
100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
| Parameter Name | Attribute value |
| Brand Name | NXP Semiconduc |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | TO-236 |
| package instruction | SMALL OUTLINE, R-PDSO-G3 |
| Contacts | 3 |
| Manufacturer packaging code | SOT23 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Other features | LOW NOISE |
| Maximum collector current (IC) | 0.1 A |
| Collector-emitter maximum voltage | 30 V |
| Configuration | SINGLE |
| Minimum DC current gain (hFE) | 420 |
| JEDEC-95 code | TO-236AB |
| JESD-30 code | R-PDSO-G3 |
| JESD-609 code | e3 |
| Humidity sensitivity level | 1 |
| Number of components | 1 |
| Number of terminals | 3 |
| Maximum operating temperature | 150 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 |
| Polarity/channel type | PNP |
| Maximum power dissipation(Abs) | 0.25 W |
| Certification status | Not Qualified |
| surface mount | YES |
| Terminal surface | Tin (Sn) |
| Terminal form | GULL WING |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| transistor applications | AMPLIFIER |
| Transistor component materials | SILICON |
| Nominal transition frequency (fT) | 100 MHz |
| VCEsat-Max | 0.65 V |

| BC859C,235 | BC859C,215 | BC860B,215 | BC860B,235 | BC859B/AU,215 | BC859B,215 | BC859B/A2,215 | |
|---|---|---|---|---|---|---|---|
| Description | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 45 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| surface mount | YES | YES | YES | YES | Yes | YES | Yes |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal location | DUAL | DUAL | DUAL | DUAL | pair | DUAL | pair |
| transistor applications | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER | amplifier | AMPLIFIER | amplifier |
| Transistor component materials | SILICON | SILICON | SILICON | SILICON | silicon | SILICON | silicon |
| Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | - | NXP Semiconduc | - |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | - | conform to | - |
| Maker | NXP | NXP | NXP | NXP | - | NXP | - |
| Parts packaging code | TO-236 | TO-236 | TO-236 | TO-236 | - | TO-236 | - |
| package instruction | SMALL OUTLINE, R-PDSO-G3 | PLASTIC PACKAGE-3 | PLASTIC PACKAGE-3 | SMALL OUTLINE, R-PDSO-G3 | - | PLASTIC PACKAGE-3 | - |
| Contacts | 3 | 3 | 3 | 3 | - | 3 | - |
| Manufacturer packaging code | SOT23 | SOT23 | SOT23 | SOT23 | - | SOT23 | - |
| Reach Compliance Code | compli | compli | compli | compli | - | compli | - |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | - |
| Other features | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | - | LOW NOISE | - |
| Maximum collector current (IC) | 0.1 A | 0.1 A | 0.1 A | 0.1 A | - | 0.1 A | - |
| Collector-emitter maximum voltage | 30 V | 30 V | 45 V | 45 V | - | 30 V | - |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | - | SINGLE | - |
| Minimum DC current gain (hFE) | 420 | 420 | 220 | 220 | - | 220 | - |
| JEDEC-95 code | TO-236AB | TO-236AB | TO-236AB | TO-236AB | - | TO-236AB | - |
| JESD-30 code | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | - | R-PDSO-G3 | - |
| JESD-609 code | e3 | e3 | e3 | e3 | - | e3 | - |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | - | 1 | - |
| Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C | - | 150 °C | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | - |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | - | 260 | - |
| Polarity/channel type | PNP | PNP | PNP | PNP | - | PNP | - |
| Maximum power dissipation(Abs) | 0.25 W | 0.3 W | 0.3 W | 0.25 W | - | 0.3 W | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| Terminal surface | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | - | Tin (Sn) | - |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 | - | 40 | - |
| Nominal transition frequency (fT) | 100 MHz | 100 MHz | 100 MHz | 100 MHz | - | 100 MHz | - |
| VCEsat-Max | 0.65 V | 0.65 V | 0.65 V | 0.65 V | - | 0.65 V | - |