TSB12LV31WN datasheet, PDF - EEWORLD Datasheet

TSB12LV31WN: Description1 CHANNEL(S), 200Mbps, SERIAL COMM CONTROLLER, CQFP100, CERAMIC, QFP-100; CategoryThe embedded processor and controller Microcontrollers and processors; File Size123KB，49 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TSB12LV31WN Overview

1 CHANNEL(S), 200Mbps, SERIAL COMM CONTROLLER, CQFP100, CERAMIC, QFP-100

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	QFP
package instruction	QFP,
Contacts	100
Reach Compliance Code	unknown
Address bus width	8
boundary scan	NO
maximum clock frequency	50 MHz
Maximum data transfer rate	25 MBps
External data bus width	16
JESD-30 code	R-GQFP-G100
length	19.05 mm
low power mode	NO
Number of serial I/Os	1
Number of terminals	100
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Certification status	Not Qualified
Maximum seat height	4.07 mm
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
width	19.05 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

	TSB12LV31WN	TSB12LV31PZ
Description	1 CHANNEL(S), 200Mbps, SERIAL COMM CONTROLLER, CQFP100, CERAMIC, QFP-100	GPLynx - General Purpose 1394 3.3V Link Layer with 8/16 bit I/F, 200byte FIFOs w/ Isochronous Port 100-LQFP
Parts packaging code	QFP	QFP
package instruction	QFP,	LFQFP, QFP100,.63SQ,20
Contacts	100	100
Reach Compliance Code	unknown	not_compliant
Address bus width	8	8
boundary scan	NO	NO
maximum clock frequency	50 MHz	50 MHz
Maximum data transfer rate	25 MBps	25 MBps
External data bus width	16	16
JESD-30 code	R-GQFP-G100	S-PQFP-G100
length	19.05 mm	14 mm
low power mode	NO	NO
Number of serial I/Os	1	1
Number of terminals	100	100
Maximum operating temperature	70 °C	70 °C
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	QFP	LFQFP
Package shape	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified
Maximum seat height	4.07 mm	1.6 mm
Maximum supply voltage	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.5 mm
Terminal location	QUAD	QUAD
width	19.05 mm	14 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

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