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LC0404FC08C-LF-T75-1

Description
Trans Voltage Suppressor Diode, 200W, 8V V(RWM), Bidirectional, 4 Element, Silicon, ROHS COMPLIANT, FLIP CHIP-4
CategoryDiscrete semiconductor    diode   
File Size542KB,8 Pages
ManufacturerProTek Devices
Websitehttp://www.protekdevices.com/
Environmental Compliance  
Download Datasheet Parametric View All

LC0404FC08C-LF-T75-1 Overview

Trans Voltage Suppressor Diode, 200W, 8V V(RWM), Bidirectional, 4 Element, Silicon, ROHS COMPLIANT, FLIP CHIP-4

LC0404FC08C-LF-T75-1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerProTek Devices
Parts packaging codeFLIP-CHIP
package instructionS-PBGA-B4
Contacts4
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresLOW CAPACITANCE, LOW LEAKAGE CURRENT
Minimum breakdown voltage8.5 V
ConfigurationCOMMON BIPOLAR TERMINAL, 4 ELEMENTS
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeS-PBGA-B4
JESD-609 codee1
Maximum non-repetitive peak reverse power dissipation200 W
Number of components4
Number of terminals4
Package body materialPLASTIC/EPOXY
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)270
polarityBIDIRECTIONAL
Certification statusNot Qualified
Maximum repetitive peak reverse voltage8 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTin/Silver/Copper (Sn96.0Ag3.5Cu0.5)
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
05157
Only One Name Means ProTek’Tion™
LC0404FC3.3C - LC0404FC36C
200W LOW CAPACITANCE FLIP ChIP Tvs ARRAy
DEsCRIPTION
The LC0404FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In ad-
dition, the LC0404FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low
inductance virtually eliminates overshoot voltage due to package inductance.
FEATuREs
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
Low Clamping Voltage
Bidirectional Configuration & Monolithic Structure
Low Capacitance
Low Leakage Current
Protection for 1 to 3 Lines
RoHS Compliant
REACH Compliant
APPLICATIONs
• SMART Phones
• Portable Electronics
• SMART Cards
MEChANICAL ChARACTERIsTICs
Standard EIA Chip Size: 0404
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGuRATION
05157.R9 9/12
Page 1
www.protekdevices.com
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