RF COMMUNICATIONS PRODUCTS
OUTPUT/INPUT
INPUT/OUTPUT
OUTPUT/INPUT
ENCH1
SA630
Single pole double throw (SPDT) switch
Product Specification
Replaces data of October 10, 1991
IC17 Data Handbook
1997 Nov 07
Philips Semiconductors
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
DESCRIPTION
The SA630 is a wideband RF switch fabricated in BiCMOS technol-
ogy and incorporating on-chip CMOS/TTL compatible drivers. Its
primary function is to switch signals in the frequency range DC -
1GHz from one 50Ω channel to another. The switch is activated by
a CMOS/TTL compatible signal applied to the enable channel 1 pin
(ENCH1).
The extremely low current consumption makes the SA630 ideal for
portable applications. The excellent isolation and low loss makes
this a suitable replacement for PIN diodes.
The SA630 is available in an 8-pin dual in-line plastic package and
an 8-pin SO (surface mounted miniature) package.
PIN CONFIGURATION
D and N Packages
V
DD
GND
INPUT
ENCH1
1
2
3
4
8
7
6
5
OUT
1
AC GND
GND
OUT
2
SR00578
Figure 1. Pin Configuration
FEATURES
•
Wideband (DC - 1GHz)
•
Low through loss (1dB typical at 200MHz)
•
Unused input is terminated internally in 50Ω
•
Excellent overload capability (1dB gain compression point +18dBm
•
Low DC power (170µA from 5V supply)
•
Fast switching (20ns typical)
•
Good isolation (off channel isolation 60dB at 100MHz)
at 300MHz)
•
Low distortion (IP
3
intercept +33dBm)
•
Good 50Ω match (return loss 18dB at 400MHz)
•
Full ESD protection
•
Bidirectional operation
APPLICATIONS
•
Digital transceiver front-end switch
•
Antenna switch
•
Filter selection
•
Video switch
•
FSK transmitter
ORDERING INFORMATION
DESCRIPTION
8-Pin Plastic Dual In-Line Package (DIP)
8-Pin Plastic Small Outline (SO) package (Surface-mount)
TEMPERATURE RANGE
-40 to +85°C
-40 to +85°C
ORDER CODE
SA630N
SA630D
DWG #
SOT97-1
SOT96-1
BLOCK DIAGRAM
OUTPUT/INPUT
INPUT/OUTPUT
OUTPUT/INPUT
ENCH1
SR00579
Figure 2. Block Diagram
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
T
A
T
J
Supply voltage
Operating ambient temperature range
SA Grade
Operating junction temperature range
SA Grade
PARAMETER
RATING
3.0 to 5.5V
-40 to +85
-40 to +105
UNITS
V
°C
°C
1997 Nov 07
2
853-1577 18666
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
EQUIVALENT CIRCUIT
V
DD
+5V
1
20kΩ
CONTROL
LOGIC
50Ω
7
2
50Ω
6
AC BYPASS
8
OUT
1
INPUT
3
20kΩ
5
OUT
2
ENCH1
4
SR00580
Figure 3. Equivalent Circuit
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
P
D
T
JMAX
P
MAX
T
STG
Supply voltage
Power dissipation, T
A
=
8-Pin Plastic DIP
8-Pin Plastic SO
25
o
C
(still
air)
1
1160
780
150
+20
-65 to +150
mW
mW
°C
dBm
°C
PARAMETER
RATING
-0.5 to +5.5
UNITS
V
Maximum operating junction temperature
Maximum power input/output
Storage temperature range
NOTES:
1. Maximum dissipation is determined by the operating ambient temperature and the thermal resistance,
θ
JA
:
8-Pin DIP:
θ
JA
= 108°C/W
8-Pin SO:
θ
JA
= 158°C/W
DC ELECTRICAL CHARACTERISTICS
V
DD
= +5V, T
A
= 25
°
C; unless otherwise stated.
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
I
DD
V
T
V
IH
V
IL
I
IL
I
IH
Supply current
TTL/CMOS logic threshold voltage
1
Logic 1 level
Logic 0 level
ENCH1 input current
ENCH1 input current
Enable channel 1
Enable channel 2
ENCH1 = 0.4V
ENCH1 = 2.4V
40
1.1
2.0
-0.3
-1
-1
0
0
SA630
TYP
170
1.25
MAX
300
1.4
V
DD
0.8
1
1
µA
V
V
V
µA
µA
UNITS
NOTE:
1. The ENCH1 input must be connected to a valid Logic Level for proper operation of the SA630.
1997 Nov 07
3
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
AC ELECTRICAL CHARACTERISTICS
1
- D PACKAGE
V
DD
= +5V, T
A
= 25
°
C; unless otherwise stated.
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
S
21
, S
12
Insertion loss (ON channel)
DC - 100MHz
500MHz
900MHz
10MHz
100MHz
500MHz
900MHz
DC - 400MHz
900MHz
DC - 400MHz
900MHz
50% TTL to 90/10% RF
90%/10% to 10%/90% RF
70
24
SA630
TYP
1
1.4
2
80
60
50
30
20
12
17
13
20
5
165
DC - 1GHz
100MHz
100MHz
100MHz
900MHz
+18
+33
+52
1.0
2.0
MAX
dB
2.8
UNITS
S
21
, S
12
Isolation (OFF channel)
2
dB
S
11
, S
22
S
11
, S
22
t
D
t
r
, t
f
Return loss (ON channel)
Return loss (OFF channel)
Switching speed (on-off delay)
Switching speeds (on-off rise/fall time)
Switching transients
dB
dB
ns
ns
mV
P-P
dBm
dBm
dBm
dB
P
-1dB
IP
3
IP
2
NF
1dB gain compression
Third-order intermodulation intercept
Second-order intermodulation intercept
Noise figure (Z
O
= 50Ω )
NOTE:
1. All measurements include the effects of the D package SA630 Evaluation Board (see Figure 4B). Measurement system impedance is 50Ω.
2. The placement of the AC bypass capacitor is critical to achieve these specifications. See the applications section for more details.
AC ELECTRICAL CHARACTERISTICS
1
- N PACKAGE
V
DD
= +5V, T
A
= 25
°
C; all other characteristics similar to the D-Package, unless otherwise stated.
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
S
21
, S
12
Insertion loss (ON channel)
DC - 100MHz
500MHz
900MHz
10MHz
100MHz
500MHz
900MHz
100MHz
900MHz
SA630
TYP
1
1.4
2.5
68
50
37
15
1.0
2.5
MAX
dB
UNITS
S
21
, S
12
Isolation (OFF channel)
58
dB
NF
Noise figure (Z
O
= 50Ω )
dB
NOTE:
1. All measurements include the effects of the N package SA630 Evaluation Board (see Figure 4C). Measurement system impedance is 50Ω.
APPLICATIONS
The typical applications schematic and printed circuit board layout of
the SA630 evaluation board is shown in Figure 4. The layout of the
board is simple, but a few cautions need to be observed. The input
and output traces should be 50Ω. The placement of the AC bypass
capacitor is
extremely critical
if a symmetric isolation between the
two channels is desired. The trace from Pin 7 should be drawn back
towards the package and then be routed downwards. The capacitor
should be placed straight down as close to the device as practical.
For better isolation between the two channels at higher frequencies,
it is also advisable to run the two output/input traces at an angle.
This also minimizes any inductive coupling between the two traces.
The power supply bypass capacitor should be placed close to the
device. Figure 10 shows the frequency response of the SA630.
The loss matching between the two channels is excellent to 1.2GHz
as shown in Figure 13.
1997 Nov 07
4
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
V
DD
+5V
D and N Packages
0.1µF
1
GND
INPUT
0.01µF
2
3
4
ENCH
1
8
7
6
5
0.01µF
AC GND
GND
OUT
2
0.01µF
0.01µF
OUT
1
a. Evaluation Board Schematic
b. 630 D-Package Board Layout
630N1 7/91
c. 630 N-Package Board Layout
Figure 4. Board and Package Graphics
1997 Nov 07
5
SR00581
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