Microcontroller, 8-Bit, MROM, SPC700 CPU, 10MHz, CMOS, PQFP100, 14 X 20 MM, PLASTIC, QFP-100
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | SONY |
| Parts packaging code | QFP |
| package instruction | QFP, QFP100,.7X.9 |
| Contacts | 100 |
| Reach Compliance Code | unknown |
| Has ADC | YES |
| Other features | ALSO OPERATES AT 2.7 V MINIMUM SUPPLY |
| Address bus width | |
| bit size | 8 |
| CPU series | SPC700 |
| maximum clock frequency | 10 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PQFP-G100 |
| JESD-609 code | e6 |
| length | 20 mm |
| Number of I/O lines | 72 |
| Number of terminals | 100 |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | -20 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP100,.7X.9 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 704 |
| rom(word) | 24576 |
| ROM programmability | MROM |
| Maximum seat height | 3.1 mm |
| speed | 10 MHz |
| Maximum slew rate | 40 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Bismuth (Sn/Bi) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 10 |
| width | 14 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| CXP82224Q | CXP82220Q | |
|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, SPC700 CPU, 10MHz, CMOS, PQFP100, 14 X 20 MM, PLASTIC, QFP-100 | Microcontroller, 8-Bit, MROM, SPC700 CPU, 10MHz, CMOS, PQFP100, 14 X 20 MM, PLASTIC, QFP-100 |
| Is it lead-free? | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to |
| Maker | SONY | SONY |
| Parts packaging code | QFP | QFP |
| package instruction | QFP, QFP100,.7X.9 | QFP, QFP100,.7X.9 |
| Contacts | 100 | 100 |
| Reach Compliance Code | unknown | unknown |
| Has ADC | YES | YES |
| Other features | ALSO OPERATES AT 2.7 V MINIMUM SUPPLY | ALSO OPERATES AT 2.7 V MINIMUM SUPPLY |
| bit size | 8 | 8 |
| CPU series | SPC700 | SPC700 |
| maximum clock frequency | 10 MHz | 10 MHz |
| DAC channel | NO | NO |
| DMA channel | NO | NO |
| JESD-30 code | R-PQFP-G100 | R-PQFP-G100 |
| JESD-609 code | e6 | e6 |
| length | 20 mm | 20 mm |
| Number of I/O lines | 72 | 72 |
| Number of terminals | 100 | 100 |
| Maximum operating temperature | 75 °C | 75 °C |
| Minimum operating temperature | -20 °C | -20 °C |
| PWM channel | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QFP |
| Encapsulate equivalent code | QFP100,.7X.9 | QFP100,.7X.9 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK |
| Peak Reflow Temperature (Celsius) | 260 | 260 |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| RAM (bytes) | 704 | 704 |
| rom(word) | 24576 | 20480 |
| ROM programmability | MROM | MROM |
| Maximum seat height | 3.1 mm | 3.1 mm |
| speed | 10 MHz | 10 MHz |
| Maximum slew rate | 40 mA | 40 mA |
| Maximum supply voltage | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Bismuth (Sn/Bi) | Tin/Bismuth (Sn/Bi) |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm |
| Terminal location | QUAD | QUAD |
| Maximum time at peak reflow temperature | 10 | 10 |
| width | 14 mm | 14 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER |
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