LH538300CN datasheet, PDF - EEWORLD Datasheet

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LH538300CN: DescriptionMASK ROM, 1MX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32; Categorystorage storage; File Size125KB，6 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH538300CN Overview

MASK ROM, 1MX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32

LH538300CN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	0.525 INCH, PLASTIC, SOP-32
Reach Compliance Code	unknown
Maximum access time	150 ns
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	20.6 mm
memory density	8388608 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	3.1 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.3 mm

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LH538300CN Related Products

	LH538300CN	LH538300CD	LH538300CSR	LH538300CS
Description	MASK ROM, 1MX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32	MASK ROM, 1MX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 1MX8, 150ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, REVERSE, TSOP2-32	MASK ROM, 1MX8, 150ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	0.525 INCH, PLASTIC, SOP-32	0.600 INCH, PLASTIC, DIP-32	0.400 INCH, PLASTIC, REVERSE, TSOP2-32	0.400 INCH, PLASTIC, TSOP2-32
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	150 ns	150 ns	150 ns	150 ns
JESD-30 code	R-PDSO-G32	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32
JESD-609 code	e0	e0	e0	e0
length	20.6 mm	41 mm	21 mm	21 mm
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	32	32	32	32
word count	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	1MX8	1MX8	1MX8	1MX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	TSOP2-R	TSOP2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.1 mm	5.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.3 mm	15.24 mm	10.2 mm	10.2 mm
Maker	SHARP	-	SHARP	SHARP

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