MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
IPAK
CASE 369D−01
ISSUE C
DATE 15 DEC 2010
SCALE 1:1
B
V
R
4
C
E
Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
H
J
K
R
S
V
Z
INCHES
MIN
MAX
0.235 0.245
0.250 0.265
0.086 0.094
0.027 0.035
0.018 0.023
0.037 0.045
0.090 BSC
0.034 0.040
0.018 0.023
0.350 0.380
0.180 0.215
0.025 0.040
0.035 0.050
0.155
−−−
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.46
0.58
0.94
1.14
2.29 BSC
0.87
1.01
0.46
0.58
8.89
9.65
4.45
5.45
0.63
1.01
0.89
1.27
3.93
−−−
S
−T−
SEATING
PLANE
A
1
2
3
K
F
D
G
3 PL
J
H
M
0.13 (0.005)
T
MARKING
DIAGRAMS
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
STYLE 5:
PIN 1. GATE
2. ANODE
3. CATHODE
4. ANODE
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
STYLE 6:
PIN 1. MT1
2. MT2
3. GATE
4. MT2
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
STYLE 7:
PIN 1. GATE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
STYLE 4:
PIN 1. CATHODE
2. ANODE
3. GATE
4. ANODE
Discrete
YWW
xxxxxxxx
Integrated
Circuits
xxxxx
ALYWW
x
xxxxxxxxx
A
lL
Y
WW
= Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON10528D
ON SEMICONDUCTOR STANDARD
REF TO JEDEC TO−251
http://onsemi.com
IPAK (DPAK INSERTION MOUNT)
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OF
XXX
2
©
Semiconductor Components Industries, LLC, 2002
October,
DESCRIPTION:
2002
−
Rev. 0
DOCUMENT NUMBER:
98AON10528D
PAGE 2 OF 2
ISSUE
O
A
B
C
REVISION
RELEASED FOR PRODUCTION. REQ. BY L. GAN
CHANGED STANDARD TO TO−251, WAS TO−252. REQ. BY J. BECHTOLD
REMOVED FOOTPRINT. REQ. BY J. LESLIE
CHANGED DESCRIPTION TO IPAK. REQ. BY J. JEONG.
DATE
24 SEP 2001
24 NOV 2003
03 DEC 2003
15 DEC 2010
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
©
Semiconductor Components Industries, LLC, 2010
December, 2010
−
Rev. 01C
Case Outline Number:
369D
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