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KS418-282TG

Description
IC Socket, DIP18, 18 Contact(s),
CategoryThe connector    socket   
File Size401KB,10 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

KS418-282TG Overview

IC Socket, DIP18, 18 Contact(s),

KS418-282TG Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAdvanced Interconnections Corp.
Reach Compliance Codecompliant
ECCN codeEAR99
Contact to complete cooperationGOLD OVER NICKEL
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBERYLLIUM COPPER/COPPER ALLOY
Device slot typeIC SOCKET
Type of equipment usedDIP18
Shell materialPOLYIMIDE
JESD-609 codee0
Number of contacts18
Peel-A-Way
®
Dual In-Line Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Peel-A-Way
®
DIP Socket Terminal Carriers
Conforms to NECQ/EIA 540DAAB Standards
Features:
• Peel away terminal carrier after soldering.
• Disposable carrier.
• Complete soldering visibility on both sides
of PCB.
• Maximum air flow.
• Better flux rinse.
• No contact damage due to terminal carrier
insertion.
• No contact pull out due to extraction of
terminal carrier.
Standard High Temperature Sockets
KS -
Insulator Material:
Polyimide Film
Temperature range -269˚C to 400˚C (-452˚F to 752˚F)
How To Order
KS
Body Type
Peel-A-Way
®
DIP
DIP Spacing
3 - .300" (7.62 mm)
4 - .400" (10.16 mm)
6 - .600" (15.24 mm)
9 - .900" (22.86 mm)
3
16
-85
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types.
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Number of Pins
(8 to 64)
Solder Preform:
63% Tin, 37% Lead
Polyimide Film
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Polyimide Film
Peel away
after soldering
to PCB.
PCB
Solder fillets visible both sides
for inspection and cleaning.
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carrier.
Peel-A-Way
®
covered by patent rights issued and/or pending. NECQ = National Electronic Component Qualification System EIA = Electronic Industry Association
Page 84
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
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