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74AUP1G158GS,132

Description
Low-power 2-input multiplexer; inverting
Categorylogic    logic   
File Size200KB,19 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74AUP1G158GS,132 Overview

Low-power 2-input multiplexer; inverting

74AUP1G158GS,132 Parametric

Parameter NameAttribute value
Source Url Status Check Date2013-06-14 00:00:00
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
package instruction1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6
Manufacturer packaging codeSOT1202
Reach Compliance Codecompli
74AUP1G158
Low-power 2-input multiplexer; inverting
Rev. 5 — 3 August 2012
Product data sheet
1. General description
The 74AUP1G158 is a single 2-input multiplexer which select data from two data inputs
(I0 and I1) under control of a common data select input (S). The state of the common data
select input determines the particular register from which the data comes. The output (Y)
presents the selected data in the complement (inverted) form.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; I
CC
= 0.9
A
(maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
I
OFF
circuitry provides partial Power-down mode operation
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C

74AUP1G158GS,132 Related Products

74AUP1G158GS,132 74AUP1G158GM,115 74AUP1G158GM,132 74AUP1G158GN,132 74AUP1G158GF,132 74AUP1G158GW,125
Description Low-power 2-input multiplexer; inverting Low-power 2-input multiplexer; inverting Low-power 2-input multiplexer; inverting Low-power 2-input multiplexer; inverting Low-power 2-input multiplexer; inverting Low-power 2-input multiplexer; inverting
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP
package instruction 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6 PLASTIC, SOT-363, SC-88, SMT-6
Manufacturer packaging code SOT1202 SOT886 SOT886 SOT1115 SOT891 SOT363
Reach Compliance Code compli compli compli compli compli compli
Parts packaging code - SON SON SON SON TSSOP
Contacts - 6 6 6 6 6
series - AUP/ULP/V AUP/ULP/V - AUP/ULP/V AUP/ULP/V
JESD-30 code - R-PDSO-N6 R-PDSO-N6 - S-PDSO-N6 R-PDSO-G6
JESD-609 code - e3 e3 - e3 e3
length - 1.45 mm 1.45 mm - 1 mm 2 mm
Load capacitance (CL) - 30 pF 30 pF - 30 pF 30 pF
Logic integrated circuit type - MULTIPLEXER MULTIPLEXER - MULTIPLEXER MULTIPLEXER
MaximumI(ol) - 0.0017 A 0.0017 A - 0.0017 A 0.0017 A
Humidity sensitivity level - 1 1 - 1 1
Number of functions - 1 1 - 1 1
Number of entries - 2 2 - 2 2
Output times - 1 1 - 1 1
Number of terminals - 6 6 - 6 6
Maximum operating temperature - 125 °C 125 °C - 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C - -40 °C -40 °C
Output polarity - INVERTED INVERTED - INVERTED INVERTED
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - VSON VSON - VSON TSSOP
Encapsulate equivalent code - SOLCC6,.04,20 SOLCC6,.04,20 - SOLCC6,.04,14 TSSOP6,.08
Package shape - RECTANGULAR RECTANGULAR - SQUARE RECTANGULAR
Package form - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing - TAPE AND REEL TAPE AND REEL - TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) - 260 260 - 260 260
power supply - 1.2/3.3 V 1.2/3.3 V - 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Su - 21 ns 21 ns - 21 ns 21 ns
propagation delay (tpd) - 21 ns 21 ns - 21 ns 21 ns
Certification status - Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height - 0.5 mm 0.5 mm - 0.5 mm 1.1 mm
Maximum supply voltage (Vsup) - 3.6 V 3.6 V - 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 0.8 V 0.8 V - 0.8 V 0.8 V
Nominal supply voltage (Vsup) - 1.1 V 1.1 V - 1.1 V 1.1 V
surface mount - YES YES - YES YES
technology - CMOS CMOS - CMOS CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal surface - Tin (Sn) Tin (Sn) - Tin (Sn) Tin (Sn)
Terminal form - NO LEAD NO LEAD - NO LEAD GULL WING
Terminal pitch - 0.5 mm 0.5 mm - 0.35 mm 0.65 mm
Terminal location - DUAL DUAL - DUAL DUAL
Maximum time at peak reflow temperature - 30 30 - 30 30
width - 1 mm 1 mm - 1 mm 1.25 mm
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