IC PULSE; RECTANGULAR, TIMER, PDSO8, 0.118 INCH, MINI, PLASTIC, SOIC-8, Analog Waveform Generation Function
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | National Semiconductor（TI ） |
| package instruction | TSSOP, TSSOP8,.19 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Analog Integrated Circuits - Other Types | PULSE; RECTANGULAR |
| JESD-30 code | S-PDSO-G8 |
| JESD-609 code | e3 |
| length | 3 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP8,.19 |
| Package shape | SQUARE |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.1 mm |
| Maximum supply voltage (Vsup) | 16 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 3 mm |
| LM555CMMX/NOPB | LM555CN/NOPB | LM555CMX/NOPB | LM555CM/NOPB | LM555CMM/NOPB | |
|---|---|---|---|---|---|
| Description | IC PULSE; RECTANGULAR, TIMER, PDSO8, 0.118 INCH, MINI, PLASTIC, SOIC-8, Analog Waveform Generation Function | IC PULSE; RECTANGULAR, TIMER, PDIP8, PLASTIC, DIP-8, Analog Waveform Generation Function | IC PULSE; RECTANGULAR, TIMER, PDSO8, SOIC-8, Analog Waveform Generation Function | IC PULSE; RECTANGULAR, TIMER, PDSO8, SOIC-8, Analog Waveform Generation Function | IC PULSE; RECTANGULAR, TIMER, PDSO8, 0.118 INCH, MINI, PLASTIC, SOIC-8, Analog Waveform Generation Function |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| package instruction | TSSOP, TSSOP8,.19 | DIP, DIP8,.3 | SOIC-8 | SOIC-8 | TSSOP, TSSOP8,.19 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Analog Integrated Circuits - Other Types | PULSE; RECTANGULAR | PULSE; RECTANGULAR | PULSE; RECTANGULAR | PULSE; RECTANGULAR | PULSE; RECTANGULAR |
| JESD-30 code | S-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 |
| length | 3 mm | 9.817 mm | 4.9 mm | 4.9 mm | 3 mm |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | DIP | SOP | SOP | TSSOP |
| Encapsulate equivalent code | TSSOP8,.19 | DIP8,.3 | SOP8,.25 | SOP8,.25 | TSSOP8,.19 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.1 mm | 5.08 mm | 1.75 mm | 1.75 mm | 1.1 mm |
| Maximum supply voltage (Vsup) | 16 V | 16 V | 16 V | 16 V | 16 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 | 40 |
| width | 3 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3 mm |
京公网安备 11010802033920号
EEWORLD
