82008033A datasheet, PDF - EEWORLD Datasheet

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82008033A: DescriptionOTP ROM, 4KX8, 45ns, Bipolar, CQCC28, CERAMIC, LCC-28; Categorystorage storage; File Size275KB，15 Pages; ManufacturerMonolithic Memories

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82008033A Overview

OTP ROM, 4KX8, 45ns, Bipolar, CQCC28, CERAMIC, LCC-28

82008033A Parametric

Parameter Name	Attribute value
Objectid	1516188327
package instruction	CERAMIC, LCC-28
Reach Compliance Code	unknown
Maximum access time	45 ns
JESD-30 code	S-CQCC-N28
memory density	32768 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	4KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Filter level	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal location	QUAD

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REVISIONS

LTR

DESCRIPTION

Change to vendor similar part number for vendor CAGE 18324.

Changes to table I parameters t

and C

OUT

. Add vendor CAGE

18324 to device types 03 and 04 as a source of supply. Add new

device design for device 04 for vendor CAGE 07933. Removed table

III, figure 5, and programming procedures. Editorial changes

throughout.

Changes in accordance with NOR 5962-R010-93

Changes in accordance with NOR 5962-R205-93

Updated boilerplate. Sheet 4, change V

conditions from I

= -2.0

mA to -1.6 mA; change C

max. limit from 10 pF to 15 pF; change

OUT

max. limit for devices 01, 02, and 04 from 13 pF to

20 pF; add footnote 3 to t

test column. Removed logic diagrams.

Remove vendors CAGE 50364 and 34335 as suppliers, and removed

their associated switching time test circuits.

Boilerplate update, part of 5 year review. ksr

Update drawing to meet current MIL-PRF-38535 requirements. – glg

DATE (YR-MO-DA)

91-10-30

APPROVED

M. A. Frye

93-02-12

93-08-10

97-05-29

M. A. Frye

Raymond Monnin

05-06-30

10-11-10

17-09-16

Raymond Monnin

Charles F. Saffle

CURRENT CAGE CODE 67268

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Darrell Hill

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

CHECKED BY

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

http://www.landandmaritime.dla.mil

C. R. Jackson

APPROVED BY

N. A. Hauck

DRAWING APPROVAL DATE

MICROCIRCUIT, MEMORY, DIGITAL,

SCHOTTKY BIPOLAR 32K PROGRAMMABLE

READ ONLY MEMORY (PROM), MONOLITHIC

SILICON

SIZE

CAGE CODE

82-09-01

REVISION LEVEL

SHEET

14933

1 OF

82008

5962-E570-17

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://quicksearch.dla.mil/

or from the Standardization Document Order

Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-

PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying

activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan

may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.

These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-

PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2.

3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing

shall be as specified on figure 2. When required in groups A or C (see 4.3), the devices shall be programmed by the

manufacturer prior to test in a checkerboard pattern (a minimum of 50 percent of the total number of bits programmed).

3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

82008

SHEET

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