Digital SLIC, Basic, 1-Func, CMOS, PQCC28, PLASTIC, LCC-28
MT8971BP Parametric
Parameter Name
Attribute value
Is it Rohs certified?
incompatible
Maker
Zarlink Semiconductor (Microsemi)
package instruction
QCCJ, LDCC28,.5SQ
Reach Compliance Code
unknown
data rate
160 Mbps
ISDN access rate
BASIC
JESD-30 code
S-PQCC-J28
JESD-609 code
e0
length
11.5062 mm
Number of functions
1
Number of terminals
28
Maximum operating temperature
85 °C
Minimum operating temperature
-40 °C
Minimum output high voltage
2.4 V
Maximum output low current
0.005 A
Maximum output low voltage
0.4 V
Package body material
PLASTIC/EPOXY
encapsulated code
QCCJ
Encapsulate equivalent code
LDCC28,.5SQ
Package shape
SQUARE
Package form
CHIP CARRIER
Peak Reflow Temperature (Celsius)
260
power supply
5 V
Certification status
Not Qualified
reference point
S
Maximum seat height
4.57 mm
Nominal supply voltage
5 V
surface mount
YES
technology
CMOS
Telecom integrated circuit types
DIGITAL SLIC
Temperature level
INDUSTRIAL
Terminal surface
Tin/Lead (Sn/Pb)
Terminal form
J BEND
Terminal pitch
1.27 mm
Terminal location
QUAD
Maximum time at peak reflow temperature
NOT SPECIFIED
width
11.5062 mm
MT8971BP Preview
®
ISO
2
-CMOS ST-BUS™ FAMILY
MT8971B/72B
Digital Subscriber Interface Circuit
Digital Network Interface Circuit
Features
•
•
•
•
•
Full duplex transmission over a single twisted
pair
Selectable 80 or 160 kbit/s line rate
Adaptive echo cancellation
Up to 3km (8971B) and 4 km (8972B)
ISDN compatible (2B+D) data format
ISSUE 7
May 1995
ed
nd n
e ig
• Transparent modem capability
m s 2
• Frame synchronization and clock extraction
m De
Description
(DSIC) and MT8972B (DNIC) are
The
7
• MITEL ST-BUS compatible
cow 71/
MT8971B devices capable of providing high
multi-function
e e
• Low power (typically 50 mW), single 5V supply
full
transmission
to 160
t Rr N T91
speed,over aduplex digital pair. They useupadaptive
kbit/s
twisted wire
o o
techniques
transfer data in
N f e M
echo-cancelling compatible to and ISDN basic rate.
(2B+D) format
the
Several modes of operation allow an easy interface
Applications
Se
to digital telecommunication networks including use
•
•
•
•
Digital subscriber lines
High speed data transmission over twisted
wires
Digital PABX line cards and telephone sets
80 or 160 kbit/s single chip modem
as a high speed limited distance modem with data
rates up to 160 kbit/s.
Both devices function
identically but with the DSIC having a shorter
maximum loop reach specification. The generic
"DNIC" will be used to reference both devices unless
otherwise noted.
The MT8971B/72B is fabricated in Mitel’s ISO
2
-
CMOS process.
Ordering Information
MT8971BE
22 Pin Plastic DIP
MT8972BE
22 Pin Plastic DIP
MT8972BC
22 Pin Ceramic DIP
MT8971BP
28 Pin PLCC
MT8972BP
28 Pin PLCC
-40°C to
+
85°C
DSTi/Di
CDSTi/
CDi
Transmit
Interface
Prescrambler
Scrambler
Differentially
Encoded Biphase
Transmitter
Transmit
Filter &
Line Driver
L
OUT
F0/CLD
C4/TCK
F0o/RCK
MS0
MS1
MS2
RegC
Control
Register
Transmit
Timing
V
Bias
Address
Echo Canceller
Error
Signal
Echo Estimate
—
DPLL
MUX
L
OUT
DIS
Master Clock
Phase Locked
Transmit/
Clock
Receive
Timing &
Control
Sync Detect
Status
Receive
Precan
∑
+
Receive
Filter
-1
+2
L
IN
OSC2
DSTo/Do
CDSTo/
CDo
Receive
Interface
De-
Prescrambler
Descrambler
Differentially
Encoded Biphase
Receiver
OSC1
V
DD
V
SS
V
Bias
V
Ref
Figure 1 - Functional Block Diagram
9-113
MT8971B/72B
Notes:
9-114
For more information about all Zarlink products
visit our Web Site at
www.zarlink.com
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. trading as Zarlink Semiconductor or its subsidiaries (collectively
“Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the
application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may
result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under
patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified
that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property
rights owned by Zarlink.
This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part
of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.
Purchase of Zarlink’s I
2
C components conveys a licence under the Philips I
2
C Patent rights to use these components in an I
2
C System, provided that the system
conforms to the I
2
C Standard Specification as defined by Philips.
Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2002, Zarlink Semiconductor Inc. All Rights Reserved.
As shown in the figure above, after the TVS tube SMAJ58A has degraded in performance and turned into a low-resistance state (it may also break down and short-circuit), the current of the 48V power sup...
I wonder what kind of decoder chips are used in small and medium-sized screens in everyone's products? I specialize in selling video decoder chips. I have a large number of original genuine products i...
This is not a toy nor a private weapon. It is a real pistol-shaped camera. Isn't it very impressive? When I took a photo of someone for the first time, I thought they were robbing me. The Japanese are...
I use GR64's script to send short messages, but they fail to send and return an error. However, if I send it to GR64 first, it can reply successfully. I don't understand what's going on. Can any exper...
[i=s] This post was last edited by 915709857 on 2015-4-11 20:11 [/i] Problem with ccs6.0, please help? CORTEX_M4_0: GEL: Encountered a problem loading file: F:\workspace_v6_0\WS\Debug\WS.out Could not...
On August 24th, Tesla CEO Elon
Musk
revealed information about the upcoming FSD V14, claiming it will outperform human drivers. Tesla FSD lead Ashok stated last year that FSD version 12.5, ...[Details]
There are many different ways of human-computer interaction. The more common ones are listed below:
Mouse interaction: Using a mouse to operate a computer and interact was the most common human...[Details]
If the ultimate form of a car is a silicon-based life form, then in
the field of
intelligent driving
, it has gradually taken on the appearance of a "veteran driver." In
the field of
the ...[Details]
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
Capable of providing precise and efficient thermal management for artificial intelligence computing power, intelligent sensing and autonomous driving systems
Shenzhen, ...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[Details]
Based on a survey of more than ten intelligent robot companies, this article sorts out and analyzes the current development status of the intelligent industry and the challenges and differences it ...[Details]
As the scale and business applications of national e-government networks continue to expand, the data and services transmitted over them are becoming increasingly sensitive and critical. To protect...[Details]
Normally, we determine our location and where we want to go by comparing our surroundings with observation and simple GPS tools. However, this kind of reasoning is very difficult for self-driving c...[Details]
1. Ease of Use: The HMI module should be designed to be simple and clear, allowing users to easily operate and configure the energy storage device.
2. Ease of Maintenance: The HMI module should...[Details]
On August 22, according to CNBC's report today, the National Highway Traffic Safety Administration (NHTSA) is launching an investigation into Tesla, and the latter is questioned whether it has fail...[Details]
Recently, Joyson Electronics has made positive progress in the core technology research and development of the robot's "brain and brain" and key components, and launched the industry's first integr...[Details]
On August 20, Geely announced its focus on "One Cockpit". Through a unified AI OS architecture, a unified AI Agent, and a unified user ID, it will achieve an All-in-One AI cockpit, create the first...[Details]
The difference between a series inverter and a parallel inverter is that they use different oscillation circuits. A series inverter connects L, R, and C in series, while a parallel inverter connect...[Details]
Switching Power Supply Study Group
京公网安备 11010802033920号
EEWORLD
