10.16 [.400]
12.70 [.500]
20.32 [.800]
25.40 [1.000]
Dim. “E”
15.24 [.600]
17.78 [.700]
20.32 [.800]
22.86 [.900]
30.82 [1.213]
35.90 [1.413]
Dim. “F”
8.48 [.334]
11.02 [.434]
11.02 [.434]
16.10 [.634]
23.72 [.934]
28.80 [1.134]
Dim. “G”
8.48 [.334]
11.02 [.434]
13.56 [.534]
16.10 [.634]
23.72 [.934]
28.80 [1.134]
Dim. “H”
12.70 [.500]
15.24 [.600]
17.78 [.700]
20.32 [.800]
27.94 [1.100]
33.02 [1.300]
Dim. “J”
9.40 [.370]
11.94 [.470]
11.94 [.470]
17.02 [.670]
24.64 [.970]
29.72 [1.170]
Dim. “K”
9.40 [.370]
11.94 [.470]
14.48 [.570]
17.02 [.670]
24.64 [.970]
29.72 [1.170]
Ordering Nomenclature
Series
PLCCSMT 20 T 0 T
Packaging:
T
= Tubes (standard)
Polarization:
R
= Tape and reel
No. of Contact Positions:
20, 28, 32, 44, 68, or 84
0
= No polarization
1
= Polarization post
All information is deemed correct as of the date of publication and subject
to change without notice. For additional information, please contact Delphi
Connection Systems.
www.delphi.com/connect
Printed on Recycled Paper.
© 2003, Delphi. All rights reserved.
Printed in the U.S.A.
503/3W
DP-03-E-103
Connection Systems
19200 Asheville Highway
P Box 519
.O.
Landrum, SC 29356 U.S.A.
Tel: [1] 864.457.3824
Fax: [1] 864.457.2535
Embedded System
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