PPC405GPR-3BB400Z datasheet, PDF

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PPC405GPR-3BB400Z: DescriptionRISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA456, 35 X 35 MM, PLASTIC, EBGA-456; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，57 Pages; ManufacturerApplied Micro Circuits (MACOM)

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PPC405GPR-3BB400Z Overview

RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA456, 35 X 35 MM, PLASTIC, EBGA-456

PPC405GPR-3BB400Z Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Applied Micro Circuits (MACOM)
Parts packaging code	BGA
package instruction	BGA, BGA456,26X26,50
Contacts	456
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	66.66 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B456
JESD-609 code	e0
length	35 mm
low power mode	YES
Number of terminals	456
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA456,26X26,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8,3.3 V
Certification status	Not Qualified
Maximum seat height	2.65 mm
speed	400 MHz
Maximum supply voltage	1.9 V
Minimum supply voltage	1.8 V
Nominal supply voltage	1.85 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	35 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Part Number 405GPr

Revision 2.05 – March 24, 2008

405GPr

Power PC 405GPr Embedded Processor

Features

• PowerPC

405 32-bit RISC processor core

operating up to 400MHz with 16KB I- and

D-caches

• Synchronous DRAM (SDRAM) interface operating

up to 133MHz

- 32-bit interface for non-ECC applications

- 40-bit interface serves 32 bits of data plus 8

check bits for ECC applications

• 4KB on-chip memory (OCM)

• External peripheral bus

- Flash ROM/Boot ROM interface

- Direct support for 8-, 16-, or 32-bit SRAM and

external peripherals

- Up to eight devices

- External Mastering supported

• DMA support for external peripherals, internal

UART and memory

- Scatter-gather chaining supported

- Four channels

• PCI Revision 2.2 compliant interface (32-bit, up to

66MHz)

Data Sheet

- Synchronous or asynchronous PCI Bus

interface

- Internal or external PCI Bus Arbiter

• Ethernet 10/100Mbps (full-duplex) support with

media independent interface (MII)

• Programmable interrupt controller supports 13

external and 19 internal edge triggered or level-

sensitive interrupts

• Programmable timers

• Two serial ports (16550 compatible UART)

• One IIC interface

• General purpose I/O (GPIO) available

• Supports JTAG for board level testing

• Internal processor local Bus (PLB) runs at SDRAM

interface frequency

• Supports PowerPC processor boot from PCI

memory

• Unique software-accessible 64-bit chip ID number

(ECID).

Description

Designed specifically to address embedded

applications, the PowerPC 405GPr (PPC405GPr)

provides a high-performance, low-power solution that

interfaces to a wide range of peripherals by

incorporating on-chip power management features

and lower power dissipation requirements.

This chip contains a high-performance RISC

processor core, SDRAM controller, PCI bus interface,

Ethernet interface, control for external ROM and

peripherals, DMA with scatter-gather support, serial

ports, IIC interface, and general purpose I/O.

Technology: CMOS SA-27E, 0.18

μm

(0.11

μm

eff

)

Package: 456-ball (35mm or 27mm) enhanced plastic

ball grid array (E-PBGA) in both leaded and lead-free

versions

Power (typical): 0.72W at 266MHz

AMCC

405GPr – Power PC 405GPr Embedded Processor

Revision 2.05 – March 24, 2008

Data Sheet

Contents

Ordering, PVR, and JTAG Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Address Map Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

On-Chip Memory (OCM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

PLB to PCI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

SDRAM Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

External Peripheral Bus Controller (EBC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

DMA Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

IIC Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

General Purpose IO (GPIO) Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Universal Interrupt Controller (UIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

10/100 Mbps Ethernet MAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Signal List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Spread Spectrum Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Strapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Tables

System Memory Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

DCR Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Signals Listed Alphabetically . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Signal Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Input Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Clocking Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Peripheral Interface Clock Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

I/O Specifications—Group 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

I/O Specifications—Group 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

PPC405GPr Legacy Mode Strapping Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

PPC405GPr New Mode Strapping Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

AMCC

PPC405GPR-3BB400Z Related Products

	PPC405GPR-3BB400Z	PPC405GPR-3BB400	PPC405GPR-3BB333Z	PPC405GPR-3BB333	PPC405GPR-3BB266	PPC405GPR-3BB266Z
Description	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA456, 35 X 35 MM, PLASTIC, EBGA-456	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA456, 35 X 35 MM, PLASTIC, EBGA-456	RISC Microprocessor, 32-Bit, 333.33MHz, CMOS, PBGA456, 35 X 35 MM, PLASTIC, EBGA-456	RISC Microprocessor, 32-Bit, 333.33MHz, CMOS, PBGA456, 35 X 35 MM, PLASTIC, EBGA-456	RISC Microprocessor, 32-Bit, 266.66MHz, CMOS, PBGA456, 35 X 35 MM, PLASTIC, EBGA-456	RISC Microprocessor, 32-Bit, 266.66MHz, CMOS, PBGA456, 35 X 35 MM, PLASTIC, EBGA-456
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Applied Micro Circuits (MACOM)	Applied Micro Circuits (MACOM)	Applied Micro Circuits (MACOM)	Applied Micro Circuits (MACOM)	Applied Micro Circuits (MACOM)	Applied Micro Circuits (MACOM)
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA, BGA456,26X26,50	BGA, BGA456,26X26,50	BGA, BGA456,26X26,50	BGA, BGA456,26X26,50	BGA, BGA456,26X26,50	BGA, BGA456,26X26,50
Contacts	456	456	456	456	456	456
Reach Compliance Code	compliant	compliant	compliant	compli	compli	compli
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address bus width	32	32	32	32	32	32
bit size	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES
maximum clock frequency	66.66 MHz	66.66 MHz	66.66 MHz	66.66 MHz	66.66 MHz	66.66 MHz
External data bus width	32	32	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B456	S-PBGA-B456	S-PBGA-B456	S-PBGA-B456	S-PBGA-B456	S-PBGA-B456
JESD-609 code	e0	e0	e0	e0	e0	e0
length	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm
low power mode	YES	YES	YES	YES	YES	YES
Number of terminals	456	456	456	456	456	456
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA456,26X26,50	BGA456,26X26,50	BGA456,26X26,50	BGA456,26X26,50	BGA456,26X26,50	BGA456,26X26,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.65 mm	2.65 mm	2.65 mm	2.65 mm	2.65 mm	2.65 mm
speed	400 MHz	400 MHz	333.33 MHz	333.33 MHz	266.66 MHz	266.66 MHz
Maximum supply voltage	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage	1.8 V	1.8 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage	1.85 V	1.85 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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