GD74HC75 datasheet, PDF - EEWORLD Datasheet

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GD74HC75: DescriptionD Latch, 2-Func, 2-Bit, CMOS, PDIP16,; Categorylogic logic; File Size261KB，6 Pages; ManufacturerLG Semicon Co., Ltd.

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GD74HC75 Overview

D Latch, 2-Func, 2-Bit, CMOS, PDIP16,

GD74HC75 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LG Semicon Co., Ltd.
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	D LATCH
MaximumI(ol)	0.004 A
Number of digits	2
Number of functions	2
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Prop。Delay @ Nom-Sup	30 ns
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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Description	D Latch, 2-Func, 2-Bit, CMOS, PDIP16,	D Latch, 2-Func, 2-Bit, CMOS, PDSO16,	D Latch, 2-Func, 2-Bit, CMOS, CDIP16,	D Latch, 2-Func, 2-Bit, CMOS, CDIP16,	D Latch, 2-Func, 2-Bit, CMOS, PDSO16,	D Latch, 2-Func, 2-Bit, CMOS, CDIP16,	D Latch, 2-Func, 2-Bit, CMOS, PDIP16,	D Latch, 2-Func, 2-Bit, CMOS, CDIP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T16	R-PDSO-G16	R-XDIP-T16	R-XDIP-T16	R-PDSO-G16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of digits	2	2	2	2	2	2	2	2
Number of functions	2	2	2	2	2	2	2	2
Number of terminals	16	16	16	16	16	16	16	16
Maximum operating temperature	85 °C	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	SOP	DIP	DIP	SOP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	SOP16,.25	DIP16,.3	DIP16,.3	SOP16,.25	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
power supply	2/6 V	5 V	5 V	2/6 V	2/6 V	5 V	5 V	2/6 V
Prop。Delay @ Nom-Sup	30 ns	32 ns	36 ns	30 ns	30 ns	32 ns	32 ns	34 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	YES	NO	NO	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
package instruction	DIP, DIP16,.3	-	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3

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