74HC02PW,112 datasheet, PDF - EEWORLD Datasheet

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74HC02PW,112: DescriptionHC/UH SERIES, QUAD 2-INPUT NOR GATE, PDSO14; Categorylogic logic; File Size128KB，16 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HC02PW,112 Overview

HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDSO14

74HC02PW,112 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconduc
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	TSSOP
package instruction	TSSOP, TSSOP14,.25
Contacts	14
Manufacturer packaging code	SOT402-1
Reach Compliance Code	compli
series	HC/UH
JESD-30 code	R-PDSO-G14
JESD-609 code	e4
length	5 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	NOR GATE
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of functions	4
Number of entries	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TUBE
Peak Reflow Temperature (Celsius)	260
power supply	2/6 V
Prop。Delay @ Nom-Su	27 ns
propagation delay (tpd)	27 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.1 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	4.4 mm
Base Number Matches	1

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74HC02; 74HCT02

Quad 2-input NOR gate

Rev. 4 — 4 September 2012

Product data sheet

1. General description

The 74HC02; 74HCT02 are high-speed Si-gate CMOS devices that comply with JEDEC

standard no. 7A. They are pin compatible with Low-power Schottky TTL (LSTTL).

The 74HC02; 74HCT02 provides a quad 2-input NOR function.

2. Features and benefits



Input levels:



For 74HC02: CMOS level



For 74HCT02: TTL level



ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V



Multiple package options



Specified from

40 C

to +85

C

and from

40 C

to +125

C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74HC02N

74HCT02N

74HC02D

74HCT02D

74HC02DB

74HCT02DB

74HC02PW

74HCT02PW

74HC02BQ

74HCT02BQ

40 C

to +125

C

DHVQFN14

40 C

to +125

C

TSSOP14

40 C

to +125

C

SSOP14

40 C

to +125

C

SO14

plastic small outline package; 14 leads; body width

3.9 mm

plastic shrink small outline package; 14 leads; body

width 5.3 mm

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

SOT108-1

SOT337-1

SOT402-1

40 C

to +125

C

Name

DIP14

Description

plastic dual in-line package; 14 leads (300 mil)

Version

SOT27-1

Type number

plastic dual in-line compatible thermal enhanced very SOT762-1

thin quad flat package; no leads; 14 terminals;

body 2.5



0.85 mm

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Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	-
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	-
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP	-
Parts packaging code	TSSOP	QFN	SOIC	SOIC	DIP	SSOP1	SSOP1	TSSOP	-
package instruction	TSSOP, TSSOP14,.25	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, VQFN-14	SOP, SOP14,.25	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14	DIP, DIP14,.3	5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14	SSOP, SSOP14,.3	4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14	-
Contacts	14	14	14	14	14	14	14	14	-
Manufacturer packaging code	SOT402-1	SOT762-1	SOT108-1	SOT108-1	SOT27-1	SOT337-1	SOT337-1	SOT402-1	-
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli	-
series	HC/UH	-	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH
JESD-30 code	R-PDSO-G14	-	R-PDSO-G14	R-PDSO-G14	R-PDIP-T14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	-
JESD-609 code	e4	-	e4	e4	e4	e4	e4	e4	-
length	5 mm	-	8.65 mm	8.65 mm	19.025 mm	6.2 mm	6.2 mm	5 mm	-
Load capacitance (CL)	50 pF	-	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	-
Logic integrated circuit type	NOR GATE	-	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	-
MaximumI(ol)	0.004 A	-	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	-
Humidity sensitivity level	1	-	1	1	-	1	1	1	-
Number of functions	4	-	4	4	4	4	4	4	4
Number of entries	2	-	2	2	2	2	2	2	-
Number of terminals	14	-	14	14	14	14	14	14	14
Maximum operating temperature	125 °C	-	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 Cel
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 Cel
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TSSOP	-	SOP	SOP	DIP	SSOP	SSOP	TSSOP	-
Encapsulate equivalent code	TSSOP14,.25	-	SOP14,.25	SOP14,.25	DIP14,.3	SSOP14,.3	SSOP14,.3	TSSOP14,.25	-
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-
method of packing	TUBE	-	BULK PACK	TAPE AND REEL	BULK PACK	TUBE	TAPE AND REEL	TAPE AND REEL	-
Peak Reflow Temperature (Celsius)	260	-	260	260	260	260	260	260	-
power supply	2/6 V	-	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	-
Prop。Delay @ Nom-Su	27 ns	-	27 ns	27 ns	27 ns	27 ns	27 ns	27 ns	-
propagation delay (tpd)	27 ns	-	27 ns	27 ns	27 ns	27 ns	27 ns	27 ns	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Schmitt trigger	NO	-	NO	NO	NO	NO	NO	NO	-
Maximum seat height	1.1 mm	-	1.75 mm	1.75 mm	4.2 mm	2 mm	2 mm	1.1 mm	-
Maximum supply voltage (Vsup)	6 V	-	6 V	6 V	6 V	6 V	6 V	6 V	-
Minimum supply voltage (Vsup)	2 V	-	2 V	2 V	2 V	2 V	2 V	2 V	-
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V	5 V	5 V	5 V	5 V	-
surface mount	YES	-	YES	YES	NO	YES	YES	YES	Yes
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	-
Terminal form	GULL WING	-	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	-	1.27 mm	1.27 mm	2.54 mm	0.65 mm	0.65 mm	0.65 mm	-
Terminal location	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	-	30	30	30	30	30	30	-
width	4.4 mm	-	3.9 mm	3.9 mm	7.62 mm	5.3 mm	5.3 mm	4.4 mm	-
Base Number Matches	1	1	1	1	1	1	1	1	-

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