FST16090 - FST160100
A
N 4 Places
C
1
2
3
Schottky Powermod
E
B
L
Q
R
P
F
G
J
M
D
K
1
2
3
Common Cathode
Dim. Inches
Max.
Min.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
1.995
0.300
0.495
0.182
0.990
2.390
1.500
0.120
---
0.240
0.490
0.330
0.175
0.035
0.445
0.890
2.005
0.325
0.505
0.192
1.010
2.410
1.525
0.130
0.400
0.260
0.510
0.350
0.195
0.045
0.455
0.910
1
2
3
A=Common Anode
H
1
2
3
D=Doubler
Notes:
Baseplate: Nickel plated copper;
electrically isolated
Pins: Nickel plated copper
50.67
7.62
12.57
4.62
25.15
60.71
38.10
3.05
---
6.10
12.45
8.38
4.45
0.89
11.30
22.61
Millimeters
Min.
Max. Notes
50.93
8.26
12.83
4.88
Dia.
25.65
61.21
38.70
3.30
10.16
6.60 to Lead C
L
12.95
6.90
Dia.
4.95
1.14
11.56
23.11
TO-249
Schottky Barrier Rectifier
Guard Ring for Reverse Protection
V RRM - 90 to 100 Volts
High Surge Capacity
Reverse Energy Tested
ROHS Compliant
Microsemi
Working Peak
Catalog Number Reverse Voltage
FST16090*
FST160100*
90V
100V
Repetitive Peak
Reverse Voltage
90V
100V
*Add the Suffix A for Common Anode, D for Doubler
Electrical Characteristics
IF(AV) 160 Amps
Average forward current per pkg
IF(AV) 80 Amps
Average forward current per leg
IFSM
1200 Amps
Maximum surge current per leg
I
Max repetitive peak reverse current per leg R(OV) 2 Amps
VFM
.75 Volts
Max peak forward voltage per leg
VFM
.96 Volts
Max peak forward voltage per leg
IRM
30 mA
Max peak reverse current per leg
IRM
2 mA
Max peak reverse current per leg
C
Typical junction capacitance per leg
1500 pF
J
TC = 120°C, Square wave, R 0JC = 0.5°C/W
TC = 120°C, Square wave, R 0JC = 0.9°C/W
8.3 ms, half sine T J = 175°C
f = 1 KHz, 25°C, 1µsec Square wave
I FM = 80A: T J = 175°C*
I FM = 80A: T J = 25°C *
VRRM, T J = 125°C *
VRRM, T J = 25°C
VR = 5.0V, T J = 25°C
*Pulse test: Pulse width 300µsec, Duty cycle 2%
Thermal and Mechanical Characteristics
Storage temp range
Operating junction temp range
Maximum thermal resistance per leg
Max thermal resistance per pkg.
Typical thermal resistance (greased)
Mounting torque
Weight
T STG
TJ
R OJC
R OJC
R OCS
-55°C to 175°C
-55°C to 175°C
0.9°C/W
Junction to case
0.5°C/W
Junction to case
0.1°C/W
Case to sink
15 - 20 inch pounds
2.5 ounces (71 grams) typical
www.microsemi.com
October, 2012 - Rev. 5
FST16090 - FST160100
Figure 1
Typical Forward Characteristics
1000
800
600
400
Junction Capacitance - pF
125 C
25 C
Figure 3
Typical Junction Capacitance
10000
6000
4000
2000
1000
600
400
200
100
0.1
200
100
80
60
40
Instantaneous Forward Current - Amperes
0.5
1.0
5.0
10
50
100
Reverse Voltage - Volts
Figure 4
Forward Current Derating
175
165
155
145
135
125
115
105
60
0
10
20
30
40
50
90
60
120
70
180
80
90
DC
100
20
10
8.0
6.0
4.0
2.0
1.0
0
.3
.5
.7
.9
1.1
1.3
1.5
Instantaneous Forward Voltage - Volts
Maximum Allowable Case Temperature - C
Maximum Power Dissipation - Watts
Average Forward Current - Amperes
Figure 5
Maximum Forward Power Dissipation
70
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
100
Average Forward Current - Amperes
90
60
120
180
DC
Figure 2
Typical Reverse Characteristics
100
Typical Reverse Current - mA
10 175 C
1.0
125 C
0.1
75 C
25 C
0
20
40
60
80
100
.01
.001
Reverse Voltage - Volts
www.microsemi.com
October, 2012 - Rev. 5
DISCLAIMER
The information contained in the document (unless it is publicly available on the Web without access restrictions) is
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement
will also apply. This document and the information contained herein may not be modified, by any person other than
authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by
Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with life-
support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product
is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.
www.microsemi.com
October, 2012
京公网安备 11010802033920号
EEWORLD
