LPC2109FBD64 datasheet, PDF - EEWORLD Datasheet

LPC2109/2119/2129

Single-chip 16/32-bit microcontrollers; 64/128/256 kB ISP/IAP

flash with 10-bit ADC and CAN

Rev. 7 — 14 June 2011

Product data sheet

1. General description

The LPC2109/2119/2129 are based on a 16/32-bit ARM7TDMI-S CPU with real-time

emulation and embedded trace support, together with 64/128/256 kB of embedded

high-speed flash memory. A 128-bit wide memory interface and a unique accelerator

architecture enable 32-bit code execution at maximum clock rate. For critical code size

applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with

minimal performance penalty.

With their compact 64-pin package, low power consumption, various 32-bit timers,

4-channel 10-bit ADC, two advanced CAN channels, PWM channels and 46 fast GPIO

lines with up to nine external interrupt pins these microcontrollers are particularly suitable

for automotive and industrial control applications, as well as medical systems and

fault-tolerant maintenance buses. With a wide range of additional serial communications

interfaces, they are also suited for communication gateways and protocol converters as

well as many other general-purpose applications.

Remark:

Throughout the data sheet, the term LPC2109/2119/2129 will apply to devices

with and without the /00 or /01 suffixes. The /00 or the /01 suffix will be used to

differentiate from other devices only when necessary.

2. Features and benefits

2.1 Key features brought by LPC2109/2119/2129/01 devices



Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original device.

They also allow for a port pin to be read at any time regardless of its function.



Dedicated result registers for ADC(s) reduce interrupt overhead. The ADC pads are

5 V tolerant when configured for digital I/O function(s).



UART0/1 include fractional baud rate generator, auto-bauding capabilities and

handshake flow-control fully implemented in hardware.



Buffered SSP serial controller supporting SPI, 4-wire SSI, and Microwire formats.



SPI programmable data length and master mode enhancement.



Diversified Code Read Protection (CRP) enables different security levels to be

implemented. This feature is available in LPC2109/2119/2129/00 devices as well.



General purpose timers can operate as external event counters.

2.2 Key features common for all devices



16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package.



8/16 kB on-chip SRAM.

NXP Semiconductors

LPC2109/2119/2129

Single-chip 16/32-bit microcontrollers



64/128/256 kB on-chip flash program memory. 128-bit wide interface/accelerator

enables high speed 60 MHz operation.



In-System Programming (ISP) and In-Application Programming (IAP) via on-chip

bootloader software. Flash programming takes 1 ms per 512 B line. Single sector or

full chip erase takes 400 ms.



EmbeddedICE-RT interface enables breakpoints and watch points. Interrupt service

routines can continue to execute while the foreground task is debugged with the

on-chip RealMonitor software.



Embedded Trace Macrocell (ETM) enables non-intrusive high speed real-time tracing

of instruction execution.



Two interconnected CAN interfaces (one for LPC2109) with advanced acceptance

filters.



Four-channel 10-bit A/D converter with conversion time as low as 2.44

s.



Multiple serial interfaces including two UARTs (16C550), Fast I

2

C-bus (400 kbit/s) and

two SPIs.



60 MHz maximum CPU clock available from programmable on-chip Phase-Locked

Loop with settling time of 100

s.



Vectored Interrupt Controller with configurable priorities and vector addresses.



Two 32-bit timers (with four capture and four compare channels), PWM unit (six

outputs), Real-Time Clock (RTC) and watchdog.



Up to forty-six 5 V tolerant general purpose I/O pins. Up to nine edge or level sensitive

external interrupt pins available.



On-chip crystal oscillator with an operating range of 1 MHz to 30 MHz.



Two low power modes, Idle and Power-down.



Processor wake-up from Power-down mode via external interrupt.



Individual enable/disable of peripheral functions for power optimization.



Dual power supply:



CPU operating voltage range of 1.65 V to 1.95 V (1.8 V



0.15 V).



I/O power supply range of 3.0 V to 3.6 V (3.3 V



10 %) with 5 V tolerant I/O pads.

3. Ordering information

Table 1.

Ordering information

Package

Name

LPC2109FBD64/01

LPC2119FBD64/01

LPC2129FBD64/01

LQFP64

Description

plastic low profile quad flat package; 64 leads;

body 10



10



1.4 mm

plastic low profile quad flat package; 64 leads;

body 10



10



1.4 mm

plastic low profile quad flat package; 64 leads;

body 10



10



1.4 mm

Version

SOT314-2

Type number

LPC2109_2119_2129

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 14 June 2011

2 of 46

NXP Semiconductors

LPC2109/2119/2129

Single-chip 16/32-bit microcontrollers

3.1 Ordering options

Table 2.

Ordering options

Flash

memory

RAM

CAN

Fast GPIO/ Temperature range

SSP/

Enhanced

UART, ADC,

Timer

yes

40 C

to +85

C

40 C

to +85

C

40 C

to +85

C

Type number

LPC2109FBD64/01 64 kB

LPC2119FBD64/01

128 kB

LPC2129FBD64/01 256 kB

8 kB

16 kB

1 channel

2 channels

LPC2109_2119_2129

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 14 June 2011

3 of 46

NXP Semiconductors

LPC2109/2119/2129

Single-chip 16/32-bit microcontrollers

4. Block diagram

TMS

(2)

TDI

(2)

RTCK

TRST

(2)

TCK

(2)

TDO

(2)

XTAL2

XTAL1

RESET

LPC2109

LPC2119

LPC2129

P0[30:27],

P0[25:0]

P1[31:16]

TEST/DEBUG

INTERFACE

EMULATION TRACE

MODULE

PLL

system

clock

SYSTEM

FUNCTIONS

VECTORED

INTERRUPT

CONTROLLER

ARM7TDMI-S

HIGH-SPEED

GPI/O

(4)

46 PINS TOTAL

AHB BRIDGE

V

DD(3V3)

V

DD(1V8)

V

SS

ARM7 LOCAL BUS

AMBA Advanced High-performance

Bus (AHB)

INTERNAL

SRAM

CONTROLLER

INTERNAL

FLASH

CONTROLLER

AHB TO APB

BRIDGE

APB

DIVIDER

AHB

DECODER

SCL

(1)

SDA

(1)

SCK1

(1)

8/16 kB

SRAM

64/128/256 kB

FLASH

I

2

C-BUS SERIAL

INTERFACE

EINT[3:0]

(1)

EXTERNAL

INTERRUPTS

SPI1/SSP

(4)

SERIAL

INTERFACE

MOSI1

(1)

MISO1

(1)

SSEL1

(1)

SCK0

(1)

4

×

CAP0

(1)

4

×

CAP1

(1)

4

×

MAT0

(1)

4

×

MAT1

(1)

CAPTURE/

COMPARE

TIMER 0/TIMER 1

SPI0 SERIAL

INTERFACE

MOSI0

(1)

MISO0

(1)

SSEL0

(1)

AIN[3:0]

(1)

A/D CONVERTER

UART0/UART1

TXD[1:0]

(1)

RXD[1:0]

(1)

P0[30:27],

P0[25:0]

P1[31:16]

GENERAL

PURPOSE I/O

DSR1

(1)

, CTS1

(1)

,

RTS1

(1)

, DTR1

(1)

,

DCD1

(1)

, RI1

(1)

WATCHDOG

TIMER

PWM[6:1]

(1)

PWM0

SYSTEM

CONTROL

RD[2:1]

(1)

TD[2:1]

(1)

CAN INTERFACE 1 AND 2

ACCEPTANCE FILTERS

(3)

REAL-TIME CLOCK

002aad172

(1) Shared with GPIO.

(2) When test/debug interface is used, GPIO/other functions sharing these pins are not available.

(3) Only 1 for LPC2109.

(4) SSP interface and high-speed GPIO are available on LPC2109/01, LPC2119/01, and LPC2129/01 only.

Fig 1. Block diagram

LPC2109_2119_2129

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 14 June 2011

4 of 46

NXP Semiconductors

LPC2109/2119/2129

Single-chip 16/32-bit microcontrollers

5. Pinning information

5.1 Pinning

54 P0[19]/MAT1[2]/MOSI1/CAP1[2]

53 P0[18]/CAP1[3]/MISO1/MAT1[3]

55 P0[20]/MAT1[3]/SSEL1/EINT3

64 P1[27]/TDO

52 P1[30]/TMS

56 P1[29]/TCK

60 P1[28]/TDI

63 V

DDA(1V8)

58 V

SSA(PLL)

51 V

DD(3V3)

P0[21]/PWM5/CAP1[3]

P0[22]/CAP0[0]/MAT0[0]

P0[23]/RD2

(1)

P1[19]/TRACEPKT3

P0[24]/TD2

(1)

V

SS

V

DDA(3V3)

P1[18]/TRACEPKT2

P0[25]/RD1

1

2

3

4

5

6

7

8

9

49 V

DD(1V8)

48 P1[20]/TRACESYNC

47 P0[17]/CAP1[2]/SCK1/MAT1[2]

46 P0[16]/EINT0/MAT0[2]/CAP0[2]

45 P0[15]/RI1/EINT2

44 P1[21]/PIPESTAT0

43 V

DD(3V3)

42 V

SS

41 P0[14]/DCD1/EINT1

40 P1[22]/PIPESTAT1

39 P0[13]/DTR1/MAT1[1]

38 P0[12]/DSR1/MAT1[0]

37 P0[11]/CTS1/CAP1[1]

36 P1[23]/PIPESTAT2

35 P0[10]/RTS1/CAP1[0]

34 P0[9]/RXD1/PWM6/EINT3

33 P0[8]/TXD1/PWM4

P1[24]/TRACECLK 32

002aad173

57 RESET

62 XTAL1

61 XTAL2

59 V

SSA

LPC2109

LPC2119

LPC2129

(2)

TD1 10

P0[27]/AIN0/CAP0[1]/MAT0[1] 11

P1[17]/TRACEPKT1 12

P0[28]/AIN1/CAP0[2]/MAT0[2] 13

P0[29]/AIN2/CAP0[3]/MAT0[3] 14

P0[30]/AIN3/EINT3/CAP0[0] 15

P1[16]/TRACEPKT0 16

V

DD(1V8)

17

V

SS

18

P0[0]/TXD0/PWM1 19

P1[31]/TRST 20

P0[1]/RXD0/PWM3/EINT0 21

P0[2]/SCL/CAP0[0] 22

V

DD(3V3)

23

P1[26]/RTCK 24

V

SS

25

P0[3]/SDA/MAT0[0]/EINT1 26

P0[4]/SCK0/CAP0[1] 27

P1[25]/EXTIN0 28

P0[5]/MISO0/MAT0[1] 29

P0[6]/MOSI0/CAP0[2] 30

(1) No TD2 and RD2 for LPC2109.

(2) Pin configuration is identical for devices with and without /00 and /01 suffixes.

Fig 2. Pin configuration

LPC2109_2119_2129

All information provided in this document is subject to legal disclaimers.

P0[7]/SSEL0/PWM2/EINT2 31

50 V

SS

Product data sheet

Rev. 7 — 14 June 2011

5 of 46

Parameter Name	Attribute value
Number of functions	1
Number of terminals	64
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	1.95 V
Minimum supply/operating voltage	1.65 V
Rated supply voltage	1.8 V
External data bus width	0.0
Number of input and output buses	46
Line speed	60 MHz
Processing package description	10 × 10 MM, 1.40 MM HEIGHT, Plastic, MS-026, SOT314-2, LQFP-64
Lead-free	Yes
EU RoHS regulations	Yes
China RoHS regulations	Yes
state	DISCONTINUED
packaging shape	SQUARE
Package Size	FLATPACK, LOW PROFILE, FINE PITCH
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.5000 mm
terminal coating	tin
Terminal location	Four
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
ADC channel	Yes
Address bus width	0.0
Number of digits	32
Maximum FCLK clock frequency	50 MHz
Microprocessor type	Reduced Instruction Set Microcontroller
PWM channel	Yes
ROM programming	FLASH

	LPC2109FBD64	LPC2109	LPC2119FBD01	LPC2129FBD64	LPC2109_11	LPC2129FBD01	LPC2109FBD01
Description	32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64	32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64	32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64	32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64	32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64	32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64	32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64
Number of terminals	64	64	64	64	64	64	64
Maximum operating temperature	85 Cel	85 Cel	85 Cel	85 °C	85 Cel	85 Cel	85 Cel
Minimum operating temperature	-40 Cel	-40 Cel	-40 Cel	-40 °C	-40 Cel	-40 Cel	-40 Cel
External data bus width	0.0	0.0	0.0	-	0.0	0.0	0.0
surface mount	Yes	Yes	Yes	YES	Yes	Yes	Yes
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	Four	Four	Four	QUAD	Four	Four	Four
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Address bus width	0.0	0.0	0.0	-	0.0	0.0	0.0
PWM channel	Yes	Yes	Yes	YES	Yes	Yes	Yes
Number of functions	1	1	1	-	1	1	1
Maximum supply/operating voltage	1.95 V	1.95 V	1.95 V	-	1.95 V	1.95 V	1.95 V
Minimum supply/operating voltage	1.65 V	1.65 V	1.65 V	-	1.65 V	1.65 V	1.65 V
Rated supply voltage	1.8 V	1.8 V	1.8 V	-	1.8 V	1.8 V	1.8 V
Number of input and output buses	46	46	46	-	46	46	46
Line speed	60 MHz	60 MHz	60 MHz	-	60 MHz	60 MHz	60 MHz
Processing package description	10 × 10 MM, 1.40 MM HEIGHT, Plastic, MS-026, SOT314-2, LQFP-64	10 × 10 MM, 1.40 MM HEIGHT, Plastic, MS-026, SOT314-2, LQFP-64	10 × 10 MM, 1.40 MM HEIGHT, Plastic, MS-026, SOT314-2, LQFP-64	-	10 × 10 MM, 1.40 MM HEIGHT, Plastic, MS-026, SOT314-2, LQFP-64	10 × 10 MM, 1.40 MM HEIGHT, Plastic, MS-026, SOT314-2, LQFP-64	10 × 10 MM, 1.40 MM HEIGHT, Plastic, MS-026, SOT314-2, LQFP-64
Lead-free	Yes	Yes	Yes	-	Yes	Yes	Yes
EU RoHS regulations	Yes	Yes	Yes	-	Yes	Yes	Yes
China RoHS regulations	Yes	Yes	Yes	-	Yes	Yes	Yes
state	DISCONTINUED	DISCONTINUED	DISCONTINUED	-	DISCONTINUED	DISCONTINUED	DISCONTINUED
packaging shape	SQUARE	SQUARE	SQUARE	-	SQUARE	SQUARE	SQUARE
Package Size	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	-	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Terminal spacing	0.5000 mm	0.5000 mm	0.5000 mm	-	0.5000 mm	0.5000 mm	0.5000 mm
terminal coating	tin	tin	tin	-	tin	tin	tin
Packaging Materials	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	-	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy
ADC channel	Yes	Yes	Yes	-	Yes	Yes	Yes
Number of digits	32	32	32	-	32	32	32
Maximum FCLK clock frequency	50 MHz	50 MHz	50 MHz	-	50 MHz	50 MHz	50 MHz
Microprocessor type	Reduced Instruction Set Microcontroller	Reduced Instruction Set Microcontroller	Reduced Instruction Set Microcontroller	-	Reduced Instruction Set Microcontroller	Reduced Instruction Set Microcontroller	Reduced Instruction Set Microcontroller
ROM programming	FLASH	FLASH	FLASH	-	FLASH	FLASH	FLASH

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