Operating Temperature Range .........................-40°C to +105°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ESD Protection
Human Body Model (RD = 1.5kΩ, CS = 100pF)
All Other Pins Including SCL, SDA to GND .................±2kV
IEC 61000-4-2 (RD = 330Ω, CS = 150pF)
Contact Discharge
(DIN_, DOUT_) to GND ..............................................±10kV
Air-Gap Discharge
(DIN_, DOUT_) to GND ..............................................±15kV
ISO 10605 (RD = 2kΩ, CS = 330pF)
Contact Discharge
(DIN_, DOUT_) to GND ..............................................±10kV
Air-Gap Discharge
(DIN_, DOUT_) to GND ..............................................±25kV
Lead Temperature (soldering, 10s) ................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
20 TSSOP-EP
Junction-to-Ambient Thermal Resistance (θ
JA
) ........37.7°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ..................2°C/W
32 TQFP-EP
Junction-to-Ambient Thermal Resistance (θ
JA
) ...........36°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ..................4°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
DC ELECTRICAL CHARACTERISTICS
(V
AVDD
= V
DVDD
= V
LVDSVDD
= +3.0V to +3.6V, T
A
= -40°C to +105°C, unless otherwise noted. Typical values are at V
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