S29GL01GP13FFCR13 datasheet, PDF

Datasheet> All Categories > storage> storage> S29GL01GP13FFCR13

S29GL01GP13FFCR13: DescriptionFlash, 1GX1, 130ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64; Categorystorage storage; File Size3MB，80 Pages; ManufacturerCypress Semiconductor; Environmental Compliance

Download Datasheet Parametric View All

S29GL01GP13FFCR13 Overview

Flash, 1GX1, 130ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64

S29GL01GP13FFCR13 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Cypress Semiconductor
package instruction	LBGA,
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	130 ns
JESD-30 code	R-PBGA-B64
length	13 mm
memory density	1073741824 bit
Memory IC Type	FLASH
memory width	1
Number of functions	1
Number of terminals	64
word count	1073741824 words
character code	1000000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	1GX1
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
type	NOR TYPE
width	11 mm

Preview

Download Datasheet

View All

S29GL-P MirrorBit

Flash Family

S29GL01GP, S29GL512P, S29GL256P, S29GL128P

1 Gigabit, 512 Megabit, 256 Megabit and 128 Megabit

3.0 Volt-only Page Mode Flash Memory featuring

90 nm MirrorBit Process Technology

S29GL-P MirrorBit

Flash Family Cover Sheet

Data Sheet

Notice to Readers:

This document states the current technical specifications regarding the Spansion

product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume

such that subsequent versions of this document are not expected to change. However, typographical or

specification corrections, or modifications to the valid combinations offered may occur.

Publication Number

S29GL-P_00

Revision

Amendment

Issue Date

November 20, 2009

D at a

S hee t

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of

product information or intended specifications throughout the product life cycle, including development,

qualification, initial production, and full production. In all cases, however, readers are encouraged to verify

that they have the latest information before finalizing their design. The following descriptions of Spansion data

sheet designations are presented here to highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more specific

products, but has not committed any design to production. Information presented in a document with this

designation is likely to change, and in some cases, development on the product may discontinue. Spansion

Inc. therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion Inc.

The information is intended to help you evaluate this product. Do not design in this product without

contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a commitment

to production has taken place. This designation covers several aspects of the product life cycle, including

product qualification, initial production, and the subsequent phases in the manufacturing process that occur

before full production is achieved. Changes to the technical specifications presented in a Preliminary

document should be expected while keeping these aspects of production under consideration. Spansion

places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. The Preliminary status of this document indicates that product qualification has been

completed, and that initial production has begun. Due to the phases of the manufacturing process that

require maintaining efficiency and quality, this document may be revised by subsequent versions or

modifications due to changes in technical specifications.”

Combination

Some data sheets contain a combination of products with different designations (Advance Information,

Preliminary, or Full Production). This type of document distinguishes these products and their designations

wherever necessary, typically on the first page, the ordering information page, and pages with the DC

Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first

page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes

are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include

those affecting the number of ordering part numbers available, such as the addition or deletion of a speed

option, temperature range, package type, or V

range. Changes may also include those needed to clarify a

description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following

conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. Spansion Inc. deems the products to have been in sufficient production volume such

that subsequent versions of this document are not expected to change. However, typographical or

specification corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

S29GL-P MirrorBit

Flash Family

S29GL-P_00_A12 November 20, 2009

Data

She et

Table of Contents

General Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Distinctive Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Performance Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Ordering Information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Input/Output Descriptions & Logic Symbol

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Block Diagram

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Physical Dimensions/Connection Diagrams

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2

Special Handling Instructions for BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.3

LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.4

TS056—56-Pin Standard Thin Small Outline Package (TSOP) . . . . . . . . . . . . . . . . . . . . . .

Additional Resources.

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.1

Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2

Specification Bulletins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3

Hardware and Software Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.4

Contacting Spansion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Product Overview

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.1

Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Device Operations

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.1

Device Operation Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.2

Word/Byte Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.3

VersatileIO

) Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.4

Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.5

Page Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.6

Autoselect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.7

Program/Erase Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.8

Write Operation Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.9

Writing Commands/Command Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Advanced Sector Protection/Unprotection

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.1

Lock Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.2

Persistent Protection Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.3

Persistent Protection Bit Lock Bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.4

Password Protection Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.5

Advanced Sector Protection Software Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.6

Hardware Data Protection Methods. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Conservation Modes

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.1

Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.2

Automatic Sleep Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.3

Hardware RESET# Input Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.4

Output Disable (OE#). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Secured Silicon Sector Flash Memory Region

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.1 Factory Locked Secured Silicon Sector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.2 Customer Lockable Secured Silicon Sector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.3 Secured Silicon Sector Entry/Exit Command Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrical Specifications

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.2 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.3 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.4 Key to Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.5 Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.6 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.7 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.

11.

November 20, 2009 S29GL-P_00_A12

S29GL-P MirrorBit

Flash Family

Recommended Resources

OP291 0 to 300℃ temperature measurement circuit

Simulated Qigong Information Instrument

Digital pressure measurement circuit

high voltage amplifier

High power multivibrator circuit

DIY-STM32F103ZET6 core board + 4.3-inch LCD driver board: The upper part is a STM32F103ZET6 core board. Unlike most core boards I have seen before, this is more like a "dedicated" board with SRAM. The main interface only leads to 2 FSMCs with complete signal...; snoweaglemcu stm32/stm8

Talk about solving EXP430G2 and MSP430FR5xxx debugging problems: I found something strange these days. The previous EXP430G2 could not download programs. I found a new board and still had the same problem. 30124285 Sat Nov 03, 2012 19:20:19: Interface dll version 2...; littleshrimp Microcontroller MCU

Can evc4.0 develop wince5.0 programs? Urgent!: Can evc4.0 develop programs that run on wince5.0? Are there any requirements for bin files? Or are there other precautions? What is the problem that a program that runs normally on wince4.2 is not a v...; van420 Embedded System

Beginner Questions: I just learned about microcontrollers. When simulating, the message "connection to target lost" appears. What is the reason? Another question: when uploading pictures on eeworld, it prompts that an un...; tpcore Embedded System

【Meet friends by disassembling】Disassembling an electronic water level meter: [i=s] This post was last edited by hujj on 2018-7-17 13:44 [/i] [align=left][color=#000000]I bought a light column type electronic water level meter from Taobao. The device consists of two major parts...; hujj Making friends through disassembly

GD32E231 DIY Part 3: LED Smooth Dimming Principle: [i=s]This post was last edited by Li Baiyi on 2019-5-18 18:55[/i] [font=宋体][size=4][color=#333333] The brightness dimming of LED[/color][color=#333333] is achieved by changing the conduction time of t...; 李百仪 GD32 MCU

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components