LMV225TLX/NOPB datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Wireless rf/communication> Telecom circuit> LMV225TLX/NOPB

LMV225TLX/NOPB: DescriptionIC TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA4, 1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4, Cellular Telephone Circuit; CategoryWireless rf/communication Telecom circuit; File Size1MB，28 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com; Environmental Compliance

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LMV225TLX/NOPB Overview

IC TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA4, 1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4, Cellular Telephone Circuit

LMV225TLX/NOPB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	National Semiconductor（TI ）
package instruction	VFBGA,
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-30 code	S-PBGA-B4
JESD-609 code	e1
length	1.014 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	4
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	0.675 mm
Nominal supply voltage	2.7 V
surface mount	YES
Telecom integrated circuit types	RF AND BASEBAND CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	1.014 mm

LMV225TLX/NOPB Related Products

	LMV225TLX/NOPB	LMV225SD/NOPB	LMV225SDX/NOPB	LMV225TL/NOPB
Description	IC TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA4, 1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4, Cellular Telephone Circuit	IC TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, DSO6, 2.20 X 2.50 MM, 0.80 MM HEIGHT, LEAD FREE, LLP-6, Cellular Telephone Circuit	IC TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, DSO6, 2.20 X 2.50 MM, 0.80 MM HEIGHT, LEAD FREE, LLP-6, Cellular Telephone Circuit	IC TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA4, 1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4, Cellular Telephone Circuit
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	VFBGA,	VSON,	VSON,	VFBGA,
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
JESD-30 code	S-PBGA-B4	R-XDSO-N6	R-XDSO-N6	S-PBGA-B4
JESD-609 code	e1	e3	e3	e1
length	1.014 mm	2.5 mm	2.5 mm	1.014 mm
Humidity sensitivity level	1	1	1	1
Number of functions	1	1	1	1
Number of terminals	4	6	6	4
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	VFBGA	VSON	VSON	VFBGA
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.675 mm	0.8 mm	0.8 mm	0.675 mm
Nominal supply voltage	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES	YES
Telecom integrated circuit types	RF AND BASEBAND CIRCUIT	RF AND BASEBAND CIRCUIT	RF AND BASEBAND CIRCUIT	RF AND BASEBAND CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	NO LEAD	NO LEAD	BALL
Terminal pitch	0.5 mm	0.65 mm	0.65 mm	0.5 mm
Terminal location	BOTTOM	DUAL	DUAL	BOTTOM
Maximum time at peak reflow temperature	40	NOT SPECIFIED	40	40
width	1.014 mm	2.2 mm	2.2 mm	1.014 mm

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