Z8932320VEG datasheet, PDF - EEWORLD Datasheet

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Z8932320VEG: DescriptionIC 16-BIT, 20 MHz, OTHER DSP, PQCC68, PLASTIC, LCC-68, Digital Signal Processor; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，61 Pages; ManufacturerZilog, Inc.; Websitehttps://www.zilog.com/; Environmental Compliance

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Z8932320VEG Overview

IC 16-BIT, 20 MHz, OTHER DSP, PQCC68, PLASTIC, LCC-68, Digital Signal Processor

Z8932320VEG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	LCC
package instruction	QCCJ,
Contacts	68
Reach Compliance Code	unknow
Address bus width	3
barrel shifter	YES
boundary scan	NO
maximum clock frequency	20 MHz
External data bus width	16
Format	FIXED POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PQCC-J68
JESD-609 code	e3
length	24.2316 mm
low power mode	YES
Number of terminals	68
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	24.2316 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

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Packaging

Product Specification

PS007226-0408

www.zilog.com

Packaging

Product Specification

iii

Table of Contents

Ordering Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package Designators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Environmental Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package Designators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Environmental Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tape, Reel, Tray, and Tube Counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Mark Permanency (For Ink Mark). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Plastic Dual In-Line Packages (PDIPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Shrink Dual In-Line Packages (SDIPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Plastic Leaded Chip Carriers (PLCCs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Low-Profile Quad Flat Packages (LQFPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Quad Flat No Lead (QFNs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Plastic Quad Flat Packages (QFPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Small Outline Integrated Circuits (SOICs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Shrink Small Outline Packages (SSOPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Low-Profile Ball Grid Arrays (LBGAs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Transceiver Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Lead Type, Carrier Tape Size, and Reel Quantity . . . . . . . . . . . . . . . . . . . 41

Preferred Package Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Change Log . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

PS007226-0408

Table of Contents

Packaging

Product Specification

List of Figures

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Current Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Motor Control Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . 2

IR Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

ARM Part Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Previous Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

8-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . . 8

14-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . 9

18-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . 9

20-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 10

22-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 10

28-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 11

40-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 12

48-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 12

42-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 13

52-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 14

64-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 15

28-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 16

44-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 17

68-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 18

84-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 18

32-Lead Plastic Low-Profile Quad Flat

Package (7 x 7 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

44-Lead Plastic Low-Profile Quad Flat

Package (10 x 10 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

64-Lead Plastic Low-Profile Quad Flat

Package (10 x 10 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

64-Lead Plastic Low-Profile Quad Flat

Package (14 x 14 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

100-Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . . . . . 23

144-Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . . . . . 24

8 Quad Flat No Lead (5 x 6 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . . 25

20 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 26

28 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 26

32 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 27

PS007226-0408

List of Figures

Packaging

Product Specification

Figure 31.

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44 Quad Flat No Lead (7 x 7 mm) . . . . . . . . . . . . . . . . . . . . . . . . . .

80-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . . .

100-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . .

144-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . .

8-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . .

18-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . .

20-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . .

28-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . .

20-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . .

28-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . .

48-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . .

144-Lead Low-Profile Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . . .

196-Lead Low-Profile Ball Grid

Array (15 x 15 mm, 1.0 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . .

256-Lead Low-Profile Ball Grid

Array (17 x 17 mm, 1.0 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1203 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1223 Mechanical Specification . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1403 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1423 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1810 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Alternate ZHX1810 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1820 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Alternate ZHX1820 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18-/20-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

28-Lead Migration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

40-/44-/48-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

100-/144-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PS007226-0408

List of Figures

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