SKM300GA12V
Absolute Maximum Ratings
Symbol
IGBT
V
CES
I
C
I
Cnom
I
CRM
I
CRM
= 3xI
Cnom
V
CC
= 720 V
V
GE
≤
20 V
V
CES
≤
1200 V
T
j
= 25 °C
T
j
= 175 °C
T
c
= 25 °C
T
c
= 80 °C
1200
420
319
300
900
-20 ... 20
T
j
= 125 °C
10
-40 ... 175
T
c
= 25 °C
T
c
= 80 °C
353
264
300
I
FRM
= 3xI
Fnom
t
p
= 10 ms, sin 180°, T
j
= 25 °C
900
1548
-40 ... 175
T
terminal
= 80 °C
AC sinus 50Hz, t = 1 min
500
-40 ... 125
4000
V
A
A
A
A
V
µs
°C
A
A
A
A
A
°C
A
°C
V
Conditions
Values
Unit
SEMITRANS 4
®
V
GES
t
psc
T
j
I
F
I
Fnom
Inverse diode
SKM300GA12V
Features
• V-IGBT = 6. Generation Trench V-IGBT
(Fuji)
• CAL4 = Soft switching 4. Generation
CAL-diode
• Isolated copper baseplate using DBC
technology (Direct Copper Bonding)
• UL recognized, file no. E63532
• Increased power cycling capability
• With integrated gate resistor
• Low switching losses at high di/dt
T
j
= 175 °C
I
FRM
I
FSM
T
j
Module
I
t(RMS)
T
stg
V
isol
Characteristics
Symbol
IGBT
V
CE(sat)
V
CE0
r
CE
V
GE(th)
I
CES
C
ies
C
oes
C
res
Q
G
R
Gint
t
d(on)
t
r
E
on
t
d(off)
t
f
E
off
R
th(j-c)
Typical Applications*
•
•
•
•
AC inverter drives
UPS
Electronic welders
Switched reluctance motor
Conditions
I
C
= 300 A
V
GE
= 15 V
chiplevel
T
j
= 25 °C
T
j
= 150 °C
T
j
= 25 °C
T
j
= 150 °C
V
GE
= 15 V
V
GE
= 0 V
V
CE
= 1200 V
V
CE
= 25 V
V
GE
= 0 V
V
GE
= - 8 V...+ 15 V
V
CC
= 600 V
I
C
= 300 A
V
GE
= ±15 V
R
G on
= 2.5
R
G off
= 2.5
di/dt
on
= 7700 A/µs
di/dt
off
= 3500 A/µs
du/dt
off
= 7500 V/
µs
per IGBT
T
j
= 150 °C
T
j
= 150 °C
T
j
= 150 °C
T
j
= 150 °C
T
j
= 150 °C
T
j
= 150 °C
T
j
= 25 °C
T
j
= 150 °C
min.
typ.
1.85
2.25
0.94
0.88
3.03
4.57
max.
2.30
2.55
1.04
0.98
4.2
5.23
6.5
0.3
Unit
V
V
V
V
m
m
V
mA
mA
nF
nF
nF
nC
ns
ns
mJ
ns
ns
mJ
Remarks
• Case temperature limited to
T
c
= 125°C max, recomm.
T
op
= -40 ... +150°C, product
rel. results valid for T
j
= 150°
V
GE
=V
CE
, I
C
= 12 mA
T
j
= 25 °C
T
j
= 150 °C
f = 1 MHz
f = 1 MHz
f = 1 MHz
5.5
6
0.1
18
1.77
1.768
3310
2.5
340
48
23
576
69
33
0.11
K/W
GA
© by SEMIKRON
Rev. 2 – 23.03.2011
1
SKM300GA12V
Characteristics
Symbol
Conditions
T
j
= 25 °C
T
j
= 150 °C
T
j
= 25 °C
T
j
= 150 °C
r
F
T
j
= 25 °C
I
F
= 300 A
T
j
= 150 °C
di/dt
off
= 8500 A/µs T = 150 °C
j
V
GE
= ±15 V
T
j
= 150 °C
V
CC
= 600 V
per diode
T
j
= 150 °C
min.
typ.
2.17
2.11
1.3
0.9
2.9
4.0
350
45
21
max.
2.49
2.42
1.5
1.1
3.3
4.4
Unit
V
V
V
V
m
m
A
µC
mJ
Inverse diode
V
F
= V
EC
I
F
= 300 A
V
GE
= 0 V
chip
V
F0
SEMITRANS
®
4
I
RRM
Q
rr
E
rr
R
th(j-c)
Module
L
CE
R
CC'+EE'
0.17
15
20
K/W
nH
m
m
SKM300GA12V
Features
• V-IGBT = 6. Generation Trench V-IGBT
(Fuji)
• CAL4 = Soft switching 4. Generation
CAL-diode
• Isolated copper baseplate using DBC
technology (Direct Copper Bonding)
• UL recognized, file no. E63532
• Increased power cycling capability
• With integrated gate resistor
• Low switching losses at high di/dt
terminal-chip
per module
to heat sink M6
T
C
= 25 °C
T
C
= 125 °C
3
2.5
0.18
0.22
0.02
0.038
5
5
330
R
th(c-s)
M
s
M
t
w
K/W
Nm
Nm
Nm
g
to terminals M6,
M4
Typical Applications*
•
•
•
•
AC inverter drives
UPS
Electronic welders
Switched reluctance motor
Remarks
• Case temperature limited to
T
c
= 125°C max, recomm.
T
op
= -40 ... +150°C, product
rel. results valid for T
j
= 150°
GA
2
Rev. 2 – 23.03.2011
© by SEMIKRON
SKM300GA12V
Fig. 1: Typ. output characteristic, inclusive R
CC'+ EE'
Fig. 2: Rated current vs. temperature I
C
= f (T
C
)
Fig. 3: Typ. turn-on /-off energy = f (I
C
)
Fig. 4: Typ. turn-on /-off energy = f (R
G
)
Fig. 5: Typ. transfer characteristic
Fig. 6: Typ. gate charge characteristic
© by SEMIKRON
Rev. 2 – 23.03.2011
3
SKM300GA12V
Fig. 7: Typ. switching times vs. I
C
Fig. 8: Typ. switching times vs. gate resistor R
G
Fig. 9: Transient thermal impedance
Fig. 10: Typ. CAL diode forward charact., incl. R
CC'+EE'
Fig. 11: CAL diode peak reverse recovery current
Fig. 12: Typ. CAL diode peak reverse recovery charge
4
Rev. 2 – 23.03.2011
© by SEMIKRON
SKM300GA12V
SEMITRANS 4
GA
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
© by SEMIKRON
Rev. 2 – 23.03.2011
5
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