25 A, 45 V, SILICON, RECTIFIER DIODE, DO-4
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Microsemi |
| Parts packaging code | DO-4 |
| package instruction | DO-4, 1 PIN |
| Contacts | 1 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Other features | REVERSE ENERGY TESTED |
| application | GENERAL PURPOSE |
| Shell connection | CATHODE |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | RECTIFIER DIODE |
| Maximum forward voltage (VF) | 0.58 V |
| JEDEC-95 code | DO-203AA |
| JESD-30 code | O-MUPM-D1 |
| JESD-609 code | e0 |
| Maximum non-repetitive peak forward current | 600 A |
| Number of components | 1 |
| Phase | 1 |
| Number of terminals | 1 |
| Maximum operating temperature | 150 °C |
| Minimum operating temperature | -55 °C |
| Maximum output current | 25 A |
| Package body material | METAL |
| Package shape | ROUND |
| Package form | POST/STUD MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum repetitive peak reverse voltage | 45 V |
| Maximum reverse current | 2000 µA |
| surface mount | NO |
| technology | SCHOTTKY |
| Terminal surface | TIN LEAD |
| Terminal form | SOLDER LUG |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| SBR2545 | SBR2535R | SBR2540R | SBR2545R | SBR2535 | SBR2540 | |
|---|---|---|---|---|---|---|
| Description | 25 A, 45 V, SILICON, RECTIFIER DIODE, DO-4 | 30 A, 35 V, SILICON, RECTIFIER DIODE, DO-203AA | 30 A, 40 V, SILICON, RECTIFIER DIODE, DO-203AA | 25 A, 45 V, SILICON, RECTIFIER DIODE, DO-203AA | 25 A, 35 V, SILICON, RECTIFIER DIODE, DO-4 | 25 A, 40 V, SILICON, RECTIFIER DIODE, DO-4 |
| Is it lead-free? | Contains lead | Lead free | Lead free | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| Parts packaging code | DO-4 | DO-4 | DO-4 | DO-4 | DO-4 | DO-4 |
| package instruction | DO-4, 1 PIN | DO-4, 1 PIN | DO-4, 1 PIN | DO-4, 1 PIN | DO-4, 1 PIN | DO-4, 1 PIN |
| Contacts | 1 | 1 | 1 | 1 | 1 | 1 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | REVERSE ENERGY TESTED | REVERSE ENERGY TESTED | REVERSE ENERGY TESTED | REVERSE ENERGY TESTED | REVERSE ENERGY TESTED | REVERSE ENERGY TESTED |
| application | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE |
| Shell connection | CATHODE | ANODE | ANODE | ANODE | CATHODE | CATHODE |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Diode component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| Diode type | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
| Maximum forward voltage (VF) | 0.58 V | 0.58 V | 0.58 V | 0.58 V | 0.58 V | 0.58 V |
| JEDEC-95 code | DO-203AA | DO-203AA | DO-203AA | DO-203AA | DO-203AA | DO-203AA |
| JESD-30 code | O-MUPM-D1 | O-MUPM-D1 | O-MUPM-D1 | O-MUPM-D1 | O-MUPM-D1 | O-MUPM-D1 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Maximum non-repetitive peak forward current | 600 A | 600 A | 600 A | 600 A | 600 A | 600 A |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 |
| Phase | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 1 | 1 | 1 | 1 | 1 | 1 |
| Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Maximum output current | 25 A | 25 A | 25 A | 25 A | 25 A | 25 A |
| Package body material | METAL | METAL | METAL | METAL | METAL | METAL |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum repetitive peak reverse voltage | 45 V | 35 V | 40 V | 45 V | 35 V | 40 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG |
| Terminal location | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Linux and Android
FPGA/CPLD
Robotics Development
Embedded System
RF/Wirelessly
Microchip MCU
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