|
Z852308VEC |
Z852308VSC |
Z852308PEC |
Z852308PSC |
| Description |
Serial I/O Controller, 2 Channel(s), 0.25MBps, CMOS, PQCC44, PLASTIC, LCC-44 |
Serial I/O Controller, 2 Channel(s), 0.25MBps, CMOS, PQCC44, PLASTIC, LCC-44 |
Serial I/O Controller, 2 Channel(s), 0.25MBps, CMOS, PDIP40, PLASTIC, DIP-40 |
Serial I/O Controller, 2 Channel(s), 0.25MBps, CMOS, PDIP40, PLASTIC, DIP-40 |
| Parts packaging code |
LCC |
LCC |
DIP |
DIP |
| package instruction |
QCCJ, |
QCCJ, |
DIP, |
DIP, |
| Contacts |
44 |
44 |
40 |
40 |
| Reach Compliance Code |
unknow |
unknow |
unknown |
unknown |
| Other features |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
| boundary scan |
NO |
NO |
NO |
NO |
| maximum clock frequency |
8.5 MHz |
8.5 MHz |
8.5 MHz |
8.5 MHz |
| letter of agreement |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC |
| Data encoding/decoding methods |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
| Maximum data transfer rate |
0.25 MBps |
0.25 MBps |
0.25 MBps |
0.25 MBps |
| External data bus width |
8 |
8 |
8 |
8 |
| JESD-30 code |
S-PQCC-J44 |
S-PQCC-J44 |
R-PDIP-T40 |
R-PDIP-T40 |
| length |
16.5862 mm |
16.5862 mm |
52.325 mm |
52.325 mm |
| low power mode |
NO |
NO |
NO |
NO |
| Number of serial I/Os |
2 |
2 |
2 |
2 |
| Number of terminals |
44 |
44 |
40 |
40 |
| Maximum operating temperature |
100 °C |
70 °C |
100 °C |
70 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
QCCJ |
QCCJ |
DIP |
DIP |
| Package shape |
SQUARE |
SQUARE |
RECTANGULAR |
RECTANGULAR |
| Package form |
CHIP CARRIER |
CHIP CARRIER |
IN-LINE |
IN-LINE |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
4.57 mm |
4.57 mm |
4.24 mm |
4.24 mm |
| Maximum slew rate |
10 mA |
10 mA |
10 mA |
10 mA |
| Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
NO |
NO |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
| Terminal form |
J BEND |
J BEND |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal pitch |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
| Terminal location |
QUAD |
QUAD |
DUAL |
DUAL |
| width |
16.5862 mm |
16.5862 mm |
15.24 mm |
15.24 mm |
| uPs/uCs/peripheral integrated circuit type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |