FST8080 - FST80100
F
A
N 2-PLCS
P
E
L
3
1
2
A=Common Anode
3
1
2
Common Cathode
Dim. Inches
A
C
E
F
G
H
J
K
L
M
N
P
1.180
.027
.350
1.490
.695
.088
.240
.115
.460
.065
.151
.015
1.195
.037
.370
1.510
.715
.098
.260
.135
.480
.085
.161
.025
Millimeter
29.97
0.69
8.89
37.85
17.65
2.24
6.10
2.92
11.68
1.65
3.84
0.38
30.35
0.94
9.40
38.35
18.16
2.49
6.60
3.43
12.19
2.16
4.09
0.64
Minimum Maximum Minimum Maximum Notes
1
2
3
Schottky MiniMod
M
3 PINS eq sp at .200
G
K
C
J
H
Note: Baseplate Common with Pin 2
1
2
3
D=Doubler
Dia.
Microsemi
Catalog Number
FST8080*
FST8090*
FST80100*
Industry
Part Number
83CNQ080, A
83CNQ100, A
Working
Peak Reverse
Voltage
80V
90V
100V
Repetitive
Peak Reverse
Voltage
80V
90V
100V
Schottky Barrier Rectifier
Guard ring protection
2X40 Amperes avg.
175°C junction temperature
Reverse energy tested
V RRM 80 to 100 volts
ROHS Compliant
*Add the Suffix A for Common Anode, D for Doubler
Electrical Characteristics
I F(AV) 80 Amps
Average forward current per pkg
I F(AV) 40 Amps
Average forward current per leg
I FSM 800 Amps
Maximum surge current per leg
Max repetitive peak reverse current per leg I R(OV) 2 Amps
VFM 0.62 Volts
Max peak forward voltage per leg
VFM 0.82 Volts
Max peak forward voltage per leg
I RM 50 mA
Max peak reverse current per leg
I RM 2 mA
Max peak reverse current per leg
CJ 1450 pF
Typical junction capacitance per leg
TC = 143°C, square wave, R0JC = 0.5°C/W
TC = 143°C, square wave, R0JC = 1.0°C/W
8.3 ms, half sine, T J = 175°C
f = 1 KHZ, 25°C, 1µsec square wave
I FM = 40A: T J = 175°C*
I FM = 40A: T J = 25°C*
VRRM, T J = 125°C*
VRRM, T J = 25°C
VR = 5.0V, T C = 25°C
*Pulse test: Pulse width 300µsec, Duty cycle 2%
Thermal and Mechanical Characteristics
Storage temp range
Operating junction temp range
Max thermal resistance per leg
Max thermal resistance per pkg
Typical thermal resistance (greased)
Mount base torque
Weight
T STG
TJ
R 0JC
R 0JC
R 0CS
-55°C to 175°C
-55°C to 175°C
Junction to case
1.0°C/W
0.5°C/W
Junction to case
Case to sink
0.3°C/W
10 inch pounds maximum
0.3 ounce (8.4 grams) typical
www.microsemi.com
October, 2012 - Rev. 6
FST8080 - FST80100
Figure 1
Typical Forward Characteristics - Per Leg
1000
800
600
Junction Capacitance - pF
400
Figure 3
Typical Junction Capacitance - Per Leg
10000
6000
4000
2000
1000
600
400
200
100
0.1
200
100
80
60
40
Instantaneous Forward Current - Amperes
0.5
1
5
10
50
100
Reverse Voltage - Volts
Figure 4
Forward Current Derating - Per Leg
175
170
165
160
155
150
145
140
0
5
60
10
15
90
20
120
25
30
180
35
40
45
DC
50
20
175 C
25 C
10
8.0
6.0
4.0
2.0
1.0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Instantaneous Forward Voltage - Volts
Maximum Allowable Case Temperature - C
Maximum Power Dissipation - Watts
Average Forward Current - Amperes
Figure 5
Maximum Forward Power Dissipation - Per Leg
35
30
25
20
15
10
5.0
0
0
5
10
15
20
25
30
35
40
45
50
Average Forward Current - Amperes
60
90
120
180
DC
Typical Reverse Current - mAmperes
Figure 2
Typical Reverse Characteristics - Per Leg
100
10
1.0
0.1
.01
.001
75 C
25 C
0
20
40
60
80
100
175 C
125 C
Reverse Voltage - Volts
www.microsemi.com
October, 2012 - Rev. 6
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PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
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Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with life-
support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
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Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.
www.microsemi.com
October, 2012
PCB Design
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