FD100U06A5R datasheet, PDF - EEWORLD Datasheet

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FD100U06A5R: DescriptionRectifier Diode, 1 Phase, 1 Element, 600V V(RRM), Silicon, DIE-1; CategoryDiscrete semiconductor diode; File Size44KB，3 Pages; ManufacturerVishay; Websitehttp://www.vishay.com

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FD100U06A5R Overview

Rectifier Diode, 1 Phase, 1 Element, 600V V(RRM), Silicon, DIE-1

FD100U06A5R Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Vishay
Parts packaging code	DIE
package instruction	DIE-1
Contacts	1
Reach Compliance Code	unknown
ECCN code	EAR99
application	GENERAL PURPOSE
Configuration	SINGLE
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
Maximum forward voltage (VF)	1.9 V
JESD-30 code	O-XUUC-N1
Number of components	1
Phase	1
Number of terminals	1
Package body material	UNSPECIFIED
Package shape	ROUND
Package form	UNCASED CHIP
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	600 V
Maximum reverse recovery time	0.027 µs
surface mount	YES
Terminal form	NO LEAD
Terminal location	UPPER

FD100U06A5R Preview

Bulletin I - 0517J rev. C 03/07

FD100U06A5B

FRED Die in Wafer Form

100% Tested at Probe

Available in Tape and Reel (upon request),

Chip Pack, and Sawn on Film

Electrical Characteristics @ T

= 25°C (unless otherwise specified)

Parameter

RRM

Description

Maximum Forward Voltage

Minimum Reverse Breakdown Voltage

Max. Reverse Leakage Current

Typ. Reverse Recovery Time

Typ. Reverse Recovery Charge

Min

–––

600V

–––

Typ

–––

27ns

45ns

280nC

Max

1.9V

–––

50µA

–––

Test Conditions

= 25°C, I

= 8A

= 25°C, I

RRM

= 200µA

= 25°C, V

RRM

= 600V

= 1A, di/dt = 100A/µs, V

= 30V

= 8A, di/dt = 200A/µs, V

= 200V

= 125°C, I

= 8A, di/dt = 200A/µs, V

= 200V

600V

1.9V

(max.)

5" Wafer

Mechanical Data

Nominal Back Metal Composition, Thickness:

Nominal Front Metal Composition, Thickness:

Dimensions:

Wafer Diameter:

Wafer Thickness:

Scribe Line Width

Reject Ink Dot Size

Recommended Storage Environment:

Recommended Die Attach Conditions:

Reference Package

Cr-Ni-Ag ( 1kA-2kA-3kA)

99%Al, 1%Si (3µm)

0.100" x 0.100" (see drawing)

125 mm

14 mils

90 ±10 µm

0.25 mm Diameter Minimum

Store in original container, in dessicated

nitrogen, with no contamination

For optimum electrical results, die attach

temperature should not exceed 300 °C

TO-220

Die Outline

NOTES:

40 (1.57)

Wafer flat alligned with

side b of the die

1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS).

0.35 ± 0.01

(14 ± 0.4)

2. CONTROLLING DIMENSION (INCH):

3. DIMENSIONS AND TOLERANCES:

a = 2.54 +0, - 0.01

(100 +0, - 0.4)

b = 2.54 +0, - 0.01

(100 +0, - 0.4)

c = 1.48 +0, - 0.01

(58.1 +0, - 0.4)

d = 1.48 +0, - 0.01

(58.1 +0, - 0.4)

4. LETTER DESIGNATION:

A = Anode (Top Metal)

C = Cathode (Back Metal)

Ø 125 (4.92)

5. SAWING:

Recommended Blade

SEMITEC S1025 QS00 Blade

Note:

The above data sheet is based on IR sample testing under certain predetermined and assumed conditions, and is

provided for illustration purposes only. Customers are encouraged to perform testing in actual proposed packaged

and use conditions. IR die products are tested using IR-based quality assurance procedures and are manufactured

using IR’s established processes. Programs for customer-specified testing are available upon request. IR has

experienced assembly yields of generally 95% or greater for individual die; however, customer’s results may vary.

Estimates such as those described and set forth in this data sheet for semiconductor die will vary depending on a

number of packaging, handling, use and other factors. Sold die may not perform on an equivalent basis to standard

package products and are therefore offered with a limited warranty as described in IR’s applicable standard terms

and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale, which

are available upon request.

Part number shown is for die in waveform. Contact factory for these other options.

Document Number: 93768

Revision: 06-Mar-07

www.vishay.com

FD100U06A5B

Additional Testing and Screening

For Customers requiring product supplied as Known Good Die (KGD) or requiring specific die level

testing, please contact your local IR Sales.

Shipping

Three shipping options are offered as standard.

•

Un-sawn wafer

•

Die in waffle pack

•

Die on film

Tape and Reel is also available for some products. Please consult your local IR sales office or email

DieSales@irf.com

for additional information.

Please specify your required shipping option when requesting prices and ordering Die product. If not

specified, Un-sawn wafer will be assumed.

Packaging

Device

FD100U06A5B

FD100U06A5R

FD100U06A5P

FD100U06A5F

Description

Inked Probed Unsawn Wafer (Wafer in Box)

Probed Die in Tape & Reel

Probed Die in Waffle Pack

Inked Probed Sawn Wafer on Film

Minimum Order Quantity

Die in sale Package

1200

n/a contact Factory

Handling

•

Product must be handled only at ESD safe workstations. Standard ESD precautions and

safe work environments are as defined in MIL-HDBK-263.

Product must be handled only in a class 10,000 or better-designated clean room

environment.

Singulated die are not to be handled with tweezers. A vacuum wand with a non-metallic ESD

protected tip should be used.

Wafer/Die Storage

•

Proper storage conditions are necessary to prevent product contamination and/or

degradation after shipment.

Un-sawn wafers and singulated die can be stored for up to 12 months when in the original

sealed packaging at room temperature (45% +/- 15% RH controlled environment).

Un-sawn wafers and singulated die that have been opened can be stored when returned to

their containers and placed in a Nitrogen purged cabinet, at room temperature (45% +/- 15%

RH controlled environment).

Note: To reduce the risk of contamination or degradation, it is recommended that product not

being used in the assembly process be returned to their original containers and resealed with

a vacuum seal process.

Sawn wafers on a film frame are intended for immediate use and have a limited shelf life.

Die in Surf Tape type carrier tape are intended for immediate use and have a limited shelf

life. This is primarily due to the nature of the adhesive tape used to hold the product in the

carrier tape cavity. This product can be stored for up to 30 days. This applies whether or not

the material has remained in its original sealed container.

Further Information

For further information please contact your local IR Sales office or email your enquiry to

DieSales@irf.com

IR WORLD HEADQUARTERS:

233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105

TAC Fax: (310) 252-7903

Visit us at www.irf.com for sales contact information. 03/07

www.vishay.com

Document Number: 93768

Revision: 6-Mar-07

Legal Disclaimer Notice

Vishay

Notice

The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of

International Rectifier’s Power Control Systems (PCS) business, which closed in April 2007. Specifications of the

products displayed herein are pending review by Vishay and are subject to the terms and conditions shown below.

Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or

anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.

Information contained herein is intended to provide a product description only. No license, express or implied, by

estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's

terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express

or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness

for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.

Customers using or selling these products for use in such applications do so at their own risk and agree to fully

indemnify Vishay for any damages resulting from such improper use or sale.

International Rectifier

, IR

, the IR logo, HEXFET

, HEXSense

, HEXDIP

, DOL

, INTERO

, and POWIRTRAIN

are registered trademarks of International Rectifier Corporation in the U.S. and other countries. All other product

names noted herein may be trademarks of their respective owners.

Document Number: 99901

Revision: 12-Mar-07

www.vishay.com

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FD100U06A5R Related Products

	FD100U06A5R	FD100U06A5P	FD100U06A5B
Description	Rectifier Diode, 1 Phase, 1 Element, 600V V(RRM), Silicon, DIE-1	Rectifier Diode, 1 Phase, 1 Element, 600V V(RRM), Silicon, DIE-1	Rectifier Diode, 1 Phase, 1 Element, 600V V(RRM), Silicon, DIE-1
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Vishay	Vishay	Vishay
Parts packaging code	DIE	DIE	DIE
package instruction	DIE-1	DIE-1	S-XXUC-N2
Contacts	1	1	1
Reach Compliance Code	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99
application	GENERAL PURPOSE	GENERAL PURPOSE	GENERAL PURPOSE
Configuration	SINGLE	SINGLE	SINGLE
Diode component materials	SILICON	SILICON	SILICON
Diode type	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE
Maximum forward voltage (VF)	1.9 V	1.9 V	1.9 V
JESD-30 code	O-XUUC-N1	O-XUUC-N1	S-XXUC-N2
Number of components	1	1	1
Phase	1	1	1
Number of terminals	1	1	2
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	ROUND	ROUND	SQUARE
Package form	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum repetitive peak reverse voltage	600 V	600 V	600 V
Maximum reverse recovery time	0.027 µs	0.027 µs	0.027 µs
surface mount	YES	YES	YES
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER	UNSPECIFIED

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