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SKCD121C120I3

Description
CAL-DIODE
CategoryDiscrete semiconductor    diode   
File Size92KB,3 Pages
ManufacturerSEMIKRON
Websitehttp://www.semikron.com
Environmental Compliance
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SKCD121C120I3 Overview

CAL-DIODE

SKCD121C120I3 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeWAFER
package instruction11 X 11 MM, WAFER-1
Contacts1
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresFREE WHEELING DIODE
applicationSOFT RECOVERY
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)2.3 V
JESD-30 codeS-XUUC-N1
JESD-609 codee3/e4
Maximum non-repetitive peak forward current1660 A
Number of components1
Phase1
Number of terminals1
Maximum operating temperature150 °C
Minimum operating temperature-40 °C
Maximum output current120 A
Package body materialUNSPECIFIED
Package shapeSQUARE
Package formUNCASED CHIP
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum repetitive peak reverse voltage1200 V
surface mountYES
Terminal surfaceTIN/SILVER
Terminal formNO LEAD
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
SKCD 121 C 120 I3
Absolute Maximum Ratings
Symbol
V
RRM
I
F(AV)
I
FSM
T
jmax
Conditions
T
j
= 25 °C, I
R
= 0.5 mA
T
s
= 80 °C, T
j
= 150 °C
10 ms
sin 180°
T
j
= 25 °C
T
j
= 150 °C
Values
1200
120
1660
150
Unit
V
A
A
A
°C
CAL-DIODE
I
F
= 150 A
V
RRM
= 1200 V
Size: 11 mm x 11 mm
SKCD 121 C 120 I3
Electrical Characteristics
Symbol
i
2
t
I
R
V
F
V
(TO)
r
T
Conditions
T
j
= 150 °C, 10 ms, sin 180°
T
j
= 25 °C, V
RRM
= 1200 V
T
j
= 125 °C, V
RRM
= 1200 V
T
j
= 25 °C, I
F
= 155 A
T
j
= 125 °C, I
F
= 155 A
T
j
= 125 °C
T
j
= 125 °C
min.
typ.
max.
Unit
A
2
s
0.50
10.00
2.00
1.79
1.18
3.8
2.50
2.30
mA
mA
V
V
V
mΩ
Features
• low forward voltage drop combined
with a low temperature dependence
• easy paralleling due to a small forward
voltage spread
• very soft recovery behavior
• small switching losses
• high ruggedness
• compatible to thick wire bonding
• compatible to all standard solder
processes
Dynamic Characteristics
Symbol
t
rr
t
rr
Q
rr
Q
rr
I
rrm
I
rrm
Conditions
T
j
= 25 °C, , 600 V,
T
j
= 125 °C, , 600 V,
T
j
= 25 °C, , 600 V,
T
j
= 125 °C, , 600 V,
T
j
= 25 °C, , 600 V,
T
j
= 125 °C, , 600 V,
min.
typ.
max.
Unit
µs
ns
µC
µC
A
A
Typical Applications*
• freewheeling diode for IGBT
• particularly suitable for frequencies
>
8
kHz
Thermal Characteristics
Symbol
T
j
T
stg
T
solder
T
solder
R
th(j-s)
10 min.
5 min.
sold. on 0,38 mm DCB, reference point
on copper heatsink close to the chip
0.24
Conditions
min.
-40
-40
typ.
max.
150
150
250
320
Unit
°C
°C
°C
°C
K/W
Mechanical Characteristics
Symbol
Raster
size
Area total
Anode
Cathode
Wire bond
Package
Chips /
Package
Conditions
Values
11 x 11
121
bondable (Al)
solderable (Ag/Ni)
Al, diameter
500 µm
wafer frame
76 (5" Wafer)
Unit
mm
2
mm
2
pcs
SKCD
© by SEMIKRON
Rev. 0 – 18.02.2010
1

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