Operating Temperature Range ......................... -40°C to +125°C
Storage Temperature Range ............................ -65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
5 SOT23
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
Thermal Resistance, Multilayer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
255.9°C/W
81°C/W
U6+1/U6+1A
21-0058
90-0175
N/A
80°C/W
115°C/W
80°C/W
K8SN+1
21-0078
90-0176
N/A
80°C/W
180°C/W
60°C/W
324.3°C/W
82°C/W
21-0057
90-0174
U5+1
6 SOT23
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
Thermal Resistance, Multilayer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
8 SOT23
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
Thermal Resistance, Multilayer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages.
Note that a “+”, “#”, or “-” in the package
code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on
package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated │
2
MAX6715A–MAX6729A/
MAX6797A
Electrical Characteristics
PARAMETER
Supply Voltage
Dual/Triple, Ultra-Low-Voltage, SOT23 μP
Supervisory Circuits
(V
CC1
= 0.8V to 5.5V, V
CC2
= 0.8V to 5.5V, GND = 0V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
= +25°C.) (Note 1)
SYMBOL
V
CC
I
CC1
Supply Current
I
CC2
CONDITIONS
V
CC1
< 5.5V all I/O connections open,
outputs not asserted
V
CC1
< 3.6V all I/O connections open,
outputs not asserted
V
CC2
< 3.6V all I/O connections open,
outputs not asserted
V
CC2
< 2.75V all I/O connections open,
outputs not asserted
L (falling)
M (falling)
T (falling)
S (falling)
V
CC1
Reset Threshold
V
TH1
R (falling)
Z (falling)
Y (falling)
W (falling)
V (falling)
T (falling)
S (falling)
R (falling)
Z (falling)
Y (falling)
W (falling)
V
CC2
Reset Threshold
V
TH2
V (falling)
I (falling)
H (falling)
G (falling)
F (falling)
E (falling)
D (falling)
4.500
4.250
3.000
2.850
2.550
2.250
2.125
1.620
1.530
3.000
2.850
2.550
2.250
2.125
1.620
1.530
1.350
1.275
1.080
1.020
0.810
0.765
MIN
0.8
15
10
4
3
4.625
4.375
3.075
2.925
2.625
2.313
2.188
1.665
1.575
3.075
2.925
2.625
2.313
2.188
1.665
1.575
1.388
1.313
1.110
1.050
0.833
0.788
TYP
MAX
5.5
39
28
11
9
4.750
4.500
3.150
3.000
2.700
2.375
2.250
1.710
1.620
3.150
3.000
2.700
2.375
2.250
1.710
1.620
1.425
1.350
1.140
1.080
0.855
0.810
V
V
UNITS
V
µA
www.maximintegrated.com
Maxim Integrated │ 3
MAX6715A–MAX6729A/
MAX6797A
Electrical Characteristics (continued)
PARAMETER
Reset Threshold Tempco
Reset Threshold Hysteresis
V
CC
to Reset Output Delay
SYMBOL
ΔV
TH
/°C
V
HYST
t
RD
Dual/Triple, Ultra-Low-Voltage, SOT23 μP
Supervisory Circuits
(V
CC1
= 0.8V to 5.5V, V
CC2
= 0.8V to 5.5V, GND = 0V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at
[i=s]This post was last edited by paulhyde on 2014-9-15 09:10[/i]After so many years of working on RF and MCU, I was actually stuck on this problem. At the beginning, the RF transceiver solution: the ...
Which expert can give me some advice?
The conditions are as follows
When a high level is input, there are 30kHZ pulses in and out. When the input turns to a low level, it calculates whether the number...
[align=left][color=rgb(0, 0, 0)][size=4]Lecturer:[/size][/color][/align][align=left][color=rgb(0, 0, 0)][size=4]Bao Zhen, Embedded Processor and Automotive Business Development Manager of Texas Instru...
[i=s] This post was last edited by qq849682862 on 2015-11-8 17:35[/i] In the past two days, I have been learning about FPGA UART transmission and reception. The results have been stuck on reception. T...
I would like to ask, when using the M5311 module for NB project, how is the communication encryption between the device and the ONENET platform done? I have read some materials and videos, but I can't...
Regarding the PHY construction of LWIP, the PHY chip used is LAN8720A, RMII mode. Regarding the hardware connection part, the Atomic board F407 is used, and the hardware connection is as follows: ...[Details]
introduction STM32 has many registers, which are difficult to remember, so the official packaged two sets of library functions. One is the standard library, but the official has not updated it on F7,...[Details]
Since the first draft of the 5G
NR standard was officially launched at
the end of 2017
, the
5G
commercialization process has taken a substantial step forward. From that moment on, mo...[Details]
Although it is early summer, the Chinese smartphone market is still in the cold winter, just like Beijing in April with snow. For mobile phone brands caught in the middle, the cold is even more bit...[Details]
As many companies listed with
the concept of
touch screen
begin to "transform and upgrade", the official voice of the TP industry is getting smaller and smaller. At the same time, the list o...[Details]
The photovoltaic inverter is the core equipment of the photovoltaic system. Its main function is to convert the direct current generated by the photovoltaic modules into alternating current that meets...[Details]
This example is mainly to familiarize yourself with the register configuration of Timer A and the configuration method of IAR. /*********************************************** Program function: re...[Details]
According to MEMS Consulting, single-chip radar system-on-chip (SoC) is becoming one of the most popular new sensors . Its widespread adoption in automobiles has greatly increased sales, thereby pr...[Details]
I have been working on a stm32 project recently and have been struggling with its startup method. I saw a good article and reposted it. The format of the original article is not very good, and there...[Details]
OSC_IN and OSC_OUT are external crystal pins by default. If you do not use an external crystal oscillator on the STM32, how to connect OSC_IN and OSC_OUT If you use the internal RC oscillator instead...[Details]
STM32 ADC multi-channel conversion Description: Use ADC to continuously collect 11 analog signals and transfer them to memory through DMA. ADC is configured to scan and continuously convert mode,...[Details]
1) ADC multi-channel acquisition: (Multi-channel acquisition must use scanning mode. In scanning mode, the channels of the rule group share a register, so DMA transmission must be used; to prevent da...[Details]
/*----------------------------------------------- Name: IIC protocol PCF8591 AD/DA conversion Content: Use DA input, digital tube display output digital quantity, LED display analog voltage size ...[Details]
Getting to the bottom of blockchain
Since last year, blockchain has become the hottest word in both the financial and non-financial circles. Some people use it as a gimmick to engage in va...[Details]