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MQSMAJP4KE33CE3TR

Description
Trans Voltage Suppressor Diode, 400W, 26.8V V(RWM), Bidirectional, 1 Element, Silicon, DO-214AC, ROHS COMPLIANT, PLASTIC, SMAJ, BA, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size305KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
Download Datasheet Parametric View All

MQSMAJP4KE33CE3TR Overview

Trans Voltage Suppressor Diode, 400W, 26.8V V(RWM), Bidirectional, 1 Element, Silicon, DO-214AC, ROHS COMPLIANT, PLASTIC, SMAJ, BA, 2 PIN

MQSMAJP4KE33CE3TR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
Parts packaging codeDO-214AC
package instructionROHS COMPLIANT, PLASTIC, SMAJ, BA, 2 PIN
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum breakdown voltage36.3 V
Minimum breakdown voltage29.7 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-214AC
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Humidity sensitivity level1
Maximum non-repetitive peak reverse power dissipation400 W
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityBIDIRECTIONAL
Maximum power dissipation1.52 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage26.8 V
surface mountYES
technologyAVALANCHE
Terminal surfaceMATTE TIN
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
SMAJP4KE6.8 thru SMAJP4KE400CA, e3
TRANSIENT VOLTAGE SUPPRESSOR
SCOTTSDALE DIVISION
DESCRIPTION
This Transient Voltage Suppressor (TVS) series is an economical molded
surface mount package with very low thermal resistance due to its unique
axial subassembly. It is used for automotive applications and others to
protect voltage sensitive components from destructive or partial degradation.
They have a peak pulse power rating of 400 watts for 1 ms as depicted in
Figures 1 and 2. The package is configured for easy pick and place onto PC
Boards for automated handling. The J-bend terminations also provide stress
relief for use on a variety of PC Board materials.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
PACKAGE
WWW .
Microsemi
.C
OM
DO-214AC or BA
(SMAJ)
FEATURES
Economical series for surface mounting
Available in both unidirectional and bi-directional (add
C or CA suffix to part number for bidirectional)
Voltages from 6.8 to 400 V Breakdown (V
BR
)
Fast Response
Moisture classification is Level 1 per IPC/JEDEC
J-STD-020B with no dry pack
Optional 100%
screening for avionics grade
is
available by adding MA prefix to part number for
o
o
added 100% temperature cycle -55 C to +125 C
(10X) as well as surge (3X) and 24 hours HTRB with
post test V
Z
& I
R
(in the operating direction for
unidirectional or both directions for bidirectional)
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, or JANTXV are available by
adding MQ, MX, or MV prefixes respectively to part
numbers
RoHS Compliant devices available by adding “e3” suffix
NOTE: Equivalent axial-leaded packages available
as P4KE6.8 to P4KE400CA
APPLICATIONS / BENEFITS
Suppresses transient up to 400 watts @ 10/1000
μs
(see Figure 1)
Protects sensitive components such as IC’s,
2
CMOS, Bipolar, BiCMOS, ECL, DTL, T L, etc.
Protection from switching transients & induced RF
Compliant to IEC61000-4-2 and IEC61000-4-4 for
ESD and EFT protection respectively
Secondary lightning protection per IEC61000-4-5
with 42 Ohms source impedance:
Class 1: SMAJP4KE6.8 to SMAJP4KE91A or CA
Class 2: SMAJP4KE6.8 to SMAJP4KE47A or CA
Class 3: SMAJP4KE6.8 to SMAJP4KE24A or CA
Class 4: SMAJP4KE6.8 to SMAJP4KE12A or CA
Secondary lightning protection per IEC61000-4-5
with 12 Ohms source impedance:
Class 1: SMAJP4KE6.8 to SMAJP4KE30A or CA
Class 2: SMAJP4KE6.8 to SMAJP4KE15A or CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25
º
C: 400 watts at
10/1000
μs
(also see Fig 1,2, and 4)
Impulse repetition rate (duty factor): 0.01%
t
clamping
(0 volts to
V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Operating and Storage temperature: -65
º
C to +150
º
C
º
Thermal resistance: 17 C/W junction to lead or
82
º
C/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint (see
last page)
Steady-State Power dissipation: 5 watts at T
L
= 65
o
C
or 1.52 watts at T
A
= 25
º
C when mounted on FR4 PC
board with recommended footprint
Forward Surge Current at 25ºC: 40 amps peak, 8.3
ms half-sine wave. Maximum voltage of 3.50 V
(unidirectional only)
Solder temperatures: 260
º
C for 10 s (maximum)
MECHANICAL AND PACKAGING
CASE: Molded epoxy package meets UL94V-0
TERMINALS: Tin-lead or RoHS compliant
annealed matte-Tin plating solderable per MIL-
STD-750, method 2026
POLARITY: Cathode designated by cathode band
for unidirectional (none for bidirectional)
Marking only shows 4KExxx digits of part number
(e.g. 4KE6.8, 4KE12CA, 4KE30A, etc.)
Weight: 0.1 grams (approximate)
Tape & Reel option: Standard per EIA-481-1-A
with 12 mm tape (add “TR” suffix to part number)
750 per 7 inch reel or 2500 per 13 inch reel
SMAJP4KE6.8 thru
SMAJP4KE400CA
Copyright
©
2007
6-20-2007 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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