TD62M8501FG datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Other integrated circuit (IC)> The signal circuit> TD62M8501FG

TD62M8501FG: DescriptionIC BRUSH DC MOTOR CONTROLLER, 4 A, PDSO18, 0.300 INCH, 1 MM PITCH, LEAD FREE, PLASTIC, HSOP-16/18, Motion Control Electronics; CategoryOther integrated circuit (IC) The signal circuit; File Size288KB，7 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/; Environmental Compliance

Download Datasheet Parametric View All

TD62M8501FG Overview

IC BRUSH DC MOTOR CONTROLLER, 4 A, PDSO18, 0.300 INCH, 1 MM PITCH, LEAD FREE, PLASTIC, HSOP-16/18, Motion Control Electronics

TD62M8501FG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Toshiba Semiconductor
Parts packaging code	SOIC
package instruction	HSSOP,
Contacts	16
Reach Compliance Code	unknown
ECCN code	EAR99
Analog Integrated Circuits - Other Types	BRUSH DC MOTOR CONTROLLER
JESD-30 code	R-PDSO-G18
length	13 mm
Number of functions	1
Number of terminals	18
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Maximum output current	4 A
Package body material	PLASTIC/EPOXY
encapsulated code	HSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.85 mm
Maximum supply voltage (Vsup)	20 V
Nominal supply voltage (Vsup)	20 V
surface mount	YES
technology	BIPOLAR
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6.4 mm

TD62M8501FG Preview

TD62M8501FG

TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT MULTI CHIP

TD62M8501FG

8CH LOW SATURATION VOLTAGE SINK DRIVER

TD62M8501FG is Multi Chip IC incorporates 8 low saturation

discrete (2SC3420) transistors.

This IC is suitable for a battery use motor drive and LED display

module applications.

The suffix (G) appended to the part number represents a Lead

(Pb)-Free product.

FEATURES

Suitable for Motor drive circuit and LED display module

External Bias Resistor

Low Saturation Voltage

CE (sat)

= 0.12 V (Typ.) at I

= 1 A

CE (sat)

= 0.25 V (Typ.) at I

= 2 A

HSOP16 (1 mm pitch) power small package sealed

Weight: 0.50 g (typ.)

SCHEMATIC

PIN CONNECTION

(TOP VIEW)

2006-06-14

TD62M8501FG

ABSOLUTE MAXIMUM RATINGS

(Ta = 25°C)

CHARACTERISTIC

Supply Voltage

SYMBOL

CBO

Breakdown Voltage

CEO

EBO

Output Current

Base Current

Power Dissipation

Junction Temperature

Operating Temperature

Storage Temperature

O (AVE)

O (PRAK)

opr

stg

RATING

4 (Note)

900

150

−40~85

−55~150

°C

UNIT

Note:

T = 10 ms MAX. and maximum duty is less than 30%.

ELECTRICAL CHARACTERISTICS

(Ta = 25°C)

CHARACTERISTIC

SYMBOL

FE (1)

FE (2)

CE (sat)

TEST

CIR−

CUIT

―

TEST CONDITION

= 2 V, I

= 0.5 A

= 2 V, I

= 2.0 A

= 1 A, I

= 25 mA

= 2 A, I

= 50 mA

= 2 V, I

= 0.5 A

= 20 V

= 2 V, I

= 2.0 A

MIN

140

―

TYP.

―

140

0.12

0.25

100

0.84

MAX

600

―

0.25

0.50

―

1.5

UNIT

Current Gain

―

Saturation Voltage

Transition Frequency

Leakage Current

Base−Emitter Forward Voltage

MHz

µA

2006-06-14

TD62M8501FG

PRECAUTIONS for USING

This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess

current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or

voltage will not be applied to the IC.

Utmost care is necessary in the design of the output line, V

and GND line since IC may be destroyed due to

short−circuit between outputs, air contamination fault, or fault by improper grounding.

2006-06-14

TD62M8501FG

PACKAGE DIMENSIONS

HSOP16−P−300−1.00

Unit: mm

Weight: 0.50 g (Typ.)

2006-06-14

TD62M8501FG

Notes on Contents

Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory

purposes.

IC Usage Considerations

Notes on Handling of ICs

(1)

The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

Use an appropriate power supply fuse to ensure that a large current does not continuously flow in

case of over current and/or IC failure. The IC will fully break down when used under conditions that

exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal

pulse noise occurs from the wiring or load, causing a large current to continuously flow and the

breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of

breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are

required.

If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the

design to prevent device malfunction or breakdown caused by the current resulting from the inrush

current at power ON or the negative current resulting from the back electromotive force at power OFF.

IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,

the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,

smoke or ignition.

Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and

exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation

or incorrectly even just one time.

Carefully select external components (such as inputs and negative feedback capacitors) and load

components (such as speakers), for example, power amp and regulator.

If there is a large amount of leakage current such as input or negative feedback condenser, the IC

output DC voltage will increase. If this output voltage is connected to a speaker with low input

withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause

smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied

Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

(2)

(3)

(4)

(5)

2006-06-14

More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

26kW AC three-speed cargo crane control circuit

Power amplifier circuit using field effect transistor as output

C534J1 vertical lathe control circuit 03

Internal circuit diagram of STRD6009E

Motor phase failure automatic protection circuit

25-in-1 color TV remote control circuit

Why does the output voltage become smaller after the AC power is rectified and filtered and added to the BUCK step-down circuit?: Why does the output voltage decrease after the AC power is rectified and filtered and added to the buck circuit, and does not change with the duty cycle, but when the DC power is directly added to the...; msy2yx Power technology

LinKIt ONE Review (2): [i=s]This post was last edited by ihalin on 2017-2-28 08:35[/i] [font=Arial][size=5]Next post:[/size][/font][url=https://bbs.eeworld.com.cn/thread-521245-1-1.html]LinKIt ONE Evaluation (1)[/url] [font...; ihalin stm32/stm8

Matter Development Guide (V): Firmware Compilation and Burning: We have already set up the Matter compilation environment, so this time we can proceed with the compilation and burning steps.To compile the Matter firmware, you need to operate in the Matter root dir...; okhxyyo RF/Wirelessly

In circuit design, how to connect the "ground": In addition to correctly designing and installing the grounding, it is also necessary to correctly handle the grounding of various different signals. In the control system, there are roughly the follo...; 电子研发_lp 51mcu

4. "Wanli" Raspberry Pi car - C++ learning (compile and run, use geany): In the past, when learning C language or embedded programming, there was an IDE. In the Windows environment, you hardly had to worry about compilation and linking. However, in the Linux environment, y...; lb8820265 Creative Market

I am a newbie, I hope someone can help me. Thanks! (FPGA Design): ...; 温柔如风~ FPGA/CPLD

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components