SKYPER32RUL datasheet, PDF - EEWORLD Datasheet

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SKYPER32RUL: DescriptionIGBT; Categorysemiconductor Discrete semiconductor; File Size461KB，17 Pages; ManufacturerSEMIKRON; Websitehttp://www.semikron.com

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SKYPER32RUL Overview

IGBT

SKYPER32RUL Parametric

Parameter Name	Attribute value
state	ACTIVE
Transistor type	INSULATED GATE BIPOLAR

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SKYPER 32 R UL

Absolute Maximum Ratings

Symbol

Iout

PEAK

Iout

AVmax

max

Conditions

Supply voltage primary

Input signal voltage (HIGH)

Input signal voltage (LOW)

Output peak current

Output average current

Max. switching frequency

Collector emitter voltage sense across

the IGBT

Rate of rise and fall of voltage

secondary to primary side

Isolation test voltage input - output

(AC, rms, 2s)

Partial discharge extinction voltage,

rms, Q

10pC

Isolation test voltage output 1 - output

2 (AC, rms, 2s)

Minimum rating for external R

Gon

Minimum rating for external R

Goff

Max. rating for output charge per pulse

Operating temperature

Storage temperature

Values

Vs + 0.3

GND - 0.3

1700

4000

1500

1.5

2.5

-40 ... 85

Unit

kHz

kV/µs

µC

°C

SKYPER

IGBT Driver Core

SKYPER 32 R UL

Preliminary Data

dv/dt

isol IO

isolPD

isol12

Features

•

UL recognized according UL 508C

UL report reference E242581

Two output channels

Integrated potential free power supply

Under voltage protection

Drive interlock top / bottom

Dynamic short cirucit protection

Shut down input

Failure management

IEC 60068-1 (climate) 40/085/56, no

condensation and no dripping water

permitted, non-corrosive, climate class

3K3 acc. EN60721

Gon min

Goff min

out/pulse

stg

Characteristics

Symbol

IT+

IT-

Conditions

Supply voltage primary side

Supply current primary (no load)

Supply current primary side (max.)

Input signal voltage on / off

Input treshold voltage HIGH

Input threshold voltage (LOW)

Input resistance (switching/HALT

signal)

Turn on output voltage

Turn off output voltage

Asic system switching frequency

Input-output turn-on propagation time

Input-output turn-off propagation time

Error input-output propagation time

Top-Bot interlock dead time

Coupling capacitance prim sec

min.

14.4

typ.

max.

15.6

450

Unit

Typical Applications*

• Driver for IGBT modules in bridge

circuits in industrial application

• DC bus voltage up to 1200V

15 / 0

12.3

4.6

-7

1.1

5.4

4.3

7.9

MHz

µs

Footnotes

CE:

With external high voltage diode

isolIO/

isol12

: Isolation test is not performed

as a series test at SEMIKRON and must be

performed by the user

isolPD

: According to VDE 0110-20

out/pulse

can be expanded to 6,3µQ with

boost capacitors

Isolation coordination in compliance with

EN50178 PD2

Operating temperature is real ambient

temperature around the driver core

Degree of protection: IP00

G(on)

G(off)

ASIC

d(on)IO

d(off)IO

d(err)

pERRRESET

Error reset time

MTBF

Mean Time Between Failure Ta = 40°C

2.5

This is an electrostatic discharge sensitive device (ESDS), international standard IEC

60747-1, Chapter IX

* The specifications of our components may not be considered as an assurance of component

characteristics. Components have to be tested for the respective application. Adjustments

may be necessary. The use of SEMIKRON products in life support appliances and systems is

subject to prior specification and written approval by SEMIKRON. We therefore strongly

recommend prior consultation of our personal.

Driver Core

Rev. 0 – 11.08.2010

SKYPER

32 R UL

Technical Explanations

Revision

Status:

Prepared by:

Johannes Krapp

Related Documents:

title:

Data Sheet SKYPER 32 R UL

This Technical Explanation is valid for the following parts:

part number:

date code (YYWW):

L6100104

≥

1030

SKYPER

32 R UL

Content

Application and Handling Instructions .................................................................................................................... 2

Further application support ..................................................................................................................................... 2

General Description ................................................................................................................................................ 2

Features of SKYPER 32 R UL................................................................................................................................ 2

UL specified remarks .............................................................................................................................................. 3

Block diagram ......................................................................................................................................................... 3

Dimensions ............................................................................................................................................................. 3

PIN Array – Primary Side........................................................................................................................................ 4

PIN Array – Secondary Side................................................................................................................................... 5

Driver Performance................................................................................................................................................. 6

Insulation................................................................................................................................................................. 6

Isolation Test Voltage ............................................................................................................................................. 7

Auxiliary Power Supply ........................................................................................................................................... 7

Under Voltage Protection of driver power supply (UVP) ........................................................................................ 8

Input Signals ........................................................................................................................................................... 8

Short Pulse Suppression (SPS) ............................................................................................................................. 8

Failure Management............................................................................................................................................... 9

Shut Down Input (SDI)............................................................................................................................................ 9

Dead Time generation (Interlock TOP / BOT) (DT).............................................................................................. 10

Dynamic Short Circuit Protection by V

CEsat

monitoring / de-saturation monitoring (DSCP).................................. 10

Adjustment of DSCP............................................................................................................................................. 11

High Voltage Diode for DSCP............................................................................................................................... 12

Gate resistors ....................................................................................................................................................... 12

External Boost Capacitors (BC)............................................................................................................................ 13

Application Example ............................................................................................................................................. 13

Mounting Notes..................................................................................................................................................... 14

Environmental Conditions..................................................................................................................................... 14

Marking ................................................................................................................................................................. 15

Rev 0 – 11.08.2010

SKYPER

32 R UL

Please note:

Unless otherwise specified, all values in this technical explanation are typical values. Typical values are the average values expected in

large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating

parameters should be validated by user’s technical experts for each application.

Application and Handling Instructions

Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,

the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any

synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be

short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements

apply to MOSFET- and IGBT-modules.

Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-

snubbers between main terminals for PLUS and MINUS of the power module.

When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current

in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and

the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case

temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions,

short-circuit testing may be done, starting again with low collector voltage.

It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.

Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.

The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V

+0,3V or below -0,3V may destroy

these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.

The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the

driver leads should be twisted.

Further application support

Latest information is available at

http://www.semikron.com.

For design support please read the SEMIKRON Application

Manual Power Modules available at

http://www.semikron.com.

General Description

The SKYPER 32 core constitutes an interface between IGBT modules and the controller. The driver is developed according

to the requirements of UL standard. This core is a half bridge driver. Basic functions for driving, potential separation and

protection are integrated in the driver. Thus it can be used to build up a driver solution for IGBT modules.

Features of SKYPER 32 R UL

Two output channels

Integrated potential free power supply for the secondary side

Short Pulse Suppression (SPS)

Under Voltage Protection (UVP)

Drive interlock (dead time) top / bottom (DT)

Dynamic Short Circuit Protection (DSCP) by V

monitoring and direct

switch off

Shut Down Input (SDI)

Failure Management

Expandable by External Boost Capacitors (BC)

DC bus voltage up to 1200V

SKYPER 32

Rev 0 – 11.08.2010

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