SKCD 81 C 170 I HD
Absolute Maximum Ratings
Symbol
V
RRM
I
F(AV)
I
FSM
T
jmax
Conditions
T
j
= 25 °C, I
R
= 0.1 mA
T
s
= 80 °C, T
j
= 150 °C
10 ms
sin 180°
T
j
= 25 °C
T
j
= 150 °C
Values
1700
85
1370
1070
150
Unit
V
A
A
A
°C
CAL-DIODE
I
F
= 150 A
V
RRM
= 1700 V
Size: 9 mm x 9 mm
SKCD 81 C 170 I HD
Electrical Characteristics
Symbol
i
2
t
I
R
V
F
V
(TO)
r
T
Conditions
T
j
= 150 °C, 10 ms, sin 180°
T
j
= 25 °C, V
RRM
= 1700 V
T
j
= 125 °C, V
RRM
= 1700 V
T
j
= 25 °C, I
F
= 150 A
T
j
= 125 °C, I
F
= 150 A
T
j
= 125 °C
T
j
= 125 °C
min.
typ.
max.
5720
0.10
Unit
A
2
s
mA
mA
V
V
V
mΩ
1.73
1.78
1.03
5.0
2.02
2.05
Features
• high current density
• easy paralleling due to a small forward
voltage spread
• positive temperature coefficient
• very soft recovery behavior
• small switching losses
• high ruggedness
• compatible to thick wire bonding
• compatible to standard solder
processes
Dynamic Characteristics
Symbol
t
rr
t
rr
Q
rr
Q
rr
I
rrm
I
rrm
Conditions
T
j
= 25 °C, 150 A, 1200 V, 1125 A/µs
T
j
= 125 °C, 150 A, 1200 V, 1125 A/µs
T
j
= 25 °C, 150 A, 1200 V, 1125 A/µs
T
j
= 125 °C, 150 A, 1200 V, 1125 A/µs
T
j
= 25 °C, 150 A, 1200 V, 1125 A/µs
T
j
= 125 °C, 150 A, 1200 V, 1125 A/µs
min.
typ.
max.
Unit
µs
ns
25
44
83
102
µC
µC
A
A
Typical Applications*
• freewheeling diode for IGBT
• particularly suitable for frequencies < 8
kHz
Thermal Characteristics
Symbol
T
j
T
stg
T
solder
T
solder
R
th(j-s)
10 min.
5 min.
sold. on 0,38 mm DCB, reference point
on copper heatsink close to the chip
0.4
Conditions
min.
-40
-40
typ.
max.
150
150
250
320
Unit
°C
°C
°C
°C
K/W
Mechanical Characteristics
Symbol
Raster
size
Area total
Anode
Cathode
Wire bond
Package
Chips /
Package
Conditions
Values
9x9
81
bondable (Al)
solderable (Ag/Ni)
Al, diameter
≤
500 µm
wafer frame
116 (5" Wafer)
Unit
mm
2
mm
2
pcs
SKCD
© by SEMIKRON
Rev. 1 – 18.02.2010
1
SKCD 81 C 170 I HD
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.
2
Rev. 1 – 18.02.2010
© by SEMIKRON
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