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89H16T4BG2ZABX

Description
PCI Bus Controller, PBGA288, 23 X 23 MM, 1 MM PITCH, BGA-288
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size761KB,32 Pages
ManufacturerIDT (Integrated Device Technology)
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89H16T4BG2ZABX Overview

PCI Bus Controller, PBGA288, 23 X 23 MM, 1 MM PITCH, BGA-288

89H16T4BG2ZABX Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instruction23 X 23 MM, 1 MM PITCH, BGA-288
Contacts288
Reach Compliance Codenot_compliant
ECCN code3A001.A.3
Other featuresIT ALSO NEED 3.3V I/O NOMINAL SUPPLY
Address bus width
maximum clock frequency125 MHz
Drive interface standardsIEEE 1149.1AC; IEEE 1149.1
External data bus width
JESD-30 codeS-PBGA-B288
JESD-609 codee0
length23 mm
Humidity sensitivity level3
Number of terminals288
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA288,22X22,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)225
power supply1,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum slew rate968 mA
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width23 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
16-Lane 4-Port
Gen2 PCI Express® Switch
®
89HPES16T4BG2
Data Sheet
Advance Information*
Device Overview
The 89HPES16T4BG2 is a member of IDT’s PRECISE™ family of
PCI Express® switching solutions. The PES16T4BG2 is a 16-lane, 4-
port Gen2 peripheral chip that performs PCI Express Base switching
with a feature set optimized for high performance applications such as
servers, storage, and communications/networking. It provides connec-
tivity and switching functions between a PCI Express upstream port and
up to three downstream ports and supports switching between down-
stream ports.
Features
Block Diagram
4-Port Switch Core / 16 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 4)
(Port 6)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 32
©
2009 Integrated Device Technology, Inc
*Notice: The information in this document is subject to change without notice
July 1, 2009
Advance Information
High Performance PCI Express Switch
– Sixteen 5 Gbps Gen2 PCI Express lanes
– Four switch ports
• One x4 upstream port
• Three x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
On-Die Temperature Sensor
– Range of 0 to 127.5 degrees Celsius
– Three programmable temperature thresholds with over and
under temperature threshold alarms
– Automatic recording of maximum high or minimum low
temperature
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates sixteen 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)

89H16T4BG2ZABX Related Products

89H16T4BG2ZABX 89H16T4BG2ZABXG 89H16T4BG2ZABXG8 89H16T4BG2ZABX8
Description PCI Bus Controller, PBGA288, 23 X 23 MM, 1 MM PITCH, BGA-288 PCI Bus Controller, PBGA288, 23 X 23 MM, 1 MM PITCH, GREEN, BGA-288 Bus Controller, PBGA288 Bus Controller, PBGA288
Is it Rohs certified? incompatible conform to conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code not_compliant compliant compliant not_compliant
JESD-30 code S-PBGA-B288 S-PBGA-B288 S-PBGA-B288 S-PBGA-B288
JESD-609 code e0 e1 e1 e0
Humidity sensitivity level 3 3 3 3
Number of terminals 288 288 288 288
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA BGA BGA
Encapsulate equivalent code BGA288,22X22,40 BGA288,22X22,40 BGA288,22X22,40 BGA288,22X22,40
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY GRID ARRAY
power supply 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 968 mA 968 mA 968 mA 968 mA
surface mount YES YES YES YES
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM

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