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FW82452KX

Description
Microprocessor Circuit, CMOS, PBGA256, BGA-256
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,180 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

FW82452KX Overview

Microprocessor Circuit, CMOS, PBGA256, BGA-256

FW82452KX Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntel
Parts packaging codeBGA
package instructionBGA, BGA292,20X20,50
Contacts256
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length27 mm
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA292,20X20,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum slew rate460 mA
Maximum supply voltage5.5 V
Minimum supply voltage3.13 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width27 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
A
Intel 450KX/GX PCIset
The information in this document is subject to change.

FW82452KX Related Products

FW82452KX FW82454GX FW82452GX
Description Microprocessor Circuit, CMOS, PBGA256, BGA-256 PCI Bus Controller, MOS, PBGA352, BGA-352 Microprocessor Circuit, CMOS, PBGA256, BGA-256
Is it Rohs certified? incompatible incompatible incompatible
Maker Intel Intel Intel
Parts packaging code BGA BGA BGA
package instruction BGA, BGA292,20X20,50 BGA, BGA388,26X26,50 BGA, BGA292,20X20,50
Contacts 256 352 256
Reach Compliance Code compliant unknown unknown
JESD-30 code S-PBGA-B256 S-PBGA-B352 S-PBGA-B256
JESD-609 code e0 e0 e0
length 27 mm 35 mm 27 mm
Number of terminals 256 352 256
Maximum operating temperature 85 °C 85 °C 85 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Encapsulate equivalent code BGA292,20X20,50 BGA388,26X26,50 BGA292,20X20,50
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3,5 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum slew rate 460 mA 640 mA 460 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V
Minimum supply voltage 3.13 V 3 V 3.13 V
Nominal supply voltage 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS MOS CMOS
Temperature level OTHER OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 27 mm 35 mm 27 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT BUS CONTROLLER, PCI MICROPROCESSOR CIRCUIT

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